Datasheet STPS1045B, STPS1045H Datasheet (SGS Thomson Microelectronics)

®

MAIN PRODUCT CHARACTERISTICS

STPS1045B/H

POWER SCHOTTKY RECTIFIER

I

F(AV)

V

RRM

V

(max) 0.57 V

F

10 A
45 V

FEATURES AND BENEFITS

NEGLIGIBLE SWITCHING LOSSES

n

LOW FORWARD DROP VOLTAGE

n

LOW CAPACITANCE

n

HIGH REVERSE AVALANCHE SURGE

n

CAPABILITY

DESCRIPTION

High voltage Schottky rectifier suited for Switch
Mode Power Supplies and other Power
Converters.

Packaged in DPAK and IPAK, these devices are
intended for use in high frequency circuitries
where low switching losses are required.

ABSOLUTE MAXIMUM RATINGS

K

A

DPAK

STPS1045B

K

A

K

A

K

A

IPAK

STPS1045H

Symbol Parameter Value Unit

V

I

F(RMS)

I

RRM

/ pin RMS forward current / pin 7 A

F(AV)

Repetitive peak reverse voltage 45 V

Average forward current Tc = 150°C

10 A

d = 0.5

I

FSM

Surge non repetitive forward current tp = 10 ms

75 A

Sinusoidal

I

RRM

Repetitive peak reverse current tp = 2 µs

1A

F = 1KHz

T

stg

Storage temperature range - 65 to + 175 °C

Tj Maximum junction temperature 175 °C

dV/dt Critical rate of rise of reverse voltage 10000 V/µs

May 2000 - Ed: 2B

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STPS1045B/H

THERMAL RESISTANCES

Symbol Parameter Value Unit

R

th (j-c)

STATIC ELECTRICAL CHARACTERISTICS

Symbol Parameter Tests Conditions Min. Typ. Max. Unit

I

R

V

F

Pulse test : * tp = 380 µs, δ <2%

To evaluate the maximum conduction losses use the following equation :
P=0.42xI

Fig. 1: Averageforward power dissipation versus
average forward current.

Junction to case 3 °C/W

* Reverse leakage current Tj = 25°C VR=45V 100 µA

Tj = 125°C 7 15 mA

** Forward voltage drop Tj = 25°C IF= 10 A 0.63 V

**tp = 5 ms, δ <2%

+ 0.015 I

F(AV)

F2(RMS)

Tj = 125°C I
Tj = 25°C I
Tj = 125°C I

= 10 A 0.5 0.57

F

= 20 A 0.84

F

= 20 A 0.65 0.72

F

Fig. 2: Average forward current versus ambient
temperature (δ=0.5).

PF(av)(W)

8
7

δ = 0.05

δ = 0.1

δ = 0.2

δ = 0.5

6
5

δ = 1

4
3

δ

=tp/T

T

tp

2
1
0

0123456789101112

IF(av) (A)

Fig. 3: Non repetitive surge peak forward current

versus overload duration (maximum values).

IM(A)

120
100

80
60
40

IM

20

0

1E-3 1E-2 1E-1 1E+0

δ=0.5

t

t(s)

Tc=50°C

Tc=100°C

Tc=150°C

IF(av)(A)

12
10

Rth(j-a)=Rth(j-c)

8
6
4

T

Rth(j-a)=15°C/W

Rth(j-a)=70°C/W

2

tp

=tp/T

δ

0

0 25 50 75 100 125 150 175

Tamb(°C)

Fig. 4: Relative variation of thermal impedance

junction to case versus pulse duration.

Zth(j-c)/Rth(j-c)

1.0

0.8

δ = 0.5

0.6

0.4

δ = 0.2

δ = 0.1

0.2

0.0

Single pulse

1E-4 1E-3 1E-2 1E-1 1E+0

tp(s)

δ

=tp/T

T

tp

2/5

STPS1045B/H

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

IR(µA)

1E+5
1E+4
1E+3
1E+2
1E+1
1E+0

1E-1

0 5 10 15 20 25 30 35 40 45

Tj=150°C

Tj=125°C
Tj=100°C
Tj=75°C

Tj=50°C

Tj=25°C

VR(V)

Fig. 7: Forward voltage drop versus forward

current (maximum values).

IFM(A)

100.0

10.0

Tj=125°C

Tj=125°C

(Typical values)

Tj=25°C

Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).

C(pF)

1000

F=1MHz
Tj=25°C

500

200

VR(V)

100

12 51020 50

Fig. 8: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board, copper thickness: 35µm)
(STPS1045B).

Rth(j-a) (°C/W)

100

80

60

1.0

VFM(V)

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

40

20

S(Cu) (cm²)

0

0 2 4 6 8 10 12 14 16 18 20

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STPS1045B/H

PACKAGE MECHANICAL DATA

IPAK

E

B2

H

L1

L

B6

G

L2

B3
B

V1

B5

A1

C2

DIMENSIONS

REF.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A

A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051

B 0.64 0.9 0.025 0.035
B2 5.2 5.4 0.204 0.212
B3 0.85 0.033

D

B5 0.3 0.035
B6 0.95 0.037

C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023

D 6 6.2 0.236 0.244

E 6.4 6.6 0.252 0.260

C
A3

G 4.4 4.6 0.173 0.181

H 15.9 16.3 0.626 0.641

L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2 0.8 1 0.031 0.039
V1 10° 10°

n

Cooling method: by conduction (C)

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PACKAGE MECHANICAL DATA

DPAK

STPS1045B/H

DIMENSIONS

REF.

A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009

B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212

C 0.45 0.60 0.017 0.023

C2 0.48 0.60 0.018 0.023

D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181

H 9.35 10.10 0.368 0.397
L2 0.80 0.031
L4 0.60 1.00 0.023 0.039

V2 0° 8° 0° 8°

Millimeters Inches

Min. Typ. Max Min. Typ. Max.

Cooling method: by conduction (C)

n

FOOT PRINT DIMENSIONS (in millimeters)

6.7

6.7

6.7

3

1.61.6

2.32.3

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