This Power Mosfet is the latest development of
SGS-THOMSON unique "Single Feature Size"
process whereby a single body is implanted on a
strip layout structure. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalance characteristics and
less critical alignment steps therefore a remarkable manufacturing reproducibility.
R
DS(on)
< 0.100 Ω
< 0.100 Ω
I
D
16 A
11 A
STP16NE06FP
STripFET POWER MOSFET
PRELIMINARY DATA
3
2
1
TO-220 TO-220FP
INTER NAL SCH E M ATI C DIAG RA M
3
2
1
APPLICATIONS
■ DC MOTOR CONTROL
■ DC-DC & DC-AC CONVERT E RS
■ SYNCHRONOUS RECTIFICATION
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP16NE06STP16NE06FP
V
V
V
I
DM
P
V
dV/dtPeak Diode Recovery voltage slope6V/ns
T
(•) Pulse width limited by safe operating area (1) ISD ≤ 16 A, di/dt ≤ 200 A/µs, VDD ≤ V
New RDS (on) spec. starting from JULY 98
’
June 1998
Drain-source Voltage (VGS = 0)60V
DS
Drain- gate Voltage (RGS = 20 kΩ)
DGR
Gate-source Voltage± 20V
GS
Drain Current (continuous) at Tc = 25 oC1611A
I
D
I
Drain Current (continuous) at Tc = 100 oC107A
D
60V
(•)Drain Current (pulsed)6464A
Total Dissipation at Tc = 25 oC6030W
tot
Derating Factor0.40.2W/
Insulation Withstand Voltage (DC)2000V
ISO
Storage Temperature-65 to 175
stg
Max. Operating Junction Temperature175
T
j
, Tj ≤ T
(BR)DSS
JMAX
o
C
o
C
o
C
1/9
Page 2
STP16NE06/FP
THERMAL DATA
TO-220TO-220FP
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERI S TICS
SymbolParameterMax ValueUnit
I
AR
E
Thermal Resistance Junction-case Max2.55
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25 oC, ID = IAR, V
j
ma x)
j
DD
= 25 V)
62.5
0.5
300
16A
80mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
= 25 oC unless otherwise specified)
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
I
= 250 µA V
D
GS
= 0
60V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating Tc = 125
DS
o
C
V
= ± 20 V
GS
1
10
± 100nA
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
Gate Threshold
V
= VGS ID = 250 µA
DS
234V
Voltage
R
DS(on)
Static Drain-source On
VGS = 10V ID = 8 A0.0800.100Ω
Resistance
I
D(on)
On State Drain Current VDS > I
V
= 10 V
GS
D(on)
x R
DS(on)max
16A
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID =8 A6S
30
1000
140
45
= 0760
GS
100
µA
µA
pF
pF
pF
2/9
Page 3
STP16NE06/FP
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING O N
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
Q
Q
Q
SWITCHING O F F
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
SOURCE DRAIN DIO DE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Turn-on Time
Rise Time
r
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
Off-voltage Rise Time
Fall Time
t
f
Cross-over Time
c
Source-drain Current
(•)
Source-drain Current
V
= 30 V ID = 8 A
DD
R
=4.7 W VGS = 10 V
G
VDD = 40 V ID = 16 A V
V
= 48 V ID = 16 A
DD
=4.7 Ω VGS = 10 V
R
G
= 10 V20
GS
10
35
5
7
7
18
30
80
40
30nC
10
25
45
16
64
(pulsed)
(∗)Forward On VoltageISD = 16 A VGS = 01.5V
Reverse Recovery
rr
Time
Reverse Recovery
rr
I
= 16 A di/dt = 100 A/µs
SD
V
= 30 V Tj = 150 oC
DD
70
0.21
Charge
Reverse Recovery
6
Current
ns
ns
nC
nC
ns
ns
ns
A
A
ns
µC
A
Safe Operating Area for TO-220Safe Operating Are a for TO-220FP
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