This Power Mosfet is the latest development of
STMicroelectronics unique ” Single Feature
Size ” strip-basedprocess. The resulting transi-
stor shows extremelyhigh packing densityforlow
on-resistance, rugged avalance characteristics
and less critical alignment steps therefore a remarkablemanufacturingreproducibility.
R
DS(on)
<0.080Ω
<0.080Ω
o
C
I
D
20 A
13 A
STP20NE06FP
STripFET POWER MOSFET
3
2
1
TO-220TO-220FP
INTERNAL SCHEMATIC DIAGRAM
3
2
1
APPLICATIONS
■ HIGHCURRENT, HIGH SPEEDSWITCHING
■ SOLENOIDAND RELAY DRIVERS
■ MOTORCONTROL, AUDIOAMPLIFIERS
■ DC-DC& DC-AC CONVERTERS
■ AUTOMOTIVEENVIRONMENT(INJECTION,
ABS, AIR-BAG, LAMPDRIVERS,Etc.)
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
ST P20NE06STP20NE06FP
V
V
V
I
DM
P
V
dv/ dtP ea k Diode Recover y volt age slope7V/ ns
T
(•) Pulse width limited by safe operating area(1)ISD≤ 20 A, di/dt ≤ 300 A/µs, VDD≤ V
June 1999
Drain-source Voltage (VGS=0)60V
DS
Drain- gate Vol t age (RGS=20kΩ)60V
DGR
Gate-source Voltage± 20V
GS
I
Drain Curre nt (cont i nuous) at Tc=25oC2013A
D
Drain Curre nt (cont i nuous) at Tc=100oC149A
I
D
(•)Drain Curre nt (pulse d)8080A
Total Dissipation at Tc=25oC7030W
tot
Derat ing F ac tor0.470.2W/
Ins ulat ion W i th s t and Voltage ( DC)2000V
ISO
Sto rage Temper at ur e-65 to 175
stg
T
Max. Operat ing Junct ion Tem pe ra ture175
j
(BR)DSS,Tj≤TJMAX
o
C
o
C
o
C
1/9
Page 2
STP20NE06/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax V alueUnit
I
AR
E
Ther mal Resistanc e Junct ion-caseM a x2.145
Ther mal Resistanc e Junct ion-ambie ntMax
Ther mal Resistanc e Case-sinkTy p
Maximum Lead Tempe ra tur e F or S o ldering Purpos e
l
Avalanche Current, R epetitive or Not-Repetitive
(pulse width limited by T
Single Pul se Avalanc he Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=25V)
j
max)
j
62.5
0.5
300
20A
100mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=060V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Volta ge
Drain Curre nt (V
GS
Gat e- bod y Leakag e
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc= 125oC
V
DS
V
=± 20 V
GS
1
10
100nA
±
ON(∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID= 250µA234V
Sta t ic Drain-s our c e On
Information furnished is believed tobe accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication orotherwise under any patent or patent rights of STMicroelectronics. Specificationmentioned in this publication are
subjecttochange without notice. This publication supersedes andreplaces all information previously supplied. STMicroelectronicsproducts
are not authorized for use as critical components in life support devices or systemswithout express written approval of STMicroelectronics.
The STlogo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
.
9/9
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