Page 1
®
MAIN PRODUCT CHARACTERISTICS
STPS5L60
POWER SCHOTTKY RECTIFIER
I
F(AV)
V
RRM
5A
60 V
Tj (max) 150°C
(max) 0.53 V
V
F
FEATURES AND BENEFITS
NEGLIGIBLE SWITCHING LOSSES
■
LOW FORWARD VOLTAGE DROP FOR
■
HIGHER EFFICIENCY
LOW THERMAL RESISTANCE
■
AVALANCHE CAPABILITY SPECIFIED
■
DESCRIPTION
Axial Power Schottky rectifier suited for Switch
Mode Power Supplies and high frequency
inverters.
PackagedinDO-201AD,thisdeviceis intended for
usein low voltage output forsmall battery chargers
& consumer SMPS such as DVD and
Set-Top-Box.
ABSOLUTE RATINGS (limiting values)
DO-201AD
STPS5L60
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
Repetitive peak reverse voltage
RMS forward current
Average forward current Tl = 100°C δ = 0.5
Surge non repetitive forward current Half wave, single phase
60 V
15 A
5A
150 A
tp=10ms
P
*:
ARM
T
Tj
dV/dt
dPtot
Repetitive peak avalanche power tp = 1µs Tj = 25°C
stg
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage (rated V
<
dTj Rth j a
July 2003 - Ed: 2A
, Tj = 25°C)
R
thermal runaway condition for a diode on its own heatsink
−1()
4000 W
- 65 to + 150 °C
150 °C
10000 V/µs
1/4
Page 2
STPS5L60
THERMAL PARAMETERS
Symbol Parameter Value Unit
R
th(j-a)
R
th(j-l)
Junction to ambient
Junction to leads Lead length = 10 mm
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
*
I
R
Reverse leakage current Tj = 25°C VR=V
RRM
Tj = 100°C
Tj = 125°C
V
*
F
Forward voltage drop Tj = 25°C IF=5A
Tj = 100°C
Tj = 125°C
Pulse test : * tp = 380 µs, δ <2%
To evaluate the maximum conduction losses use the following equation:
P=0.39xI
F(AV)
+ 0.028 x I
F2(RMS)
75 °C/W
15 °C/W
0.22 mA
10 25
40 100
0.47 0.52 V
0.43 0.49
0.42 0.48
Fig.1: Conduction lossesversus average current.
PF(av)(W)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
δ = 0.05
2/4
δ = 0.1
δ = 0.2
IF(av)(A)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5).
IF(av)(A)
6
5
4
3
2
δ
T
=tp/T
1
0
0 25 50 75 100 125 150
Rth(j-a)=Rth(j-l)
Rth(j-a)=75°C/W
tp
Tamb(°C)
Page 3
STPS5L60
Fig. 3: Normalized avalanche power derating
versus pulse duration.
P(t)
ARM p
P (1µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
16
14
12
10
8
6
4
IM
2
0
1.E-03 1.E-02 1.E-01 1.E+00
δ=0.5
t
t(s)
Ta=25°C
Ta=50°C
Ta=100°C
Fig. 4: Normalized avalanche power derating
versus junction temperature.
P(t)
ARM p
P (25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
T (°C)
0
j
0 25 50 75 100 125 150
Fig. 6: Relative variation of thermal impedance
junction to ambient versus pulse duration.
Zth(j-a)/Rth(j-a)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
δ
=tp/T
T
tp
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
1.E+03
1.E+02
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0 5 10 15 20 25 30 35 40 45 50 55 60
Tj=150°C
Tj=125°C
Tj=100°C
Tj=75°C
Tj=50°C
Tj=25°C
VR(V)
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
1000
100
VR(V)
10
1 10 100
F=1MHz
Vosc=30mV
Tj=25°C
3/4
Page 4
STPS5L60
Fig. 9-1: Forward voltage drop versus forward
current (low level).
IFM(A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
(Typical values)
(Maximum values)
VFM(V)
Tj=25°C
Fig. 10: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed board FR4, Cu = 35µm).
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
0
012345678910
S(cm²)
Fig. 9-2: Forward voltage drop versus forward
current (high level).
IFM(A)
100
Tj=125°C
Tj=125°C
(Maximum values)
(Maximum values)
Tj=125°C
Tj=125°C
(Typical values)
10
(Typical values)
Tj=25°C
(Maximum values)
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Fig. 11: Thermal resistances versus leads length.
Rth(°C/W)
80
70
60
50
40
30
20
10
0
5 10152025
Rth(j-a): Epoxy printed circuit board FR4 (Cu=35µm)
Rth(j-l)
Lleads(cm)
4/4
Page 5
PACKAGE MECHANICAL DATA
DO-201AD plastic
STPS5L60
BA
note 1
E
ØD ØD
DIMENSIONS
REF.
Min. Max. Min. Max.
A 9.50 0.374
B 25.40 1.000
∅ C 5.30 0.209
∅ D 1.30 0.051
E 1.25 0.049
note 2
B
note 1
E
ØC
NOTESMillimeters Inches
1 - The lead diameter ∅ D is not controlled over zone E
2 - The minimum axial length within which the device
may be placed with its leads bent at right angles is
0.59"(15 mm)
Ordering type Marking Package Weight Base qty Delivery mode
STPS5L60 STPS5L60 DO-201AD 1.12g 600 Ammopack
STPS5L60RL STPS5L60 DO-201AD 1.12g 1900 Tape and reel
■
WHITE BAND INDICATES CATHODE
■
EPOXY MEETS UL94,V0
Informationfurnished is believed to be accurateandreliable. However, STMicroelectronics assumes noresponsibilityfor the consequences of
useof such information nor forany infringement of patents orotherrights of third parties whichmay result from its use.No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written
approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States.
http://www.st.com
5/4
Loading...