Datasheet STP16NF06 Specification

Page 1
N-channel 60V - 0.08Ω - 16A - TO-220/TO-220FP
3
General features
Typ e V
STP16NF06 60V <0.1 16A
STP16NF06FP 60V <0.1 11A
Exceptional dv/dt capability
Application oriented characterization
DSS
Description
This Power MOSFET is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
I
D
STP16NF06
STP16NF06FP
STripFET™ II Power MOSFET
3
2
1
TO-220
TO-220FP
Internal schematic diagram
2
1
Applications
Switching application
Order codes
Part number Marking Package Packaging
STP16NF06 P16NF06 TO-220 Tube
STP16NF06FP P16NF06 TO-220FP Tube
February 2007 Rev 8 1/14
www.st.com
14
Page 2
Contents STP16NF06 - STP16NF06FP
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
Page 3
STP16NF06 - STP16NF06FP Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
TO-220 TO-220FP
I
V
V
DM
P
I
I
DS
GS
D
D
(2)
tot
Drain-source voltage (VGS = 0) 60 V
Gate- source voltage ± 20 V
Drain current (continuous) at TC = 25°C 16 11
Drain current (continuous) at TC = 100°C 11 7.5
Drain current (pulsed) 64 44
Total dissipation at TC = 25°C 45 25 W
Derating factor 0.3 0.17 W/°C
(3)
dv/dt
E
AS
I
AR
V
ISO
T
stg
T
j
1. Current limited by package’s thermal resistance
2. Pulse width limited by safe operating area.
3. ISD ≤ 16A, di/dt ≤ 200A/µs, VDD ≤ V
4. Starting Tj = 25 °C, ID = 8A, VDD = 30V
Peak diode recovery voltage slope 20 V/ns
(4)
Single pulse avalanche energy 130 mJ
Avalanche current, repetitive or not­repetitive
Insulation withstand voltage (DC) -- 2500 V
Storage temperature
Max. operating junction temperature
, Tj ≤ T
(BR)DSS
JMAX
(1)
(1)
(1)
A
A
A
16 A
-55 to 175 °C
Table 2. Thermal data
TO-220 TO-220FP
Rthj-case Thermal resistance junction-case max 3.33 6 °C/W
Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W
T
Maximum lead temperature for soldering purpose 300 °C
J
3/14
Page 4
Electrical characteristics STP16NF06 - STP16NF06FP

2 Electrical characteristics

(T
=25°C unless otherwise specified)
CASE
Table 3. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (V
GS
Gate-body leakage current (V
DS
= 0)
= 0)
ID = 250µA, VGS =0 60 V
V
= max ratings
DS
VDS = max ratings,
= 125°C
T
C
1
10
VGS = ± 20V ±100 nA
Gate threshold voltage VDS = VGS, ID = 250µA 2 4 V
Static drain-source on resistance
V
= 10V, ID = 8A 0.08 0.1
GS
Table 4. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Forward
(1)
g
fs
C C
oss
C
t
d(on)
t
t
d(off)
t
Q
Q
Q
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
transconductance
Input capacitance
iss
Output capacitance Reverse transfer
rss
capacitance
Turn-on delay time Rise time
r
Turn-off delay time Fall time
f
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
= 15V, ID=8A 6.5 S
V
DS
= 25V, f = 1MHz,
V
DS
= 0
V
GS
= 30V, ID = 8A
V
DD
RG=4.7Ω VGS = 10V (see Figure 15)
VDD = 48V, ID = 16A, VGS = 10V (see Figure 16)
315
70 30
7 18 17
6
10
3.5
3.5
13 nC
µA µA
pF pF pF
ns ns ns ns
nC nC
4/14
Page 5
STP16NF06 - STP16NF06FP Electrical characteristics
Table 5. Source drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Source-drain current Source-drain current
(1)
(pulsed)
(2)
Forward on voltage ISD = 16A, VGS = 0 1.3 V
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
ISD = 15A, di/dt = 100A/µs,
= 30V, Tj = 150°C
V
DD
(see Figure 17)
50 88
3.5
16 64
A A
ns
nC
A
5/14
Page 6
Electrical characteristics STP16NF06 - STP16NF06FP

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area for TO-220 Figure 2. Thermal impedance for TO-220
Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP
Figure 5. Output characteristics Figure 6. Transfer characteristics
6/14
Page 7
STP16NF06 - STP16NF06FP Electrical characteristics
Figure 7. Transconductance Figure 8. Static drain-source on resistance
Figure 9. Gate charge vs. gate-source voltage Figure 10. Capacitance variations
Figure 11. Normalized gate threshold voltage
vs. temperature
Figure 12. Normalized on resistance vs.
temperature
7/14
Page 8
Electrical characteristics STP16NF06 - STP16NF06FP
Figure 13. Source-drain diode forward
characteristics
Figure 14. Normalized B
vs. temperature
VDSS
8/14
Page 9
STP16NF06 - STP16NF06FP Test circuit

3 Test circuit

Figure 15. Switching times test circuit for
resistive load
Figure 17. Test circuit for inductive load
switching and diode recovery times
Figure 16. Gate charge test circuit
Figure 18. Unclamped Inductive load test
circuit
Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform
9/14
Page 10
Package mechanical data STP16NF06 - STP16NF06FP

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
10/14
Page 11
STP16NF06 - STP16NF06FP Package mechanical data
L2
A
B
D
E
H
G
L6
F
L3
G1
123
F2
F1
L7
L4
L5
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.1 08
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.2 04
L4 9. 8 10.6 .0385 0.417
L5 2. 9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.6 45
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
TO-220FP MECHANICAL DATA
11/14
Page 12
Package mechanical data STP16NF06 - STP16NF06FP
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0. 024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15 .75 0.60 0.620
E 10 10.40 0.393 0 .409
e 2.40 2.70 0. 094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
3.75 3.85 0.147 0.151
mm. inch
12/14
Page 13
STP16NF06 - STP16NF06FP Revision history

5 Revision history

Table 6. Revision history
Date Revision Changes
09-Sep-2004 4 Preliminary version
28-Jun-2005 5 Complete version
21-Jul-2005 6 ECOPACK label inserted
09-Aug-2006 7 New template, no content change
20-Feb-2007 8 Typo mistake on page 1
13/14
Page 14
STP16NF06 - STP16NF06FP
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14
Loading...