Datasheet STD7NS20 Datasheet (SGS Thomson Microelectronics)

Page 1
STD7NS20
N - CHANNEL 200V - 0.35 - 7A - DPAK
MESH OVERLAY MOSFET
PRELIMINARY DATA
TYPICAL R
DS(on)
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
VERY LOW INTRINSIC CAPACITANCES
GATE CHARGE MINIMIZED
FOR TAPE & REEL AND OTHER PACKAGING OPTIONS CONTACT SALES OFFICES
DESCRIPTION
This power MOSFET is designed using the company’s consolidated strip layout-based MESH OVERLAY process. This technology matches and improves the performances compared with standard parts from various sources.
APPLICATIONS
HIGH CURRENT SWITCHING
UNINTERRUPTIBLE PO WER S UPPLY (UPS)
DC/DC COVERTERS FOR TELECOM, INDUSTRIAL, AND LIGHTING EQUIPMENT.
®
INTERNAL SCHEMATIC DIAGRAM
November 1998
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (VGS = 0) 200 V
V
DGR
Drain- gate Voltage (RGS = 20 k)
200 V
V
GS
Gate-source Voltage ± 20 V
I
D
Drain Current (continuous) at Tc = 25 oC7A
I
D
Drain Current (continuous) at Tc = 100 oC4.4A
I
DM
() Drain Current (pulsed) 28 A
P
tot
Total Dissipation at Tc = 25 oC45W Derating Factor 0.37 W/
o
C
dv/dt(
1
) Peak Diode Recovery voltage slope 5 V/ns
T
stg
Storage Temperature -65 to 150
o
C
T
j
Max. Operating Junction Temperature 150
o
C
(•) Pulse width limited by safe operating area (1) ISD ≤ 7A, di/dt ≤ 300 A/µs, VDD ≤ V
(BR)DSS
, Tj ≤ T
JMAX
First Digit of the Datecode Being Z or K Identifies Silicon Characterized in this Dat asheet
TYPE V
DSS
R
DS(on)
I
D
STD7NS20 200 V < 0.40 7 A
1
3
DPAK
TO-252
(Suffix "T4")
1/5
Page 2
THERMAL DATA
R
thj-case
Rthj-am b
R
thc-sink
T
l
Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose
2.7
100
1.5
275
o
C/W
oC/W
o
C/W
o
C
AVALANCHE CHARACTERIST ICS
Symbol Parameter Max Value Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
j
max)
7A
E
AS
Single Pulse Avalanche Energy (starting T
j
= 25 oC, ID = IAR, V
DD
= 50 V)
60 mJ
ELECTRICAL CHARACTERISTICS
(T
case
= 25 oC unless otherwise specified)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
I
D
= 250 µA V
GS
= 0
200 V
I
DSS
Zero Gate Voltage Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating Tc = 125 oC
1
10
µA µA
I
GSS
Gate-body Leakage Current (V
DS
= 0)
V
GS
= ± 20 V
± 100 nA
ON (∗)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= VGS ID = 250 µA
234V
R
DS(on)
Static Drain-source On Resistance
VGS = 10V ID =3.5 A 0.35 0.40
I
D(on)
On State Drain Current VDS > I
D(on)
x R
DS(on)max
V
GS
= 10 V
7A
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
() Forward
Transconductance
VDS > I
D(on)
x R
DS(on)max
ID = 3.5 A 3 4 S
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
V
DS
= 25 V f = 1 MHz V
GS
= 0 540
90 35
700 120
50
pF pF pF
STD7NS20
2/5
Page 3
ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Time Rise Time
V
DD
= 100 V ID = 3.5 A
R
G
= 4.7 Ω VGS = 10 V
(see test circuit, figure 3)
10 15
14 20
ns ns
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
V
DD
= 160 V ID = 18 A V
GS
= 10
V
31
7.5 9
45 nC
nC nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time Cross-over Time
V
DD
= 160 V ID = 7 A
R
G
= 4.7 Ω VGS = 10 V
(see test circuit, figure 5)
12 12 25
17 17 35
ns ns ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(•)
Source-drain Current Source-drain Current (pulsed)
7
28
A A
V
SD
(∗) Forward On Voltage ISD = 7 A VGS = 0 1.5 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
I
SD
= 7 A di/dt = 100 A/µs
V
DD
= 50 V Tj = 150 oC
(see test circuit, figure 5)
170
0.95 11
ns
µ
C
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operating area
STD7NS20
3/5
Page 4
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.9 0.025 0.035 B2 5.2 5.4 0.204 0.212
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 9.35 10.1 0.368 0.397
L2 0.8 0.031 L4 0.6 1 0.023 0.039
==
D
L2
L4
1 3
==
B
E
==
B2
G
2
A
C2
C
H
A1
DETAIL "A"
A2
DETAIL "A"
TO-252 (DPAK) MECHANICAL DATA
0068772-B
STD7NS20
4/5
Page 5
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such inform ation nor for any in fringe ment o f patents or other rig hts of third par ties wh ich may result from its u se. N o li cen se is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized f or use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 1998 STMicroelectro nics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
http://www.st.com
.
STD7NS20
5/5
Loading...