This PowerMOSFET is the latest developmentof
STMicroelectronicsunique”SingleFeature
Size” strip-based process. The resulting transi-
stor showsextremelyhigh packing densityfor low
on-resistance, rugged avalanche characteristics
and less critical alignment steps therefore a remarkablemanufacturingreproducibility.
APPLICATIONS
■ DC MOTOR CONTROL
■ DC-DC& DC-ACCONVERTERS
■ SYNCHRONOUSRECTIFICATION
R
DS(on)
<0.05Ω
<0.05Ω
I
D
30 A
17 A
3
2
1
TO-220TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP30NE06L STP30NE06L FP
V
V
V
I
DM
P
V
T
(•) Pulse width limited by safe operating area
March 1999
Drain-source Voltage (VGS=0)60V
DS
Drain- ga t e Voltage (RGS=20kΩ)60V
DGR
Gate-s ource Volt age± 20V
GS
I
Drain Cur rent (cont i nuous) at Tc=25oC3017A
D
I
Drain Cur rent (cont i nuous) at Tc= 100oC2112A
D
(•)Drain Cur rent (pulse d)12068A
Total Dissipation at Tc=25oC8030W
tot
Derat i ng Factor0.530.2W/
Ins ula t ion Withst and Voltage (DC)2000V
ISO
St orage Tem p er at u re-65 to 175
stg
T
Max. Operating Junct ion Temperature175
j
o
C
o
C
o
C
1/9
Page 2
STP30NE06L/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax Valu eUnit
I
AR
E
Ther mal Resistanc e Junct ion-caseMax1.8755
Ther mal Resistanc e Junct ion-ambientMax
Ther mal Resistanc e Case-sinkTy p
Maximum L ead Temperature F or Solder ing P urp os e
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pul se Avalanche Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max)
j
62.5
0.5
300
20A
100mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest Condit ionsMin.Typ.M ax.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=060V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Curre nt (V
GS
Gat e- bod y Leakag e
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc= 125oC
V
DS
V
=± 20 V
GS
1
10
100nA
±
ON(∗)
SymbolParameterTest Condit ionsMin.Typ.M ax.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250µA11.752.5V
Sta t ic Drain-s our c e On
Resistance
VGS=5V ID=15A
=10V ID=15A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.045
0.035
30A
0.06
0.05
VGS=10V
DYNAMIC
SymbolParameterTest Condit ionsMin.Typ.M ax.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac it anc e
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=15 A1018S
VDS=25V f=1MHz VGS= 01350
195
58
µA
µA
Ω
Ω
pF
pF
pF
2/9
Page 3
STP30NE06L/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
SymbolParameterTest Condit ionsMin.Typ.M ax.Unit
t
d(on)
Tur n-on Delay Time
Rise Time
t
r
VDD=30VID=15A
R
=4.7
G
Ω
VGS=4.5V
25
105
(Resis t iv e Load, see fig. 3)
Q
Q
Q
Tot al Gate Charge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD=48V ID=30A VGS=5V20
8
10
28nC
SWITCHINGOFF
SymbolParameterTest Condit ionsMin.Typ.M ax.Unit
t
d(off)
Tur n-of f Dela y Tim e
t
Fall T ime
f
VDD=30VID=15A
=4.7 ΩVGS=4.5V
R
G
50
20
(Resis t iv e Load, see fig. 3)
t
r(Voff)
t
t
Off-volt age Rise Time
Fall T ime
f
Cross-over Tim e
c
VDD=48VID=30A
=4.7 ΩVGS=4.5V
R
G
(Indu ct iv e Load, see fig . 5)
15
40
60
SOURCEDRAIN DIODE
SymbolParameterTest Condit ionsMin.Typ.M ax.Unit
I
V
I
SDM
SD
Q
I
RRM
SD
t
Source-drain Current
(•)
Source-drain Current
30
120
(pulsed)
(∗)ForwardOnVoltage ISD=30A VGS=01.5V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD= 30 Adi/dt = 100 A /µs
=30VTj=150oC
V
DD
(see test circuit, fig. 5)
80
0.18
Charge
Reverse Recovery
4.5
Current
ns
ns
nC
nC
ns
ns
ns
ns
ns
A
A
ns
µC
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
(•) Pulse width limited by safeoperating area
SafeOperating Area for TO-220SafeOperating Area for TO-220FP
3/9
Page 4
STP30NE06L/FP
ThermalImpedancefor TO-220
OutputCharacteristics
ThermalImpedanceforTO-220FP
TransferCharacteristics
Transconductance
4/9
Static Drain-sourceOn Resistance
Page 5
STP30NE06L/FP
Gate Charge vs Gate-sourceVoltage
NormalizedGate ThresholdVoltage vs
Temperature
CapacitanceVariations
NormalizedOn Resistancevs Temperature
Source-drainDiode Forward Characteristics
5/9
Page 6
STP30NE06L/FP
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For
ResistiveLoad
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