Datasheet STP50N06FI, STP50N06 Datasheet (SGS Thomson Microelectronics)

Page 1
STP50N06
STP50N06FI
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTOR
TYPICAL R
DS(on)
= 0.022
AVALANCHE RUGGED TECHNOLOGY
REPETITIVE AVALANCHE DATA AT 100
o
C
LOW GATE CHARGE
HIGH CURRENT CAPABILITY
175
o
C OPERATING TEMPERATURE
APPLICATION ORIENTED
CHARACTERIZATION
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SOLENOID AND RELAY DRIVERS
REGULATORS
DC-DC & DC-AC CONVERTERS
MOTOR CONTROL, AUDIO AMPLIFIERS
AUTOMOTIVE ENVIRONMENT (INJECTION,
ABS, AIR-BAG, LAMPDRIVERS, Etc.)
INTERNAL SCHEMATIC DIAGRAM
TO-220 ISOWATT220
July 1993
TYPE V
DSS
R
DS(on)
I
D
STP 50N06 STP 50N06FI
60 V 60 V
< 0. 028 < 0. 028
50 A 27 A
ABSOLUTE MAXIMUM RATINGS
Symb o l Parameter Val u e Unit
STP 50N06 STP5 0N06FI
V
DS
Drain - source Voltage (VGS=0) 60 V
V
DGR
Drain- gate Voltage (RGS=20kΩ)60V
V
GS
Gate-source Voltage ± 20 V
I
D
Drain Current (continuous) at Tc=25oC5027A
I
D
Drain Current (continuous) at Tc=100oC35 19A
I
DM
(•) Drain Current (pulsed) 200 200 A
P
tot
Total D i ssipation at Tc=25oC 150 45 W Derating Factor 1 0.3 W/
o
C
V
ISO
Ins ulation Withs t and Voltage (DC) 20 00 V
T
stg
St orage Temperature -65 to 175
o
C
T
j
Max. Operating Junctio n Temperatur e 175
o
C
() Pulsewidth limited by safe operating area
1
2
3
1
2
3
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Page 2
THERMAL DATA
TO-220 ISOW ATT 220
R
thj-case
Thermal Resistance Junction -c as e M ax 1 3.33
o
C/W
R
thj-amb
R
thc-sink
T
l
Thermal Resistance Junction- ambient Max Thermal Resistance Case-sink Typ Maximum Lead T emperature For Soldering Purpos e
62.5
0.5
300
o
C/W
o
C/W
o
C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Uni t
I
AR
Avalanc h e Cu rr ent , Repet itive or Not-R epetitiv e (pulse width limited by Tjmax, δ <1%)
50 A
E
AS
Single Pul se Avalanche Ener gy (starti ng T
j
=25oC, ID=IAR,VDD=25V)
400 mJ
E
AR
Repetitive Avalanc he Energ y (pulse width limited by Tjmax, δ <1%)
100 mJ
I
AR
Avalanc h e Cu rr ent , Repet itive or Not-R epetitiv e (Tc= 100oC, pulse wid th limited by Tjmax, δ <1%)
35 A
ELECTRICAL CHARACTERISTICS (T
case
=25oC unless otherwise specified)
OFF
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
V
(BR)DSS
Drain - source Break d own Voltage
ID=250µAVGS=0 60 V
I
DSS
Zer o Gate Voltage Drain Current (VGS=0)
VDS=MaxRating VDS= Max R ating x 0.8 Tc=125oC
250
1000µAµA
I
GSS
Gat e- body Leakage Current (V
DS
=0)
V
GS
= ± 20 V ± 100 nA
ON ()
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage VDS=VGSID=250µA22.94V
R
DS(on)
St at ic Drain-s ourc e O n Resistance
VGS=10V ID=25A VGS=10V ID=25A Tc= 100oC
0.022 0.028
0.056ΩΩ
I
D(on)
On St ate Dra in Current VDS>I
D(on)xRDS(on)max
VGS=10V
50 A
DYNAMIC
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
g
fs
()Forward
Tr ansconduct anc e
VDS>I
D(on)xRDS(on)maxID
=25A 17 22 S
C
iss
C
oss
C
rss
Input Capacitance Out put Capacitance Reverse Transfer Capaci tance
VDS=25V f=1MHz VGS= 0 1700
630 200
2200
850 260
pF pF pF
STP50N06/FI
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Page 3
ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Time Rise Time
VDD=25V ID=25A RG=4.7 VGS=10V (see test circuit, figure 3)
50
11070160
ns ns
(di/dt)
on
Turn-on C urrent Slope VDD=40V ID=50A
RG=4.7 VGS=10V (see test circuit, figure 5)
460 A/µs
Q
g
Q
gs
Q
gd
Total Gate Charge Gat e- Source Charge Gate-Drain Charge
VDD=40V ID=50A VGS=10V 50
14 25
70 nC
nC nC
SWITCHING OFF
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off -voltage R ise Time Fall Time Cross-over Time
VDD=40V ID=50A RG=4.7 VGS=10V (see test circuit, figure 5)
55 50
110
80 70
160
ns ns ns
SOURCE DRAIN DIODE
Symbol Parameter Test Co ndition s Min. Typ. Max. Unit
I
SD
I
SDM
()
Source-drain Current Source-drain Current (pulsed)
50
200
A A
V
SD
(∗) Forward On Voltage ISD=50A VGS=0 2 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
ISD= 50 A di/dt = 100 A/µs VDD=30V Tj=150oC (see test circuit, figure 5)
150
0.45 6
ns
µC
A
() Pulsed: Pulse duration = 300 µs, dutycycle 1.5 % () Pulse widthlimited by safeoperating area
Safe Operating Areas For TO-220 Safe Operating Areas For ISOWATT220
STP50N06/FI
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Page 4
Thermal Impedeance For TO-220
Derating Curve For TO-220
Output Characteristics
Thermal Impedance For ISOWATT220
Derating Curve For ISOWATT220
Transfer Characteristics
STP50N06/FI
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Page 5
Transconductance Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage Capacitance Variations
Normalized On Resistance vs TemperatureNormalized Gate Threshold Voltage vs
Temperature
STP50N06/FI
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Page 6
Turn-on Current Slope Turn-off Drain-source Voltage Slope
Cross-over Time Switching Safe Operating Area
Accidental Overload Area Source-drain Diode Forward Characteristics
STP50N06/FI
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Page 7
Fig. 2: Unclamped Inductive Waveforms
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge Test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Reverse Recovery Time
Fig. 1: Unclamped Inductive Load Test Circuits
STP50N06/FI
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Page 8
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
L6
A
C
D
E
D1
F
G
L7
L2
Dia.
F1
L5
L4
H2
L9
F2
G1
TO-220 MECHANICAL DATA
P011C
STP50N06/FI
8/10
Page 9
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.4 0.7 0.015 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
L2
A
B
D
E
H
G
L6
Ø
F
L3
G1
123
F2
F1
L7
L4
ISOWATT220 MECHANICAL DATA
P011G
STP50N06/FI
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Page 10
Information furnished isbelieved to be accurateand reliable. However, SGS-THOMSONMicroelectronics assumes noresponsability for the consequences of use of suchinformation nor for any infringementof patents orother rights of third parties whichmay results from its use. No license isgrantedby implicationor otherwiseunder anypatentor patentrights ofSGS-THOMSON Microelectronics.Specificationsmentioned in this publicationare subjectto change without notice.This publication supersedes and replacesall information previouslysupplied. SGS-THOMSON Microelectronicsproducts arenotauthorizedfor useascriticalcomponents inlifesupportdevices orsystemswithout express written approvalof SGS-THOMSON Microelectonics.
1994 SGS-THOMSONMicroelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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STP50N06/FI
10/10
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