This series of POWER MOSFETS represents the
most advanced high voltage technology. The optimized cell layout coupled with a new proprietary
edge termination concur to give the device low
R
and gate charge, unequalled ruggedness
DS(on)
and superior switching performance.
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITCH MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES AND MOTOR DRIVE
TO-247
3
2
1
3
2
TO-218 ISOWATT218
1
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STH/STW1 2NA60STH12NA 60FI
V
V
V
I
DM
P
V
T
(•) Pulse width limited by safe operating area
November 1996
Drain-source Voltage (VGS = 0)600V
DS
Drain- gate Voltage (RGS = 20 kΩ)600V
DGR
Gate-source Voltage± 30V
GS
I
Drain Current (continuous) at Tc = 25 oC127A
D
I
Drain Current (continuous) at Tc = 100 oC7.6 4.4A
D
(•)Drain Current (pulsed)4848A
Total Dissipation at Tc = 25 oC19080W
tot
Dera tin g Fact or1.520.64W/
Insulation Withstand Voltage (DC)4000V
ISO
Stor age Tempe rat ure-65 to 15 0
stg
T
Max. Operating Junction Temperature150
j
o
C
o
C
o
C
1/11
Page 2
STH12NA60/FI - STW12NA60
THERMAL DATA
TO-218/TO-247 ISOWA TT218
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax ValueUnit
I
AR
E
E
I
AR
Thermal Resistance Junction-case Max0.661.56
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Max im u m Le ad T em perature F or So l de rin g P ur p ose
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
Sing le Pul se Ava lan che Energy
AS
(starting Tj = 25 oC, ID = IAR, V
Repet iti ve Av alan che En erg y
AR
DD
= 50 V)
(pulse width limited by Tj max, δ < 1%)
Avalanche Current, Repetitive or Not-Repetitive
Information f urnished is believed t o be accurate and reliabl e. However, SGS-T HOMSON Micro electronics a ssumes no re sponsability for the
cons eq ue nce s o f u se o f s uc h i n fo rma ti o n nor f or a ny infrin ge me nt of pa te nt s or o th er r i gh ts o f t hir d pa rti e s w hic h ma y results fro m i t s us e. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as crit ical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.