Datasheet STPS41H100C Datasheet (ST)

STPS41H100C

2

Low drop power Schottky rectifier

Datasheet − production data

Features

■ Negligible switching losses

■ Low leakage current

■ Good trade off between leakage current and

forward voltage drop

■ Low thermal resistance

■ Avalanche capability specified

Description

Dual center tab Schottky rectifier suited for switch
mode power supply and high frequency DC to DC
converters.

2

Packaged in D
device is intended for use in high frequency
inverters.

PAK , I2PAK and TO-220AB, this

A1

K

A2

A

K

A1

I2PAK

STPS41H100CR

K

A1

2

D

PAK

STPS41H100CG

j

Table 1. Device summary

A2

K

A1

TO-220AB

STPS41H100CT

A2

Symbol Value

I

F(AV)

V

RRM

(max) 175 °C

T

j

(max) 0.67 V

V

F

2 x 20 A

100 V

April 2012 Doc ID 8613 Rev 5 1/9

This is information on a product in full production.

www.st.com

9

Characteristics STPS41H100C

1 Characteristics

Table 2. Absolute ratings (limiting values, per diode)

Symbol Parameter Value Unit

V

I

F(RMS)

I

F(AV)

I

I

P

T

Repetitive peak reverse voltage 100 V

RRM

Forward rms current 30 A

T

= 50 °C

Average forward current

Surge non repetitive forward current tp = 10 ms sinusoidal 220 A

FSM

Repetitive peak reverse current tp = 2 µs square F= 1 kHz 1 A

RRM

Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 18100 W

ARM

Storage temperature range -65 to + 175 °C

stg

Maximum operating junction temperature

T

j

c

δ = 0.5

(1)

Per diode
Per device

20

40

175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

<

Rth(j-a)

1

dPtot

1. condition to avoid thermal runaway for a diode on its own heatsink

dTj

Table 3. Thermal resistance

Symbol Parameter Value Unit

Per diode 1.5

R

R

Junction to case

th(j-c)

Coupling 0.1

th(c)

°C/WTo ta l 0 .8

When the diodes 1 and 2 are used simultaneously:

A

ΔTj(diode 1) = P(diode1) x R

Table 4. Static electrical characteristics (per diode)

(Per diode) + P(diode 2) x R

th(j-c)

Symbol Parameter Test conditions Min. Typ. Max. Unit

= 25 °C

T

Reverse leakage

(1)

I

R

current

(1)

V

1. Pulse test: tp = 380 µs, δ < 2%

Forward voltage drop

F

j

T

= 125 °C 3 10 mA

j

= 25 °C IF = 20 A 0.80

T

j

T

= 125 °C IF = 20 A 0.62 0.67

j

= 25 °C IF = 40 A 0.90

T

j

= 125 °C IF = 40 A 0.70 0.76

T

j

V

R

To evaluate the conduction losses use the following equation:
P = 0.58 x I

2/9 Doc ID 8613 Rev 5

F(AV)

+ 0.0045 I

F2(RMS)

= V

th(c)

10 μA

RRM

V

STPS41H100C Characteristics

Figure 1. Conduction losses versus average

current

PF(av)(W)

16

14

12

10

8

6

4

2

0

0 5 10 15 20 25

δ = 0.05

δ = 0.2

δ = 0.1

IF(av)(A)

δ = 0.5

δ

=tp/T

δ = 1

T

tp

Figure 3. Normalized avalanche power

derating versus pulse duration

P(t)

ARM p

P (1µs)

ARM

1

0.1

0.01

t (µs)

0.001

0.10.01 1

p

10 100 1000

Figure 5. Non repetitive surge peak forward

current versus overload duration
(maximum values)

IM(A)

300

250

200

150

100

IM

50

0

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

t

t(s)

Tc=25°C

Tc=75°C

Tc=125°C

Figure 2. Average forward current versus

ambient temperature (δ = 0.5)

IF(av)(A)

22

20
18

16
14

12
10

8
6

4
2

=tp/T

δ

0

0 25 50 75 100 125 150 175

Rth(j-a)=50°C/W

T

tp

Rth(j-a)=Rth(j-c)

Tamb(°C)

Figure 4. Normalized avalanche power

derating versus junction
temperature

P)

ARM (Tj

P (25°C)

ARM

1.2

1

0.8

0.6

0.4

0.2

T (°C)

0

j

25 50 75 100 125 150

Figure 6. Relative variation of thermal

impedance junction to case versus
pulse duration

Zth(j-c)/Rth(j-c)

1.0

0.9

0.8

0.7

δ = 0.5

0.6

0.5

0.4

δ = 0.2

δ = 0.1

0.3

0.2

Single pulse

0.1

0.0

1.E-03 1.E-02 1.E-01 1.E+00

tp(s)

δ

=tp/T

T

tp

Doc ID 8613 Rev 5 3/9

Characteristics STPS41H100C

Figure 7. Reverse leakage current versus

reverse voltage applied
(typical values)

IR(mA)

1.E+02

1.E+01

1.E+00

1.E-01

1.E-02

1.E-03

1.E-04
0 102030405060708090100

Tj=150°C

Tj=125°C

Tj=100°C

Tj=75°C

Tj=50°C

Tj=25°C

VR(V)

Figure 9. Forward voltage drop versus

forward current

IFM(A)

100

Tj=125°C

Tj=125°C

(Maximum values)

(Maximum values)

Tj=125°C

10

1

0.0 0.2 0.4 0.6 0.8 1.0 1.2

Tj=125°C

(Typical values)

(Typical values)

VFM(V)

Tj=25°C

(Maximum values)

Figure 8. Junction capacitance versus

reverse voltage applied
(typical values)

C(nF)

10.0

1.0

F=1MHz

Vosc=30mV

Tj=25°C

VR(V)

0.1
1 10 100

Figure 10. Thermal resistance junction to

ambient versus copper surface
under tab

Rth(j-a)(°C/W)

80

70

60

50

40

30

20

10

(epoxy printed board FR4, Cu = 35 µm) - STPS41H100CG only

S(cm²)

0

0 5 10 15 20 25 30 35 40

4/9 Doc ID 8613 Rev 5

STPS41H100C Package information

e

2 Package information

● Epoxy meets UL94, V0

● Recommended torque values for TO-220AB: 0.4 to 0.6 N·m

In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com
ECOPACK

Table 5. I

®

packages, depending on their level of environmental compliance. ECOPACK®

®

is an ST trademark.

2

PAK dimensions

.

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

L2

A

E

c2

A 4.40 4.60 0.173 0.181

A1 2.40 2.72 0.094 0.107

b 0.61 0.88 0.024 0.035

D

b1 1.14 1.70 0.044 0.067

c 0.49 0.70 0.019 0.028

L1

L

b1

A1

c2 1.23 1.32 0.048 0.052

D 8.95 9.35 0.352 0.368

e 2.40 2.70 0.094 0.106

e1 4.95 5.15 0.195 0.203

b

e

1

c

E 10 10.40 0.394 0.409

L 13 14 0.512 0.551

L1 3.50 3.93 0.138 0.155

L2 1.27 1.40 0.050 0.055

Devices in I2PAK with nickel-plated back frame must NOT be mounted by frame soldering
like SMDs. Such devices are intended to be through-hole mounted ONLY and in no
circumstances shall ST be held liable for any lack of performance or damage arising out of
soldering of nickel-plated back frames.

Doc ID 8613 Rev 5 5/9

Package information STPS41H100C

Table 6. TO-220AB dimensions

Dimensions

L2

F2

F1

F

G1

H2

Dia

G

L5

L9

L6

L4

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

C

C 1.23 1.32 0.048 0.051

D 2.40 2.72 0.094 0.107

E 0.49 0.70 0.019 0.027

L7

F 0.61 0.88 0.024 0.034

F1 1.14 1.70 0.044 0.066

F2 1.14 1.70 0.044 0.066

G 4.95 5.15 0.194 0.202

D

G1 2.40 2.70 0.094 0.106

H2 10 10.40 0.393 0.409

L2 16.4 typ. 0.645 typ.

M

E

L4 13 14 0.511 0.551

L5 2.65 2.95 0.104 0.116

L6 15.25 15.75 0.600 0.620

L7 6.20 6.60 0.244 0.259

L9 3.50 3.93 0.137 0.154

M 2.6 typ. 0.102 typ.

6/9 Doc ID 8613 Rev 5

Diam. 3.75 3.85 0.147 0.151

STPS41H100C Package information

m

D

Table 7. D

L2

L

L3

2

PAK dimensions

E

A1

B2
B

G

* FLAT ZONE NO LESS THAN 2m

Dimensions

Ref.

Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

A

C2

A1 2.49 2.69 0.098 0.106

A2 0.03 0.23 0.001 0.009

B 0.70 0.93 0.027 0.037

B2 1.14 1.70 0.045 0.067

C 0.45 0.60 0.017 0.024

C2 1.23 1.36 0.048 0.054

C

R

D 8.95 9.35 0.352 0.368

E 10.00 10.40 0.393 0.409

A2

G 4.88 5.28 0.192 0.208

L 15.00 15.85 0.590 0.624

M

*

V2

L2 1.27 1.40 0.050 0.055

L3 1.40 1.75 0.055 0.069

M 2.40 3.20 0.094 0.126

Figure 11. Footprint (dimensions in mm)

16.90

10.30

8.90

R 0.40 typ. 0.016 typ.

V2 0° 8° 0° 8°

5.08

1.30

3.70

Doc ID 8613 Rev 5 7/9

Ordering information STPS41H100C

3 Ordering information

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS41H100CT STPS41H100CT TO-220AB 2.20 g 50 Tube

STPS41H100CG STPS41H100CG D2PAK 1.48 g 50 Tube

2

STPS41H100CG-TR STPS41H100CG D

STPS41H100CR STPS41H100CR I

PAK 1.48 g 1000 Tape and reel

2

PAK 1.49 g 50 Tube

4 Revision history

Table 9. Document revision history

Date Revision Changes

Jul-2003 3A Previous release.

15-Jul-2011 4 Updated Tab le 5 .

11-Apr-2012 5

Removed order codes STPS41H100CR-H and STPS41H100CT-H.
Replaced paragraph under Ta bl e 5.

8/9 Doc ID 8613 Rev 5

STPS41H100C

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2012 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

Doc ID 8613 Rev 5 9/9