SURFACE-MOU NTING DPAK (TO-252)
POWER PACKAGE IN TA PE & REEL
(SUFFIX "T4")
APPLICATIONS
■
HIGH CURRENT, HIGH SPEED SWITCH ING
■
POWER MOTOR CONTROL
■
DC-DC & DC-AC CONVERTERS
■
SYNCRONOUS RECTIFICATION
3
2
IPAK
TO-251
(Suffix "-1")
1
(Suffix "T4")
1
DPAK
TO-252
INTERNAL SCHEMATIC DIAGRAM
3
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
I
DM
P
dV/dt(
T
(•) Pulse width limited by safe operating area
April 2000
Drain-source Voltage (VGS = 0)100V
DS
Drain- gate Voltage (RGS = 20 kΩ)100V
DGR
Gate-source Voltage± 20V
GS
I
Drain Current (continuous) at Tc = 25 oC9A
D
I
Drain Current (continuous) at Tc = 100 oC6.4A
D
(•)Drain Current (pulsed)36A
Total Dissipation at Tc = 25 oC45W
tot
Derating Factor0.3W/
) Peak Diode Recovery voltage slope7V/ns
1
Storage Temperature-65 to 175
stg
T
Max. Operating Junction Temperature175
j
o
C
o
C
o
C
1/6
Page 2
STD9N10L
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
Thermal Resistance Junction-case Max
Thermal Resistance Junction-ambient Max
Thermal Resistance Case-sink Typ
Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERIST ICS
SymbolParameterMax ValueUnit
I
AR
E
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse Avalanche Energy
AS
(starting T
= 25 oC, ID = IAR, V
j
max)
j
DD
= 25 V)
3.33
100
1.5
275
9A
25mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
= 25 oC unless otherwise specified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID = 250 µA V
= 0100V
GS
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
= 0)
= 0)
= Max Rating
V
DS
V
= Max Rating x 0.8 Tc = 125 oC
DS
= ± 15 V± 100nA
V
GS
10
100
ON (∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage V
Static Drain-source On
Resistance
= VGS ID = 250 µA11.72.5V
DS
VGS = 5V ID = 4.5 A
V
= 10V ID = 4.5 A Tc = 100oC
GS
On State Drain Current VDS > I
V
= 5 V
GS
D(on)
x R
DS(on)max
0.22
0.21
9A
0.27
0.25
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Transconductance
C
C
C
Input Capacitance
iss
Output Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS > I
V
DS
x R
D(on)
DS(on)max
= 25 V f = 1 MHz V
ID = 4.5 A47S
= 0520
GS
90
30
700
120
40
µA
µA
Ω
Ω
pF
pF
pF
2/6
®
Page 3
STD9N10L
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
r
Turn-on Time
Rise Time
V
= 50 V ID = 4.5 A
DD
R
= 4.7 Ω VGS = 5 V
G
10
25
14
35
ns
ns
Q
Q
Q
Total Gate Charge
g
Gate-Source Charge
gs
Gate-Drain Charge
gd
V
= 80 V ID = 9 A V
DD
= 10 V13
GS
5.5
6
18nC
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
r(Voff)
t
t
Off-voltage Rise Time
Fall Time
f
Cross-over Time
c
V
= 80 V ID = 9 A
DD
R
= 4.7 Ω VGS = 5 V
G
10
10
25
14
14
35
SOURCE DRAIN DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
9
36
I
SDM
I
SD
Source-drain Current
(•)
Source-drain Current
(pulsed)
V
(∗)Forward On VoltageISD = 9 A VGS = 01.5V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
I
= 9 A di/dt = 100 A/µs
SD
V
= 25 V Tj = 150 oC
DD
110
0.4
Charge
I
RRM
Reverse Recovery
7.2
Current
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
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