Datasheet STD7NS20-1 Datasheet (SGS Thomson Microelectronics)

Page 1
STD7NS20
STD7NS20-1
N-CHANNEL 200V - 0.35- 7A DPAK / IPAK
MESH O VERL AY™ MOSFET
PRELIMINARY DATA
TYPE V
STD7NS20 STD7NS20-1
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AV ALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
ADD SUFFIX “T4” FOR ORDERING IN TAPE &
DSS
200 V 200 V
(on) = 0.35
R
DS(on)
< 0.40 < 0.40
I
D
7A 7A
REEL
DESCRIPTION
Using the l ate st high voltage MESH OVERLAY™ process, STMicroelectronics has designed an ad­vanced family of power MOSFETs with outstanding performance. The new patented STrip layout cou­pled with the Company’s proprietary edge termina­tion s t ruc ture, makes it suitable in c ov erte rs for lighting applications.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITH MODE POWER SUPPLIES (SMPS)
DC-DC CONVERTERS FOR TELECOM,
INDUSTRIAL, AND LIGHTING EQUIPMENT
3
1
DPAK
TO-252
IPAK
TO-251
INTERNAL SCHEMATIC DIAGRAM
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt (1) Peak Diode Recovery voltage slope 5 V/ns
T
stg
T
j
(•)Pulse width limited by safe operating area
June 2003
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
200 V
200 V Gate- source Voltage ± 20 V Drain Current (continuos) at TC= 25°C Drain Current (continuos) at TC= 100°C
()
Drain Current (pulsed) 28 A Total Dissipation at TC= 25°C
7A
4.4 A
45 W
Derating Factor 0.37 W/°C
Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(1) ISD≤ 7A, di/dt300 A/µs, VDD≤ V
(BR)DSS
,Tj≤T
jMAX
1/8
Page 2
STD7NS20 / STD7NS20-1
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 2.7 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 100 °C/W
T
l
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
Maximum Lead Temperature For Soldering Purpose 275 °C
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
Drain-source
= 25 °C, ID=IAR,VDD=50V)
j
ID= 250 µA, VGS= 0 200 V
7A
60 mJ
Breakdown Voltage
= Max Rating
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
=0)
=0)
V
DS
= Max Rating, TC= 125 °C
V
DS
V
= ±20V ±100 nA
GS
A
10 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
V
DS=VGS,ID
VGS=10V,ID= 3.5 A
= 250µA
234V
0.35 0.40
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 90 pF Reverse Transfer
Capacitance
D(on)xRDS(on)max,
ID= 3.5 A
V
=25V,f=1MHz,VGS=0
DS
4S
540 pF
35 pF
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Page 3
STD7NS20 / STD7NS20-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time 15 ns Total Gate Charge
Gate-Source Charge 7.5 nC Gate-Drain Charge 9 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t t
f
c
Off-voltage Rise Time Fall Time Cross-over Time
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 7 A
(2)
Source-drain Current (pulsed) 28 A
(1)
Forward On Voltage Reverse Recovery Time Reverse Recovery Charge 0.95 µC Reverse Recovery Current 11 A
=100V,ID= 3.5 A
DD
R
= 4.7VGS=10V
G
(see test circuit, Figure 3) V
=160V,ID=18A,
DD
=10V
V
GS
V
= 160 V, ID=7A,
clamp
RG=4.7Ω, VGS= 10V (see test circuit, Figure 5)
ISD= 7 A, VGS=0 I
= 7 A, di/dt = 100A/µs
SD
VDD=50V,Tj= 150°C (see test circuit, Figure 5)
10 ns
31 45 nC
12 12 25
1.5 V
170 ns
ns ns ns
3/8
Page 4
STD7NS20 / STD7NS20-1
Fig. 2: Unclamped Inductive W av eformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
4/8
Page 5
TO-252 (DPAK) MECHANICAL DATA
STD7NS20 / STD7NS20-1
DIM.
A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0
MIN. TYP. MAX. MIN. TYP. MAX.
o
mm inch
o
8
o
0
o
0
P032P_B
5/8
Page 6
STD7NS20 / STD7NS20-1
TO-251 (IPAK) MECHANI CAL DAT A
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
H
6/8
A
C2
L2
E
B2
= =
= =
D
B3
2
1 3
L1
A1
L
B6
C
A3
B
B5
G
= =
0068771-E
Page 7
STD7NS20 / STD7NS20-1
DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
All dimensions
areinmillimeters
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0. 267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476
D 1.5 1.6 0. 059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
2500 2500
7/8
Page 8
STD7NS20 / STD7NS20-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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