The Smart Reset™ device family STM65xx provides a useful feature that ensures
inadvertent short reset push-button closures do not cause system resets. This is done by
implementing an extended Smart Reset™ input delay (t
input levels and setup delay are met, the device generates an output reset pulse with userprogrammable timeout period (t
REC
).
The typical application hookup shows that the dual Smart Reset™ inputs can be also
connected to the applications interrupt to allow the control of both the interrupt pin and the
hard reset functions. If the push-buttons are closed for a short time, the processor is only
interrupted. If the system still does not respond properly, holding the push-buttons for the
extended setup time (t
) causes a hard reset of the processor through the reset output.
SRC
The Smart Reset™ feature helps significantly increase system stability.
The STM65xx family of Smart Reset™ devices consists of low-current microprocessor reset
circuits targeted at applications such as MP3 players, portable navigation devices or mobile
phones, generally any application that requires delayed reset push-button(s) response for
improved system stability. The STM65xx devices feature single or dual Smart Reset™
inputs (SRx). The delayed Smart Reset™ setup time (t
adding an external capacitor on the SRC pin or selectable by three-state logic. The delayed
setup period ignores switch closures shorter than t
SRC
The STM65xx devices have active-low (optionally active-high) open-drain reset (RST
output(s) with or without an internal pull-up resistor or push-pull as output options, with or
without the power-on reset function.
). Once the valid Smart Reset™
SRC
) options are adjustable by
SRC
, thus preventing undesired resets.
)
Some devices also have an undervoltage monitoring feature: the reset output is also
asserted when the monitored supply voltage V
reset output remains asserted for the reset timeout period (t
voltage goes above the specified threshold.
1.2 STM6510
The STM6510 has two combined Smart Reset™ inputs (SR0 and SR1) with Smart Reset™
setup delay (t
STM6510 feature is adjustable output reset pulse time t
(C
).
tREC
Additionally, the V
reset output goes active and remains active while V
defined duration of the reset pulse t
drops below the specified threshold. The
CC
) programmed by an external capacitor on the SRC pin. An additional
SRC
REC
is monitored and if it drops below the selected V
CC
REC
.
is below the V
CC
) after the monitored supply
REC
by adding an external capacitor
threshold, the
RST
threshold, plus the
RST
Doc ID 16788 Rev 25/26
Page 6
DescriptionSTM6510
Figure 1.Logic diagram
V
CC
SR0
SR1
SRC
STM6510
V
SS
RST
TREC
ADJ
AM00389a
Figure 2.Pin connections
STM
6510
8
V
CC
7
SR0
6
TREC
ADJ
5
SRC
Table 1.Signal names
RST
V
SS
SR1
NC
1
2
3
4
SymbolInput/outputDescription
RST
SR0Input
SR1Input
SRCInput
TREC
ADJ
OutputReset output, active-low (open-drain).
Primary push-button Smart Reset™ input. Active-low, internal 65 kΩ
pull-up resistor to V
CC
.
Secondary push-button Smart Reset™ input. Active-low, internal 65 kΩ
pull-up resistor to V
CC
.
Smart Reset™ input delay setup control. Connect an external capacitor
to this pin to adjust the delay setup time (t
Input
Input pin for t
capacitor (C
reset pulse duration adjustment. Connect an external
REC
) to this pin to determine t
tREC
Supply voltage input. Power supply for the device and an input for the
V
CC
Supply
monitored supply voltage. A 0.1 µF decoupling ceramic capacitor is
recommended to be connected between V
V
SS
Supply Ground
NCNo connect (not bonded); should be connected to V
Note:When only one Smart Reset™ input push-button is used, tie both the SR
Figure 5.Dual-button Smart Reset™ typical hookup
V
CC
V
CC
MCU
V
SS
AM04870v1
inputs together.
V
CC
RST
SS
SRC
SR1
SR0
C
SRC
PUSH-BUTTON
SWITCH
C
tREC
TREC
ADJ
STM6510
V
8/26Doc ID 16788 Rev 2
100 kΩ
RESET
INT/
NMI
PUSH-BUTTON
SWITCH
V
CC
MCU
V
SS
AM004871v1
Page 9
STM6510Description
1.3 Pin descriptions
1.3.1 Power supply (VCC)
This pin is used to provide the power to the Smart Reset™ device and to monitor the power
supply. A 0.1 µF decoupling ceramic capacitor is recommended to be connected between
the V
1.3.2 Ground (VSS)
This is the supply ground for the device.
1.3.3 Smart Reset™ push-button inputs (SR0, SR1)
and VSS pins.
CC
Both SR0 and SR1 need to be held active at the same time for at least t
reset output pulse. Include an internal 65 kΩ
pull-up resistor to V
Figure 6.Timing waveforms
SR0
SR1
RST
t
SRC
t
REC
1.3.4 Adjustable delay of Smart Reset™ input (SRC pin)
This pin controls the setup time before the push-button action is validated by the reset
output. It is connected to an external capacitor (C
desired value of setup time (t
Calculated t
Table 2.t
Calculated C
value [µF]
and C
SRC
SRC
SRC
SRC
programmed by an ideal external capacitor
Min.Typ.Max.
).
SRC
examples are given in Table 2. Refer also to Table 6.
Setup delay t
), which is tied to ground to provide the
SRC
(1)(2)
[s]
SRC
SRC
for each input.
CC
to activate the
AM00393
Closest common
C
value [µF]
SRC
0.22340.22
0.334.560.33
0.669120.56
11015201
1. Example calculations based on an ideal capacitor. During application design and component selection it
should be considered that the current flowing into the external t
the order of 100 nA, therefore a low-leakage capacitor (ceramic or film capacitor) and an adequate PCB
environment should be used to prevent t
value of C
2. In case of repeated activations of the t
activations to fully discharge C
is 0.01 µF.
SRC
, so that the next t
SRC
accuracy from being affected. A recommended minimum
SRC
counter, an interval of 10 ms min. is needed between the
SRC
is as specified.
SRC
programming capacitor (C
SRC
SRC
) is on
Doc ID 16788 Rev 29/26
Page 10
DescriptionSTM6510
1.3.5 Reset output (RST)
RST is active-low, open-drain.
1.3.6 Adjustable reset timeout (TREC
The reset timeout (t
Calculated t
Table 3.t
Calculated C
value [µF]
0.0011015200.001
0.0022030400.0022
0.011001502000.01
0.0141402102800.015
0.0282804205600.027
0.05656084011200.056
0.1121120168022400.1
1. Example calculations based on an ideal capacitor. During application design and component selection it
should be considered that the current flowing into the external t
the order of 100 nA, therefore a low-leakage capacitor (ceramic or film capacitor) and an adequate PCB
environment should be used to prevent t
value of C
2. In case of repeated activations of the t
intervals to fully discharge C
and C
REC
REC
tREC
is 0.001 µF.
tREC
) is adjustable by connecting an external capacitor C
REC
examples are given in Table 3. Refer also to Table 6.
tREC
programmed by an ideal external capacitor
Min.Typ.Max.
, so that the next t
tREC
t
accuracy from being affected. A recommended minimum
REC
counter, an interval of 10 ms min. is needed between t
REC
ADJ
REC
pin)
(1)(2)
[ms]
is as specified.
REC
programming capacitor (C
REC
to this pin.
tREC
Closest common
C
value [µF]
tREC
) is on
tREC
REC
10/26Doc ID 16788 Rev 2
Page 11
STM6510Typical operating characteristics
2 Typical operating characteristics
Figure 7.Supply current (ICC) vs. temperature
2.4
2.2
2
1.8
1.6
1.4
[μA]
CC
I
-60-40-20020406080100120140
Figure 8.Smart Reset™ delay (t
1.2
0.8
0.6
0.4
0.2
1
0
Temperature [°C]
5.5 V3.3 V5 V3 V
) vs. temperature, C
SRC
12
11
10
= 0.56 µF
SRC
AM04876v1
[s]
SRC
t
-60-40-20020406080100120140
9
8
7
6
Temperature [°C]
5.75 V5.5 V3.3 V
AM04877v1
Doc ID 16788 Rev 211/26
Page 12
Typical operating characteristicsSTM6510
Figure 9.Reset timeout period (t
200
190
180
170
160
[ms]
REC
t
-60-40-20020406080100120140
150
140
130
120
110
100
) vs. temperature, C
REC
Temperature [°C]
5.75 V5.5 V3.3 V
tREC
= 0.01 µF
AM04878v1
Figure 10. Reset threshold (V
[V]
RST
V
-60-40-20020406080100120140
) vs. temperature, “S” threshold option, VCC falling
RST
2.99
2.97
2.95
2.93
2.91
2.89
2.87
2.85
Temperature [°C]
AM04879v1
12/26Doc ID 16788 Rev 2
Page 13
STM6510Maximum ratings
3 Maximum ratings
Stressing the device above the rating listed in the Table 4: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics™ SURE
Program and other relevant quality documents.
Table 4.Absolute maximum ratings
SymbolParameterValueUnit
T
T
SLD
θ
V
V
STG
JA
IO
CC
Storage temperature (VCC off)–55 to +150 °C
(1)
Lead solder temperature for 10 seconds260 °C
Thermal resistance (junction to ambient)TDFN8149.0°C/W
Input or output voltage–0.3 to V
CC
Supply voltage–0.3 to 7V
+0.3V
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Doc ID 16788 Rev 213/26
Page 14
DC and AC parametersSTM6510
4 DC and AC parameters
This section summarizes the operating measurement conditions, and the DC and AC
characteristics of the device. The parameters in the Table 6: DC and AC characteristics that
follow, are derived from tests performed under the Measurement Conditions summarized in
T ab le 5: Operating and measurement conditions. Designers should check that the operating
conditions in their circuit match the operating conditions when relying on the quoted
parameters.
Table 5.Operating and measurement conditions
ParameterValueUnit
V
supply voltage1.0 to 5.5V
CC
Ambient operating temperature (T
Input rise and fall times≤
Input pulse voltages0.2 to 0.8 V
Input and output timing ref. voltages0.3 to 0.7 V
Figure 11. AC testing input/output waveforms
)–40 to +85°C
A
5ns
CC
CC
V
V
0.8 V
0.2 V
CC
CC
0.7 V
0.3 V
CC
CC
AM00478
14/26Doc ID 16788 Rev 2
Page 15
STM6510DC and AC parameters
Table 6.DC and AC characteristics
SymbolParameterTest conditions
V
V
Supply voltage rangeReset output valid - active-low1.05.5V
CC
V
= 5.0 V1.52.4µA
I
Supply current (VCC)
CC
Reset output voltage low
OL
CC
V
V
V
V
= 3.0 V
CC
≥
CC
≥
CC
≥
CC
(3)
4.5 V, sinking 3.2 mA0.3V
3.3 V, sinking 2.5 mA0.3V
1.0 V, sinking 0.1 mA0.3V
–40 to +85 °C
V
VCC undervoltage reset
RST
threshold (refer to Table 7)
25 °C
L, M0.5%
V
t
REC
Hysteresis of V
HYST
V
to reset delay
CC
User-adjustable reset timeout
(4)
period on RST. Refer to
RST
(4)
T, S, R, Z, Y, W, V1%
VCC falling from (V
to (V
- 100 mV) at 10 mV/µs
RST
RST
Table 3.
(1)
+ 100 mV)
Min.Typ.
V
RST
–2.5%
V
RST
–2.0%
10 000 x
C
tREC
(µF)
(2)
Max.Units
1.4µA
V
V
RST
V
RST
RST
+2.5%
V
RST
+2.0%
20µs
15 000 x
C
(µF)
tREC
20 000 x
C
(µF)
tREC
V
V
ms
Smart Reset™ inputs
User-adjustable delayed Smart
(5)
t
SRC
Reset™ setup time. Refer to
Table 2.
V
SR0, SR1 input voltage low0.3 V
IL
SR0, SR1 input voltage high0.7 V
V
IH
R
1. Valid for ambient operating temperature: TA = –40 to +85 °C; VCC = 1.0 to 5.5 V (except where noted).
2. Typical value is at 25 °C and V
3. For devices with V
4. Guaranteed by design.
5. Input glitch immunity is equal to t
Internal pull-up resistor, SR0,
PUI
SR1
inputs
RST
< 3.0 V.
= 3.3 V unless otherwise noted.
CC
(when both SR inputs are low, otherwise infinite).
SRC
10 x
C
SRC
(µF)
CC
15 x
C
SRC
(µF)
65kΩ
20 x
C
SRC
s
(µF)
V
CC
V
Doc ID 16788 Rev 215/26
Page 16
DC and AC parametersSTM6510
Table 7.Possible VCC voltage thresholds
VCC voltage
threshold V
RST
Typ .
±2.5% (–40 °C to +85 °C)±2.0% (25 °C)
Unit
Min.Max.Min.Max.
L (falling)4.6254.5094.7414.5334.718V
M (falling)4.3754.2664.4844.2884.463V
T (falling)3.0752.9983.1523.0143.137V
S (falling)2.9252.8522.9982.8672.984V
R (falling)2.6252.5592.6912.5732.678V
Z (falling)2.3132.2552.3712.2672.359V
Y (falling)2.1882.1332.2432.1442.232V
W (falling)1.6651.6231.7071.6321.698V
V (falling)1.5751.5361.6141.5441.607V
16/26Doc ID 16788 Rev 2
Page 17
STM6510Package mechanical data
5 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Doc ID 16788 Rev 217/26
Page 18
Package mechanical dataSTM6510
Figure 12. TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package outline
PIN 1 INDEX AREA
0.10 C
0.10
C
A
0.08 C
PIN 1 INDEX AREA
Pin#1 I D
D
2x
0.10 C
2x
TOP VIEW
SIDE VIEW
e
1
A
B
E
C
A1
SEAT ING
PLANE
b
4
0.10 C A B
L
8
BOTTOM VIEW
5
8070540_A
Table 8.TDFN – 8-lead 2 x 2 x 0.75 mm, 0.5 mm pitch package mechanical data
Dimension (mm)Dimension (inches)
Symbol
Min.Nom.Max.Min.Nom.Max.
A0.700.750.800.0280.0300.031
A10.000.020.050.0000.0010.002
b0.150.200.250.0060.0080.010
D
BSC
E
BSC
e0.500.020
L0.450.550.650.0180.0220.026
2.000.079
2.000.079
18/26Doc ID 16788 Rev 2
Page 19
STM6510Package mechanical data
Figure 13. Landing pattern - TDFN – 8-lead 2 x 2 mm without thermal pad
D
P
E1E
L
b
Table 9.Parameter for landing pattern - TDFN – 8-lead 2 x 2 mm package
2All dimensions are in mm, unless otherwise noted.
22/26Doc ID 16788 Rev 2
AM00442
Page 23
STM6510Part numbering
6 Part numbering
Table 12.Ordering information scheme
Example:STM6510WCACDG6F
Device type
STM6510
Reset (V
L = 4.625 V (typ., falling)
M = 4.375 V
T = 3.075 V
S = 2.925 V
R = 2.625 V
Z = 2.313 V
Y = 2.188 V
W = 1.665 V
V = 1.575 V
Smart Reset™ setup delay control (t
Smart Reset™ inputs (SR0
C = 1 to 15 s, user-programmable (external capacitor); 65 kΩ input pull-up
Output type
A = open-drain, active-low
Reset timeout period (t
C = user-programmable (external capacitor)
Package
DG = TDFN8 - 2 x 2 x 0.75 mm, 0.5 mm pitch
Temperature range
monitoring threshold) voltage V
CC
SRC
REC
, SR1)
)
RST
); presence of internal input pull-up on all
6 = –40 °C to +85 °C
Shipping method
®
F = ECOPACK
package, tape and reel
For device options currently available refer to Table 13. For other options, voltage threshold values etc. or
for more information on any aspect of this device, please contact the ST sales office nearest you.
Doc ID 16788 Rev 223/26
Page 24
Package markingSTM6510
7 Package marking
Table 13.Package marking
t
Part name
SRC
delay
control
Smart
Reset™
inputs type
V
RST
Reset
output type
t
REC
programming
Top mark
STM6510WCACDG6FC
STM6510SCACDG6F C
STM6510RCACDG6F C
SRC
SRC
SRC
AL, PUWAL, ODC
AL, PUSAL, ODC
AL, PURAL, ODC
tREC
tREC
tREC
8WK
8SK
8RK
Note:AL = Active-Low, AH = Active-High; PU = with internal pull-up resistor, OD = Open-Drain.
Figure 18. Package marking, top view
A
BC
E
D
Topmark
A = dot (pin 1 reference)
B = assembly plant (P)
C = assembly year (Y, 0-9): 9 = 2009 etc.
D = assembly work week (WW, 01 to 52): 20 = WW20 etc.
E = marking area (topmark)
24/26Doc ID 16788 Rev 2
AM00479
Page 25
STM6510Revision history
8 Revision history
Table 14.Document revision history
DateRevisionChanges
12-Feb-20101Initial release.
Updated title of datasheet, Features, Applications; updated footnote 1
26-Feb-20102
of Table 2; updated Table 6, 12, 13; Figure 3; Section 1.3.3; minor
textual and formatting changes.
Doc ID 16788 Rev 225/26
Page 26
STM6510
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