Datasheet STP30NE03L, STP30NE03LFP Datasheet (SGS Thomson Microelectronics)

Page 1
STP30NE03L
N - CHANNEL 30V - 0.028 - 30A TO-220/TO-220FP
TYPE V
ST P30NE03L ST P30NE03LFP
TYPICALR
100%AVALANCHETESTED
LOW THRESHOLDDRIVE
DS(on)
DSS
30 V 30 V
= 0.028
DESCRIPTION
This PowerMOSFET is the latest developmentof STMicroelectronics unique ”Single Feature Size” strip-based process. The resulting transi­stor showsextremelyhigh packing densityfor low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a re­markablemanufacturingreproducibility.
APPLICATIONS
DC MOTOR CONTROL
DC-DC& DC-ACCONVERTERS
SYNCHRONOUSRECTIFICATION
R
DS(on)
<0.04 <0.04
I
D
30 A 17 A
STP30NE03LFP
STripFET POWER MOSFET
3
2
1
TO-220 TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP30NE03L STP30NE03L FP
V
V
V
I
DM
P
V
T
() Pulse width limited by safe operating area
June 1999
Drain-source Voltage (VGS=0) 30 V
DS
Drain- ga t e Voltage (RGS=20kΩ)30V
DGR
Gate-s ource Volt age ± 20 V
GS
I
Drain Cur rent (cont i nuous) at Tc=25oC3017A
D
I
Drain Cur rent (cont i nuous) at Tc= 100oC2112A
D
() Drain Cur rent (pulse d) 120 68 A
Total Dissipation at Tc=25oC7025W
tot
Derat i ng Fa c t or 0.47 0.17 W/ Ins ula t ion Withst and Voltage (DC) 2000 V
ISO
St orage Tem p er at u re -65 to 175
stg
T
Max. Operating Junction Tem p er at u re 175
j
o
C
o
C
o
C
1/9
Page 2
STP30NE03L/FP
THERMAL DATA
TO-220 TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Valu e Unit
I
AR
E
Ther mal Resistanc e Junct ion-case Max 2.14 6 Ther mal Resistanc e Junct ion-ambient Max
Ther mal Resistanc e Case-sink Ty p Maximum L ead Temperature For So ldering Purpos e
l
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
Single Pul se Avalanche Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max)
j
62.5
0.5
300
15 A
250 mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=0 30 V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage Drain Curre nt (V
GS
Gat e- bod y Leakag e Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRating Tc= 125oC
V
DS
V
=± 20 V
GS
1
10
100 nA
±
ON()
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250µA 1 1.75 2.5 V Sta t ic Drain-s our c e On
Resistance
VGS=5V ID=15A
=10V ID=15A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.042
0.028
30 A
0.055
0.04
VGS=10V
DYNAMIC
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=15 A 5 15 S
VDS=25V f=1MHz VGS= 0 800
205
70
µA µA
Ω Ω
pF pF pF
2/9
Page 3
STP30NE03L/FP
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
t
d(on)
Tur n-on Delay Time Rise Time
t
r
VDD=15V ID=14A R
=4.7
G
VGS=5V
19
110
(Resis t iv e Load, see fig. 3)
Q Q Q
Tot al Gate Charge
g
Gat e- Source Char g e
gs
Gate-Drain Charge
gd
VDD=48V ID=30A VGS=5V 20
8
10
28 nC
SWITCHINGOFF
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
t
d(off)
Tur n-of f Dela y Tim e
t
Fall T ime
f
VDD=15V ID=14A
=4.7 VGS=5V
R
G
40 20
(Resis t iv e Load, see fig. 3)
t
r(Voff)
t
t
Off-volt age Rise Time Fall T ime
f
Cross-over Tim e
c
VDD=24V ID=28A
=4.7 VGS=5V
R
G
(Indu ct iv e Load, see fig . 5)
20 38 65
SOURCEDRAIN DIODE
Symbol Parameter Test Condit ions Min. Typ. M ax. Unit
I
V
I
SDM
SD
Q
I
RRM
SD
t
Source-drain Current
(•)
Source-drain Current
30
120
(pulsed)
(∗)ForwardOnVoltage ISD=30A VGS=0 1.5 V
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 28 A di/dt = 100 A /µs
=20V Tj=150oC
V
DD
(see test circuit, fig. 5)
30
30 Charge Reverse Recovery
2
Current
ns ns
nC nC
ns ns
ns ns ns
A A
ns
nC
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5% (•) Pulse width limited by safeoperating area
SafeOperating Area for TO-220 SafeOperating Area for TO-220FP
3/9
Page 4
STP30NE03L/FP
ThermalImpedancefor TO-220
OutputCharacteristics
ThermalImpedanceforTO-220FP
TransferCharacteristics
Transconductance
4/9
Static Drain-sourceOn Resistance
Page 5
STP30NE03L/FP
Gate Charge vs Gate-sourceVoltage
NormalizedGate ThresholdVoltage vs Temperature
CapacitanceVariations
NormalizedOn Resistancevs Temperature
Source-drainDiode Forward Characteristics
5/9
Page 6
STP30NE03L/FP
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For ResistiveLoad
Fig. 2:
UnclampedInductiveWaveform
Fig. 4: Gate Charge test Circuit
Fig. 5:
Test CircuitFor InductiveLoad Switching
And Diode Recovery Times
6/9
Page 7
TO-220 MECHANICALDATA
STP30NE03L/FP
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
mm inch
E
A
L4
D
F2
F1
G1
H2
G
F
P011C
C
D1
L2
Dia.
L5
L7
L6
L9
7/9
Page 8
STP30NE03L/FP
TO-220FP MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L4
8/9
Page 9
STP30NE03L/FP
Information furnished is believed tobeaccurateand reliable. However, STMicroelectronics assumesno responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may resultfrom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationmentioned in this publicationare subjecttochange without notice.Thispublication supersedesand replacesall information previously supplied. STMicroelectronics products are not authorizedfor useas critical components in lifesupport devices or systems without express written approval of STMicroelectronics.
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1999 STMicroelectronics – Printed in Italy – All Rights Reserved
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