Derat ing Factor0.43W/
St or a ge Tem perature-65 to 175
stg
Max. Operating Junctio n Temperatur e175
T
j
o
C
o
C
o
C
1/7
Page 2
STK22N06
THERMAL DATA
R
thj-case
R
thj-amb
R
thj-amb
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax ValueUni t
I
AR
E
E
I
AR
Thermal Resistance Junction - cas eMax
Thermal Resistance Junction- ambientMax
Thermal Resistance Case-sinkTyp
Maximum L ead Temperat ur e For Soldering Purpos e
l
Avalanc h e Cu rr ent , Repet itive or Not-R epetitive
(pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng Tj=25oC, ID=IAR,VDD=25V)
Repetitive Avalanc he Energ y
AR
(pulse width limited by Tjmax, δ <1%)
Avalanc h e Cu rr ent , Repet itive or Not-R epetitive
(Tc= 100oC, puls e width limited by Tjmax, δ <1%)
2.31
80
0.7
275
22A
100mJ
25mJ
15A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwise specified)
case
OFF
SymbolParameterTest Condition sMin.Typ.Max.Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS=060V
Break d own Volta ge
I
DSS
I
GSS
Zer o Gate Voltage
Drain Current (V
GS
Gat e- body Leakage
=0)
=MaxRating
V
DS
V
= Max R ating x 0.8 Tc=125oC
DS
250
1000µAµA
VGS= ± 20 V± 100nA
Current (VDS=0)
ON (∗)
SymbolParameterTest Condition sMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID=250µA22.94V
St at ic Drain-s our ce O n
Resistance
On St ate Dra in Current VDS>I
VGS=10V ID=11A
VGS=10V ID=11A Tc= 100oC
D(on)xRDS(on)max
0.0480.065
0.13
22A
VGS=10V
DYNAMIC
SymbolParameterTest Condition sMin.Typ.Max.Unit
(∗)Forward
g
fs
Tr ansconductance
C
C
C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=11A610S
VDS=25V f=1MHz VGS=0700
320
90
900
450
150
Ω
Ω
pF
pF
pF
2/7
Page 3
STK22N06
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest Condition sMin.Typ.Max.Unit
t
d(on)
(di/dt)
Q
Q
Q
Turn-on Time
t
Rise Time
r
Turn-on C urrent SlopeVDD=40V ID=22A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
SymbolParameterTest Condition sMin.Typ.Max.Unit
t
r(Voff)
t
Off -voltage R ise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAIN DIODE
VDD=30V ID=3A
RG=50 ΩVGS=10V
30
90
(see test circuit, figure 3)
230A/µs
RG=50 ΩVGS=10V
(see test circuit, figure 5)
VDD=40V ID=22A VGS=10V26
8
9
VDD=40V ID=22A
RG=50 Ω VGS=10V
(see test circuit, figure 5)
80
80
170
45
130
40nC
120
120
250
ns
ns
nC
nC
ns
ns
ns
SymbolParameterTest Condition sMin.Typ.Max.Unit
I
I
SDM
SD
Source-drain Current
(•)
Source-drain Current
22
88
(pulsed)
V
(∗)For w ar d On Volt ageISD=22A VGS=01.5V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD= 22 Adi/dt = 100 A/µs
VDD=30VTj= 150oC
(see test circuit, figure 5)
80
0.22
Charge
I
RRM
Reverse Recovery
5.5
Current
(∗) Pulsed:Pulse duration = 300 µs, dutycycle 1.5 %
(•) Pulse widthlimited by safeoperating area
Safe Operating AreaThermal Impedance
A
A
ns
µC
A
3/7
Page 4
STK22N06
Derating Curve
Transfer Characteristics
Output Characteristics
Transconductance
Static Drain-source On Resistance
4/7
Gate Charge vs Gate-source Voltage
Page 5
Capacitance VariationsNormalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs TemperatureTurn-on Current Slope
STK22N06
Cross-over TimeTurn-off Drain-source Voltage Slope
5/7
Page 6
STK22N06
Switching SafeOperating AreaAccidental Overload Area
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
Fig. 4: Gate Charge Test Circuit
7/7
Page 8
STK22N06
SOT-82 MECHANICAL DATA
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A7.47.80.2910.307
B10.511.30.4130.445
b0.70.90.0280.035
b10.490.750.0190.030
C2.42.70.040.106
c11.20.047
D15.70.618
e2.20.087
e34.40.173
F3.80.150
H2.540.100
mminch
C
c1
b
b1
A
F
BD
H
e
e3
P032A
8/7
Page 9
SOT-194 MECHANICAL DATA
STK22N06
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A7.47.80.2910.307
B10.511.30.4130.445
b0.70.90.0280.035
b10.490.750.0190.030
C2.42.70.0940.106
c11.20.047
c21.30.051
D60.236
e2.20.087
e34.40.173
F3.80.150
H2.540.100
P45°(typ.)
S40.157
S120.079
T0.10.004
mminch
C
A
F
B
C1
H
D
b1
T
e
SS1
P
b
c2
e3
P032B
9/7
Page 10
STK22N06
Information furnished isbelieved to be accurateand reliable. However, SGS-THOMSONMicroelectronics assumes no responsability for the
consequences of use of suchinformation nor for any infringementof patents orother rights of third parties whichmay results from its use. No
license isgrantedby implicationor otherwiseunderany patentor patentrights ofSGS-THOMSON Microelectronics.Specificationsmentioned
in this publicationare subjectto change without notice.This publication supersedes and replacesall information previouslysupplied.
SGS-THOMSON Microelectronicsproducts are notauthorizedforuse ascriticalcomponentsin lifesupportdevices orsystemswithoutexpress
written approvalof SGS-THOMSON Microelectonics.
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