current versus overload duration
(maximum values, per diode)
(TO-220AB, I
2
PAK and D2PAK)
Figure 2.Average forward current versus
ambient temperature
(
δ = 0.5, per diode)
I(A)
F(AV)
6
5
4
3
2
1
0
0255075100125150
δ
=tp/T
T
tp
R=R
th(j-a) th(j-c)
T(°C)
amb
TO-220FPAB
22
TO-220AB / D PAK / I
R =15°C/W
th(j-a)
PAK
Figure 4.Normalized avalanche power
derating versus junction
temperature
P(t)
ARM p
P(25°C)
ARM
1.2
1
0.8
0.6
0.4
0.2
0
255075100125150
T (°C)
j
Figure 6.Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
( TO-220FPAB)
I (A)
M
100
90
80
70
60
50
40
30
IM
20
10
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
T =125°C
T =25°C
C
T =75°C
C
C
I (A)
M
80
70
60
50
40
30
20
IM
10
0
1E-31E-21E-11E+0
δ=0.5
t
t(s)
T =25°C
C
T =75°C
C
T =125°C
C
3/10
Page 4
CharacteristicsSTPS10L45C
Figure 7.Relative variation of thermal
impedance junction to case versus
pulse duration
(TO-220AB, I
Z/R
th(j-c) th(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
Single pulse
0.0
1E-31E-21E-11E+0
2
PAK and D2PAK)
t (s)
p
δ
T
=tp/T
Figure 9.Reverse leakage current versus
reverse voltage applied (typical
values, per diode)
I (mA)
R
1E+2
1E+1
1E+0
1E-1
1E-2
1E-3
051015202530354045
T =150°C
j
T =125°C
j
T =100°C
j
T =25°C
j
V (V)
R
Figure 11. Forward voltage drop versus
forward current (maximum values,
per diode)
I (A)
FM
100.0
T =150°C
j
(typical values)
10.0
T =125°C
1.0
0.1
0.00.20.40.60.81.01.21.41.61.8
j
V (V)
FM
T =25°C
j
Figure 8.Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220FPAB)
Z/R
th(j-c) th(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
t (s)
tp
Single pulse
0.0
1E-31E-21E-11E+01E+1
p
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values, per diode)
C(pF)
1000
100
V (V)
10
1251020 50
R
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, copper thickness:
35 µm) ( D
R(°C/W)
th(j-a)
80
70
60
50
40
30
20
10
0
0481216202428323640
2
PAK)
S(Cu)(cm²)
δ
=tp/T
T
F=1MHz
V =30mV
OSCRMS
T =25°C
j
tp
4/10
Page 5
STPS10L45CPackage Information
2 Package Information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque value: 0.55 Nm
●Maximum torque value: 0.70 Nm
Table 4.TO-220AB dimensions
Dimensions
L2
F2
F1
F
G1
H2
Dia
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.40 4.60 0.173 0.181
A
C
L5
L6
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
L7
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
L9
L4
D
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
M
E
G
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. 3.75 3.85 0.147 0.151
5/10
Page 6
Package InformationSTPS10L45C
Table 5.I2PAK dimensions
Dimensions
L2
Ref.
MillimetersInches
Min.Max.Min.Max.
A
E
c2
A4.404.600.1730.181
A12.402.720.0940.107
b0.610.880.0240.035
b11.141.700.0440.067
D
c0.490.700.0190.028
c21.231.320.0480.052
L1
L
b1
A1
D8.959.350.3520.368
e2.402.700.0940.106
e14.955.150.1950.203
E1010.400.3940.409
b
e
e1
c
L13140.5120.551
L13.503.930.1380.155
L21.271.400.0500.055
6/10
Page 7
STPS10L45CPackage Information
Table 6.TO-220FPAB dimensions
Dimensions
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.4 4.6 0.173 0.181
A
H
B
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
Dia
L6
L2
L3
L5
F1
L4
F2
D
L7
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
G1
F
E
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
G
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
7/10
Page 8
Package InformationSTPS10L45C
m
D
Table 7.D
L2
L
L3
2
PAK dimensions
E
A1
B2
B
G
* FLAT ZONE NO LESS THAN 2m
Dimensions
Ref
MillimetersInches
Min.Max.Min.Max.
A 4.40 4.60 0.173 0.181
A
C2
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C
R
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
A2
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
M
*
V2
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
Figure 13. Footprint (dimensions in millimeters)
16.90
10.30
8.90
3.70
5.08
1.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
8/10
Page 9
STPS10L45COrdering information
3 Ordering information
Ordering typeMarkingPackageWeight Base qty Delivery mode
STPS10L45CT STPS10L45CT TO-220AB 2.23 g 50 Tube
STPS10L45CFP STPS10L45CFP TO-200FPAB 2 g 50 Tube
STPS10L45CG STPS10L45CG D
STPS10L45CG-TR STPS10L45CG D
STPS10L45CRSTPS10L45CRI
2
PAK 1.48 g 50 Tube
2
PAK 1.48 g 1000 Tape and reel
2
PAK1.49 g50Tube
4 Revision history
DateRevisionDescription of Changes
Jul-20033BLast release.
22-Mar-20074
Removed ISOWATT package.
Added I
2
PAK package.
9/10
Page 10
STPS10L45C
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