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查询STB21NM50N供应商
STP21NM50N-STF21NM50N-STW21NM50N
STB21NM50N - STB21NM50N-1
N-CH A NNEL 500V - 0.15Ω - 18A TO-220/FP/D2/I2PAK/TO-247
SECOND GENERATION MDmesh™ MOSFET
Table 1: General Features
TYPE V
STB21NM50N
STB21NM50N-1
STF21NM50N
STP21NM50N
STW21NM50N
■ 100% AVALANCHE TESTED
■ LOW INPUT CAPACITANCE AND GATE
DSS
(@Tjmax)
550 V
550 V
550 V
550 V
550 V
R
DS(on)
< 0.19 Ω
< 0.19 Ω
< 0.19 Ω
< 0.19 Ω
< 0.19 Ω
I
D
18 A
18 A
18 A (*)
18 A
18 A
CHARGE
■ LOW GATE INPUT RESISTANCE
DESCRIPTION
The STx21NM50N is realized with the second
generation of MDmesh Techno logy. This revolu
tionary MOSFET associates a new vertical structure to the Comp any's strip layout to yield one of
the world's lowest on-resistance and gate charge.
It is therefore suitable for the most demanding high
efficiency converters
APPLICATIONS
The MDmesh™ II family is very suitable for increasing power density of high voltage converters
allowing system miniaturization and higher effi
ciencies.
Figure 1: Package
2
TO-247
TO-220
I2PAK
1
2
TO-220FP
2
Figure 2: Internal Schematic Diagram
D
2
PAK
1
2
Table 2: Order Codes
SALES TYPE MARKING PACKAGE PACKAGING
STB21NM50N B21NM50N
STB21NM50N-1 B21NM50N
STF21NM50N F21NM50N TO-220FP TUBE
STP21NM50N P21NM50N TO-220 TUBE
STW21NM50N W21NM50N TO-247 TUBE
D2PAK
I2PAK
TAPE & REEL
TUBE
Rev. 3
1/16 October 2005
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
Table 3: Absolute Maximum ratings
Symbol Parameter Value Unit
TO-220 / D2PAK / I2PAK
/ TO-247
V
DS
V
DGR
V
GS
I
D
I
D
IDM ( )
P
TOT
Drain-source Voltage (VGS = 0) 500 V
Drain-gate Voltage (RGS = 20 kΩ) 500 V
Gate- source Voltage ±25 V
Drain Current (continuous) at TC = 25°C
Drain Current (continuous) at TC = 100°C
18 18 (*) A
11 11 (*) A
Drain Current (pulsed) 72 72 (*) A
Total Dissipation at TC = 25°C
140 30 W
Derating Factor 1.12 0.23 W/°C
dv/dt(1) Peak Diode Recovery voltage slope 15 V/ns
Viso Insulation Winthstand Voltage (DC) -- 2500 V
T
stg
T
Storage Temperature
Max. Operating Junction Temperature
j
–55 to 150
150
( ) Pulse width l i mited by safe operating area
(*) Limited only by maximum temperature allowed
(1) ISD ≤ 18 A, di/dt ≤ 40 0 A / µs, V DD =80% V
(BR)DSS
TO-220FP
°C
Table 4: Thermal Data
TO-220 / D²PAK / I²PAK
/ TO-247
Rthj-case Thermal Resistance Junction-case Max 0.89 4.21 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
Table 5: Avalanche Characteristics
Maximum Lead T emperature For Soldering
l
Purpose
300 °C
Symbol Parameter Max Value Unit
I
AS
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max)
E
AS
Single Pulse Avalanche Energy
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
TO-220FP
9 A
480 mJ
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
Table 6: On/Off
Symbol Parameter Test Conditions Value Unit
Min. Typ. Max.
V
(BR)DSS
Drain-source
ID = 1mA, VGS = 0 500 V
Breakdown Voltage
dv/dt(2) Drain Source Voltage
Vdd=400V, Id=25A, Vgs=10V 44 V/ns
Slope
I
DSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating
1
10
TC = 125 °C
I
GSS
Gate-body Leaka ge
VGS = ± 20V 100 nA
Current (VDS = 0)
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS = VGS, ID = 250 µA 2 3 4 V
Static Drain-source On
VGS = 10V, ID = 9 A 0.150 0.190 Ω
Resistance
(2) Cha rac teristic va l ue at turn off on inductive loa d
Table 7: Dynamic
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(1) Forward Transconductance VDS = 15 V, ID = 9 A
fs
C
oss eq.
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
(*) E quiv alent Outpu t
VDS = 25V, f = 1 MHz, VGS = 0 1950
VGS = 0V, VDS = 0V to 400V 270 pF
Capacitance
t
d(on)
t
d(off)
Q
Q
Q
R
t
r
t
f
g
gs
gd
g
Turn-on Delay Time
Rise Time
Off-voltageRise Time
VDD =250 V, ID = 9 A
RG = 4.7Ω VGS = 10 V
(see Figure 18)
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
VDD = 400V, ID = 18 A,
VGS = 10V,
(see Figure 21)
Gate Input Resistance f=1MHz Gate DC Bias=0
Test Signal Level=20mV
Open Drain
(*) C
is defined as a co nstant equi valent capaci tance giving the same charging time as C
oss eq.
when VDS increases from 0 to 80% V
oss
12 S
420
60
22
18
90
30
65
10
30
1.6 Ω
µA
µA
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
DSS
Table 8: Source Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD (1)
t
rr
Q
rr
I
RRM
t
rr
Q
rr
I
RRM
Note: 1. Puls ed: Pulse du rat i on = 300 µs, d uty cycle 1.5 % .
Source-drain Current
Source-drain Current (pulsed)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 18 A, VGS = 0
ISD = 18 A, di/dt = 100 A/µs
VDD = 100 V, Tj = 25°C
(see Figure 19)
ISD = 18A, di/dt = 100 A/µs
VDD = 100 V, Tj = 150°C
(see Figure 19)
360
5
27
640
6.5
27
18
72
1.5 V
A
A
ns
µC
A
ns
µC
A
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
Figure 3: Safe Operating Area For TO-220
Figure 4: Safe Operating Area For TO-220FP
Figure 6: Thermal Impedance For TO-220
Figure 7: Thermal Impedance For TO-220FP
Figure 5: Output Characteristics
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Figure 8: Transfer Characteristics
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
Figure 9: Transconductance
Figure 10: Gate Charge vs Gate-source Voltage
Figure 12: Static Drain-source On Resistance
Figure 13: Capacitance Variations
Figure 11: Normalized Gate Threshold Voltage
vs Tem pera tur e
Figure 14: Normal ized On R esistance vs Temperature
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
Figure 15: S ource-Drain Forward Char acteristics
Figure 16: Normalized BVdss vs Temperature
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
Figure 17: Unclamped Inductive Load Test Circuit
Figure 18: Switching Times Test Circuit For
Resistive Load
Figure 20: Unclamped Inductive Wafeform
Figure 21: Gate Charge Test Circuit
Figure 19: Test Circuit For Inductive Load
Switching and Diode Recovery Times
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, i n compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at:
www.st.com
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
T APE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
D2PAK MECHANICAL DATA
TO -24 7 M E CHA NICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126
R0 . 4 0 . 0 1 5
V2 0º 4º
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
TO-262 (I2PAK) MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c 0.49 0.70 0.019 0.027
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
E 10 10.40 0.393 0.410
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L2 1.27 1.40 0.050 0.055
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. M AX.
3.75 3.85 0.147 0.151
mm. inch
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
F1
F
G1
H
F2
123
L4
L2
L5
G
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
TO-247 MECHANICAL DATA
DIM.
A 4.85 5.15 0.19 0.20
A1 2.20 2.60 0.086 0.102
b 1.0 1.40 0.039 0.055
b1 2.0 2.40 0.079 0.094
b2 3.0 3.40 0.118 0.134
c 0.40 0.80 0.015 0.03
D 19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e5 . 4 5 0 . 2 1 4
L 14.20 14.80 0.560 0.582
L1 3.70 4.30 0.14 0.17
L2 18.50 0.728
øP 3.55 3.65 0.140 0.143
øR 4.50 5.50 0.177 0.216
S5 . 5 0 0 . 2 1 6
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
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STP21NM50N - STF21NM50N - ST B21NM50N - STB21NM50N-1 - STW21NM50N
Table 9: Revision History
Date Revision Description of Changes
07-Sep-2005 1 First Release.
28-Sep-2005 2 Symbol changed in Table 5
14-Oct-2005 3 Modified curves 5,8
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STP21NM50N - STF21NM50N - STB21NM 50N - STB21NM50N-1 - STW21NM50N
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
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y implicat io n or ot h er wis e under an y pat e nt or pa te nt r igh ts of STMi c roe l ec tro ni c s. Sp ec i fi ca ti on s ment i o ne d in th is p ub li c ati on ar e s ub jec
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