Datasheet STPS5L25B-1, STPS5L25B Datasheet (SGS Thomson Microelectronics)

®

LOW DROP POWER SCHOTTKY RECTIFIER

MAIN PRODUCT CHARACTERISTIC S

I

F(AV)

V

RRM

Tj (max) 150° C

(max) 0.35 V

V

F

FEATURES AND BENEFITS

VERY LOW F O RW ARD VOLTAG E DROP FOR
LESS POWER DISSIPATION AND REDUCED
HEATSINK

OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS

HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE

AVALANCHE R ATE D

5 A

25 V

4

STPS5L25B

STPS5L25B/B-1

2

3

2

1

NC

DPAK

3

4(TAB)

4

IPAK

STPS5L25B-1

3

2

1

NC

DESCR IPT ION

Single Schottky rectifier suited t o Switched Mode
Power Supplies and high frequency DC to DC con­verters.

This device is especially intended for use as a Rec­tifier at the secondary of 3.3V SMPS units.

ABSOLUTE RATINGS

(limiting values)

Symbol Parameter Value Unit

V

RRM

I

F(RMS)

I

F(AV)

I

FSM

I

RRM

I

RSM

T

stg

Repetitive peak reverse voltage 25 V
RMS forward current 7 A
Average forward current Tc = 145°C

δ

= 0.5 5 A
Surge non repetitive forward current tp = 10 ms Sinus oidal 75 A
Repetitive peak reverse current tp=2 µs square F=1k Hz 1 A
Non repetitive peak reverse c urrent tp = 100 µs square 2 A
Storage temperature range - 65 to + 150

Tj Maximum operating junction temperature * 150

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

* :

dPtot

dTj

<

1

Rth(j−a

thermal runaway condition for a diode on its own heatsink

)

°

C

°

C

August 1999 - Ed: 3A

1/5

STPS5L25B/B-1

THERMAL RESISTANCES

Symbol Parameter Value Unit

R

th(j-c)

Junction to case 2.5

STATIC ELECTRICAL CHARACTER ISTICS

Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit

* Reverse leakage current Tj = 25°CV

I

R

= V

R

RRM

350

Tj = 125°C 55 115 mA

* Forward voltage drop Tj = 25°CI

V

F

Tj = 125°CI
Tj = 25°CI
Tj = 125°CI

Pulse test : * tp = 380 µs, δ < 2%

= 5 A 0.47 V

F

= 5 A 0.31 0.35

F

= 10 A 0.59

F

= 10 A 0.41 0.50

F

To evaluate the maximum conduction losses use the following equation :
P = 0.2 x I

F(AV)

+ 0.030 I

F2(RMS)

°

C/W

µ

A

Fig. 1:

Average forward power dissipation versus

average forward current.

PF(av)(W)

2.5

2.0

1.5

1.0

0.5

0.0
0123456

δ = 0.05

δ = 0.1

δ = 0.2

IF(av) (A)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Fig. 2:

Average forward current versus ambient

temperature (δ=0.5).

IF(av)(A)

6
5
4

δ

=tp/T

Rth(j-a)=70°C/W

T

tp

3
2
1
0

0 25 50 75 100 125 150

Rth(j-a)=Rth(j-c)

Tamb(°C)

2/5

STPS5L25B/B-1

Fig. 3:

Non repetitive surge peak forward current

versus overload duration (maximum values).

IM(A)

100

80

60

Tc=25°C

Tc=75°C

40

I

M

20

0

1E-3 1E-2 1E-1 1E+0

Fig. 5:

t

δ

=0.5

t(s)

Reverse leakage current versus reverse

Tc=100°C

voltage applied (typical values).

IR(mA)

3E+2
1E+2

1E+1

Tj=150°C

Tj=125°C

Fig. 4:

Relative variation of thermal impedance

junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

1.0

0.8

0.6

0.4

0.2

0.0

1.0E-4 1.0E-3 1.0E-2 1.0E-1 1.0E+0

Fig. 6:

δ = 0.5

δ = 0.1

δ = 0.2

Single pulse

tp(s)

δ

T

=tp/T

Junction capacitance versus reverse

tp

voltage applied (typical values).

C(pF)

2000

1000

F=1MHz
Tj=25°C

1E+0

1E-1

Tj=25°C

1E-2

VR(V)

1E-3

0 5 10 15 20 25

Fig. 7:

Forward voltage drop versus forward cur-

rent (maximum values).

IFM(A)

100.0

Typical values

Tj=150°C

10.0

1.0

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Tj=125°C

Tj=25°C

VFM(V)

500

200

VR(V)

100

12 5102030

Fig. 8:

Thermal resistance junction to ambient ver­sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm).

Rth(j-a) (°C/W)

100

80

60

40

20

0

0 2 4 6 8 101214161820

S(Cu) (cm²)

3/5

STPS5L25B/B-1

PACKAGE ME CHANICAL D AT A

DPAK

DIMENSIONS

REF.

Millimeters Inches

Min. Max Min. Max.

A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244

E 6.40 6.60 0.251 0.259

G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

FOOT PRINT DIMENSIONS

6.7

2.32.3

(in millimeters)

6.7

3

3

1.61.6

4/5

PACKAGE ME CHANICAL D AT A

IPAK

E

B2

H

L1

L

B6

G

L2

B3
B

V1

B5

A1

C2

STPS5L25B/B-1

DIMENSIONS

REF.

A 2.2 2.4 0.086 0.094

A

A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051

B 0.64 0.9 0.025 0.035
B2 5.2 5.4 0.204 0.212
B3 0.85 0.033

D

B5 0.3 0.035
B6 0.95 0.037

C 0.45 0.6 0.017 0.023

C2 0.48 0.6 0.019 0.023

D 6 6.2 0.236 0.244

E 6.4 6.6 0.252 0.260

C
A3

G 4.4 4.6 0.173 0.181

H 15.9 16.3 0.626 0.641

L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2 0.8 1 0.031 0.039
V1 10° 10°

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

Ordering type Marking Package Weight Base qty Delivery mode

STPS5L25B STPS5L25B DPAK 0.30g 75 Tube

STPS15LB-TR STPS5L25B DPAK 0.30g 2500 Tape & reel

STPS5L25B-1 STPS5L25B IPAK 0.35g 75 Tube

Epoxy meets UL94,V0

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