Page 1
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTIC S
STPS10L25D/G
I
F(AV)
V
RRM
10 A
25 V
Tj (max) 150 °C
(max) 0.35 V
V
F
FEATURES AND BENEFITS
VERY LOW FORWARD VOLTAGE DR OP FOR
LESS POWER DISSIPATION
OPTIMIZED CONDUCTION / REVERSE
LOSSES TRADE-OFF WHICH MEANS THE
HIGHEST EFFICIENCY IN THE APPLICATIONS
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC converters.
This device is especially intended for use as a
rectifier at the secondary of 3.3V SMPS units.
ABSOLUTE RATINGS
(limiting values)
TO-220AC
STPS10L25D
K
A
A
K
NC
D2PAK
STPS10L25G
Symbol Parameter Value Unit
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
T
stg
Repetitive peak reverse voltage 25 V
RMS forward current 30 A
Average forward current Tc = 140°C δ = 0.5 10 A
Surge non repetitive forward current tp = 10 ms Sinus oidal 200 A
Repetitive peak reverse current tp=2 µs square F=1kHz 1 A
Non repetitive peak reverse c urrent tp = 100 µs square 3 A
Storage temperature range - 65 to + 150
Tj Maximum operating junction temperature * 150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
dPtot
* :
June 1999 - Ed : 3B
dTj
<
1
Rth(j−a
thermal runaway condition for a diode on its own heatsink
)
°
C
1/5
Page 2
STPS10L25D/G
THERMAL RE SISTA NC E
Symbol Parameter Value Unit
R
th (j-c)
Junction to case 1.5
°
STATIC ELECTRICAL CHARACTE RISTICS
Symbol Tests Conditions Tests Conditions Min. Typ. Max. Unit
* Reverse leakage current Tj = 25°CV
I
R
= V
R
RRM
800
Tj = 125°C 135 260 mA
* Forward voltage drop Tj = 25°CI
V
F
Tj = 125°CI
Tj = 25°CI
Tj = 125°CI
Pulse test : * tp = 380 µs, δ < 2%
= 10 A 0.46 V
F
= 10 A 0.30 0.35
F
= 20 A 0.55
F
= 20 A 0.41 0.48
F
To evaluate the maximum conduction losses use the following equation :
P = 0.22 x I
F(AV)
+ 0.013 I
F2(RMS)
C/W
µ
A
Fig.1 :
Average forward power dissipation versus
average forward current.
PF(av)(W)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
01234567891011
δ = 0.05
2/5
δ = 0.1
IF(av) (A)
δ = 0.2
δ = 0.5
δ
δ = 1
T
=tp/T
Fig.2 :
Average forward current versus ambient
temperature ( δ = 0.5).
IF(av)(A)
12
10
8
6
4
2
tp
0
0 25 50 75 100 125 150
δ
=tp/T
T
tp
Rth(j-a)=Rth(j-c)
Rth(j-a)=50°C/W
Tamb(°C)
Page 3
STPS10L25D/G
Fig.3 :
Non repetitive surge peak forward current
versus overload duration (maximum values).
IM(A)
200
180
160
140
120
100
80
60
IM
40
20
0
1E-3 1E-2 1E-1 1E+0
Fig.5 :
δ=0.5
t
t(s)
Reverse leakage current versus reverse
Tc=25°C
Tc=75°C
Tc=100°C
voltage applied (typical values).
IR(mA)
5E+2
1E+2
1E+1
1E+0
Tj=150°C
Tj=125°C
Fig.4 :
Relative variation of thermal impedance
junction to case versus pulse duration.
Zth(j-c)/Rth(j-c)
1.0
0.8
δ = 0.5
0.6
0.4
δ = 0.2
δ = 0.1
0.2
0.0
1E-4 1E-3 1E-2 1E-1 1E+0
Fig.6 :
Single pulse
Junction capacitance versus reverse
tp(s)
δ
=tp/T
T
tp
voltage applied (typical values).
C(nF)
5.0
F=1MHz
Tj=25°C
1.0
1E-1
Tj=25°C
VR(V)
1E-2
0 5 10 15 20 25
Fig.7 :
Forward voltage drop versus forward
current (maximum values).
IFM(A)
100.0
Typical values
10.0
1.0
0.1
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Tj=150°C
Tj=125°C
Tj=25°C
VFM(V)
0.1
12 5102030
Fig.8 :
Thermal resistance junction to ambient
VR(V)
versus copper surface under tab (Epoxy printed
circuit board FR4, copper thickness : 35 µm).
(STPS10L25G only)
Rth(j-a) (°C/W)
80
70
60
50
40
30
20
10
0
0 4 8 1216202428323640
S(Cu) (cm²)
3/5
Page 4
STPS10L25D/G
PACKAGE MECHANICAL DAT A
2
D
PAK
E
L2
L
L3
A1
B2
B
G
C2
DIMENSIONS
REF.
Millimeters Inches
Min. Max. Min. Max.
A
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
D
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
C
R
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
A2
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
M
*
V2
V2 0° 8° 0° 8°
* FLAT ZONE NO LESSTHAN 2mm
FOOT PRINT DIMENSIONS
16.90
10.30
8.90
(in millimeters)
Cooling method: by conduction ( method C)
5.08
1.30
3.70
4/5
Page 5
PACKAGE MECHANICAL DAT A
TO-220AC
H2
L5
Ø I
L6
L2
L9
F1
L4
F
G
STPS10L25D/G
DIMENSIONS
REF.
A
C
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
L7
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
D
H2 10.00 10.40 0.393 0.409
L2 16.40 typ. 0.645 typ.
L4 13.00 14.00 0.511 0.551
M
E
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Diam. I 3.75 3.85 0.147 0.151
Millimeters Inches
Min. Max. Min. Max.
Cooling method : C
Recommended torque value : 0.55 m .N
Maximum torque value : 0.70 m.N
Ordering type Marking Package Weight Base qty
Delivery
mode
STPS10L25D STPS10L25D TO-220AC 1.86g 50 Tube
2
STPS10L25G STPS10L25G D
STPS10L25G-TR S TPS10L25G D
PAK 1.48g 50 Tube
2
PAK 1.48g 1000 Tape & reel
Epoxy meets UL94,V0
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change without notice. This publication supersedes and replaces all information previously supplied.
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© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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