Datasheet STPS1545CR Specification

Page 1
STPS1545C
Power Schottky rectifier
Features
very small conduction losses
negligible switching losses
extremely fast switching
Description
Dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters.
Packaged either in TO-220AB, D DPAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications.
2
PAK, I2PAK, or
A1
A2
A1
TO-220AB
STPS1545CT
K
A2
A1
2
D
PAK
STPS1545CG
K
A2
A2
K
A1
DPAK
STPS1545CB
A2
K
A1
I2PAK
STPS1545CR

Table 1. Device summary

I
F(AV)
V
RRM
T
(max) 175 °C
j
(max) 0.57 V
V
F
2 x 7.5 A
45 V
November 2010 Doc ID 3503 Rev 7 1/10
www.st.com
10
Page 2
Characteristics STPS1545C
d
-

1 Characteristics

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit
V
I
F(RMS)
I
F(AV)
I
I
I
P
T
Repetitive peak reverse voltage 45 V
RRM
Forward rms current 20 A
Average forward current δ = 0.5 Tc = 157 °C Per diode 7.5 A
Surge non repetitive forward current tp = 10 ms sinusoidal 150 A
FSM
t
= 2 µs square
Peak repetitive reverse current
RRM
Non repetitive peak reverse current tp = 100 µs square 2 A
RSM
Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2700 W
ARM
Storage temperature range -65 to + 175 °C
stg
T
Maximum operating junction temperature
j
p
F = 1 kHz
(1)
1A
175 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
Ptot
--------------
1. condition to avoid thermal runaway for a diode on its own heatsink
dTj
1
--------------------------
<
Rth j a–()

Table 3. Thermal resistances

Symbol Parameter Value Unit
R
R
th(j-c)
th(c)
Junction to case
Per diode To t al
Coupling 0.35
3.0
1.7
°C/W
When the diodes 1 and 2 are used simultaneously:
ΔT
(diode 1) = P(diode1) x R
j

Table 4. Static electrical characteristics (per diode)

(Per diode) + P(diode2) x R
th(j-c)
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
= 25 °C
(1)
I
V
1. Pulse test: tp = 380 µs, δ < 2%
Reverse leakage current
R
(1)
Forward voltage drop
F
j
= 125 °C - 5 15 mA
T
j
T
= 125°C IF = 7.5A - 0.5 0.57
j
= 25°C IF = 15 A --0.84
j
= 125 °C IF = 15 A - 0.65 0.72
T
j
To evaluate the conduction losses use the following equation: P = 0.42 x I
2/10 Doc ID 3503 Rev 7
F(AV)
+ 0.020 I
F2(RMS)
th(c)
- - 100 µA
=V
V
R
RRM
V T
Page 3
STPS1545C Characteristics
Figure 1. Average forward power dissipation
versus average forward current (per diode)
P (W)
F(AV)
6
5
4
3
2
1
0
012345678910
δ = 0.05
δ = 0.1
δ = 0.2
I (A)
F(AV)
δ = 0.5
δ = 1
δ
=tp/T
T
tp
Figure 3. Normalized avalanche power
derating versus pulse duration
P(tp)
ARM
P (1 µs)
ARM
1
0.1
0.01
t (µs)
0.001
0.10.01 1
p
10 100 1000
Figure 2. Average forward current versus
ambient temperature (
δ = 0.5, per
diode)
I (A)
F(AV)
9
R=R
R =15°C/W
th(j-a)
th(j-a) th(j-c)
8
7
R =40°C/W
δ
=tp/T
th(j-a)
T
tp
T (°C)
amb
6
5
4
3
2
1
0
0 25 50 75 100 125 150 175
Figure 4. Normalized avalanche power
derating versus junction temperature
P(Tj)
ARM
P (25 °C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
T (°C)
j
Figure 5. Non repetitive surge peak forward
current versus overload duration (maximum values, per diode)
I (A)
M
120
100
80
T =50°C
60
40
IM
20
0
1E-3 1E-2 1E-1 1E+0
δ=0.5
t
t(s)
C
T =100°C
C
T =150°C
C
Doc ID 3503 Rev 7 3/10
Figure 6. Relative variation of thermal
impedance junction to case versus pulse duration
Z/R
th(j-c) th(j-c)
1.0
0.8
0.6
δ = 0.5
0.4
δ
T
=tp/T
δ = 0.2
0.2
δ = 0.1
Single pulse
0.0 1E-4 1E-3 1E-2 1E-1 1E+0
t (s)
p
tp
Page 4
Characteristics STPS1545C
Figure 7. Reverse leakage current versus
reverse voltage applied (typical values, per diode)
I (µA)
R
5E+4
T =150°C
1E+4
1E+3
1E+2
1E+1
1E+0
1E-1
0 5 10 15 20 25 30 35 40 45
j
T =125°C
j
T =100°C
j
T =75°C
j
T =50°C
j
T =25°C
j
V (V)
R
Figure 9. Forward voltage drop versus
forward current (high values, per diode)
I (A)
FM
100.0
T=125°C
j
(typical values)
10.0
T=125°C
j
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
maximum values
V (V)
FM
T=25°C
j
maximum values
Figure 8. Junction capacitance versus
reverse voltage applied (typical values, per diode)
C(pF)
1000
500
200
V (V)
100
12 51020 50
R
F=1MHz
V =30mV
OSC RMS
T =25°C
j
Figure 10. Thermal resistance junction to
ambient versus copper surface under tab (D
R (°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
Epoxy printed circuit board copper thickness = 35 µm
2
PAK )
D²PAK
S (cm²)
cu

Figure 11. Thermal resistance junction to ambient versus copper surface under tab (DPAK)

R (°C/W)
th(j-a)
100
90
80
70
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40
4/10 Doc ID 3503 Rev 7
Epoxy printed circuit board copper thickness = 35 µm
DPAK
S (cm²)
cu
Page 5
STPS1545C Package information

2 Package information

Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Figure 12. TO-220AB dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
L2
F2
F1
F
G1
H2
Dia
A
C
L5
L6
C
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
L7
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
L4
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
M
E
G
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
1.23 1.32 0.048 0.051
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Dia. 3.75 3.85 0.147 0.151
Doc ID 3503 Rev 7 5/10
Page 6
Package information STPS1545C
Table 5. D
L2
L
L3
2
PAK dimensions
E
A1
B2
B
G
* FLAT ZONE NO LESSTHAN 2mm
Dimensions
Ref.
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A
A1 2.49 2.69 0.098 0.106
C2
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
D
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
C
R
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
A2
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
M
*
V2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2

Figure 13. Footprint (dimensions in millimeters)

16.90
10.30
8.90
3.70
5.08
1.30
6/10 Doc ID 3503 Rev 7
Page 7
STPS1545C Package information
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory.

Figure 14. I2PAK dimensions

Dimensions
L2
Ref
A
E
c2
A 4.40 4.60 0.173 0.181 A 4.40
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1 2.49 2.69 0.098 0.106 A1 2.49
b 0.70 0.93 0.028 0.037 b 0.70
D
b1 1.14 1.17 0.044 0.046 b1 1.14
b2 1.14 1.17 0.044 0.046 b2 1.14
L1
L
b1
A1
c 0.45 0.60 0.018 0.024 c 0.45
c2 1.23 1.36 0.048 0.054 c2 1.23
D 8.95 9.35 0.352 0.368 D 8.95
b
e
e1
c
e 2.40 2.70 0.094 0.106 e 2.40
E 10.0 10.4 0.394 0.409 E 10.0
L 13.1 13.6 0.516 0.535 L 13.1
L1 3.48 3.78 0.137 0.149 L1 3.48
L2 1.27 1.40 0.050 0.055 L2 1.27
Doc ID 3503 Rev 7 7/10
Page 8
Package information STPS1545C

Table 6. DPAK dimensions

Dimensions
E
B2
L2
H
L4
B
G
0.60 MIN.
A1
A2
V2
A
C2
D
R
R
C

Figure 15. Footprint (dimensions in mm)

Ref.
Millimeters Inches
Min. Max. Min. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 typ. 0.031 typ.
L4 0.60 1.00 0.023 0.039
V2
6.7 3 3
6.7
1.6
2.3
2.3
1.6
8/10 Doc ID 3503 Rev 7
Page 9
STPS1545C Ordering information

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty Delivery mode
STPS1545CT STPS1545CT TO-220AB 2.23 g 50 Tube
STPS1545CG STPS1545CG D2PAK 1.48 g 50 Tube
2
STPS1545CG-TR STPS1545CG D
STPS1545CR STPS1545CR I
STPS1545CB-TR STPS1545CB DPAK 0.3 g 2500 Tape and reel
PAK 1.48 g 1000 Tape and reel
2
PAK 1.49 g 50 Tube
For the latest information on available order codes see the product pages on www.st.com.

4 Revision history

Table 8. Document revision history

Date Revision Changes
Jul-2003 5F Last release.
21-Mar-2007 6 Removed ISOWATT and TO-220FPAB packages.
03-Nov-2010 7 Added DPAK package.
Doc ID 3503 Rev 7 9/10
Page 10
STPS1545C
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
10/10 Doc ID 3503 Rev 7
Page 11
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
STMicroelectronics: STPS1545CG-TR STPS1545CT STPS1545CR STPS1545CB-TR
Loading...