Datasheet STP5NK40ZFP, STD5NK40ZT4, STD5NK40Z-1, STD5NK40Z Datasheet (SGS Thomson Microelectronics)

Page 1
1/13February 2003
STP5NK40Z - STP5NK40ZFP
STD5NK40Z - STD5NK40Z-1
N-CHANNEL 400V - 1.47- 3A TO-220/TO-220FP/DPAK/IPAK
Zener-Protected SuperMESH™Power MOSFET
TYPICAL R
DS
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
GAT E CHARGE MINIMIZED
VERY LOW INTRINSIC CAPACITANCES
VER Y GO OD MANUFACTURING
REPEATIBILITY
DESCRIPTION
The SuperME SH™ series is obtained through an extreme optimization of S T’s well established strip­based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special careis tak­en to ensure a very good dv/dt capability for the most demanding applications. Such series com ple­ments ST full range of high voltage MOSFETs in­cluding revolutionary MDm es h™ products.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
IDEAL FOR OFF-LINE POWER SUPPLIES,
ADAPTORS AND PFC
LI GHTING
ORDERING INFORMATION
TYPE V
DSS
R
DS(on)
I
D
Pw
STP5NK40Z STP5NK40ZFP STD5NK40Z STD5NK40Z-1
400 V 400 V 400 V 400 V
< 1.8 < 1.8 < 1.8 < 1.8
3A 3A 3A 3A
45 W 20 W 45 W 45 W
SALES TYPE MARKING PACKAGE PACKAGING
STP5NK40Z P5NK40Z TO-220 TUBE STP5NK40ZFP P5NK40ZFP TO-220FP TUBE STD5NK40ZT4 D5NK40Z DPAK TAPE & REEL
STD5NK40Z-1 D5NK40Z IPAK TUBE
TO-220 TO-220FP
1
2
3
1
3
DPAK
3
2
1
IPAK
INTERNAL SCHEMATIC DIAGRAM
Page 2
STP5NK40Z - STP5NK40ZFP - STD5NK40Z - STD5NK40Z -1
2/13
ABSOLUTE MAXIMUM RATINGS
() Pulse width limited by safe operating area (1) I
SD
3A, di/dt 200A/µs, VDD≤ V
(BR)DSS,Tj≤TJMAX.
(*) Limited only by maximum temperature allowed
THERMAL DATA
AVALANCHE CHARACTERISTICS
GATE-SOURCE ZENER DIODE
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed t o enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’ s integrity. These integ rated Zener diodes thus avoid the usage of external components.
Symbol Parameter Value Unit
STP5NK40Z STP5NK40ZFP
STD5NK40Z
STD5NK40Z-1
V
DS
Drain-source Voltage (VGS=0)
400 V
V
DGR
Drain-gate Voltage (RGS=20kΩ)
400 V
V
GS
Gate- source Voltage ± 30 V
I
D
Drain Current (continuous) at TC= 25°C
3 3 (*) 3 A
I
D
Drain Current (continuous) at TC= 100°C
1.9 1.9 (*) 1.9 A
I
DM
()
Drain Current (pulsed) 12 12 (*) 12 A
P
TOT
Total Dissipation at TC= 25°C
45 20 45 W
Derating Factor 0.36 0.16 0.36 W/°C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5KΩ) 2800 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
V
ISO
Insulation Withstand Voltage (DC) - 2500 - V
T
j
T
stg
Operating Junction Temperature Storage Temperature
-55to150
-55to150
°C °C
TO-220 TO-220FP DPAK
Rthj-case Thermal Resistance Junction-case Max 2.77 6.25 2.77 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 100 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose
300 °C
Symbol Parameter Max Value Unit
I
AR
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
j
max)
3A
E
AS
Single Pulse Avalanche Energy (starting T
j
= 25 °C, ID=IAR,VDD=50V)
130 mJ
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown Voltage
Igs=± 1mA (Open Drain) 30 V
Page 3
3/13
STP5NK40Z - STP5NK 40Z FP - STD5NK40Z - STD5NK40Z-1
ELECTRICAL CHARACTERISTICS (T
CASE
=25°C UNLESS OTHERWISE SP ECIFIED)
ON/OFF
DYNAMIC
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when VDSincreases from 0 to 80%
V
DSS
.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
ID=1 mA, VGS= 0 400 V
I
DSS
Zero Gate Voltage Drain Current (V
GS
=0)
V
DS
= Max Rating
VDS= Max Rating, TC= 125 °C
1
50
µA µA
I
GSS
Gate-body Leakage Current (V
DS
=0)
V
GS
= ± 20V ±10 µA
V
GS(th)
Gate Threshold Voltage
V
DS=VGS,ID
= 50µA
3 3.75 4.5 V
R
DS(on)
Static Drain-source On Resistance
VGS=10V,ID= 1.5 A 1.47 1.8
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(1) Forward Transconductance VDS=15 V,ID= 1.5 A 2.2 S
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
V
DS
=25V,f=1MHz,VGS= 0 305
57
11.5
pF pF pF
C
oss eq.
(3) Equivalent Output
Capacitance
VGS=0V,VDS= 0V to 400V 44 pF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
t
r
Turn-on Delay Time Rise Time
VDD=200V,ID= 1.5 A RG= 4.7VGS=10V (Resistive Load see, Figure 3)
9.2 6
ns ns
Q
g
Q
gs
Q
gd
Total Gate Charge Gate-Source Charge Gate-Drain Charge
V
DD
=320V,ID=3A,
V
GS
=10V
11.7
2.8
5.8
17 nC
nC nC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off Delay Time Fall Time
VDD= 200 V, ID= 1.5A R
G
=4.7ΩVGS=10V
(Resistive Load see, Figure 3)
22.5 11
ns ns
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time Cross-over Time
V
DD
= 320V, ID=3A, RG=4.7Ω, VGS= 10V (Inductive Load see, Figure 5)
8.5
7.5
14.5
ns ns ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
(2)
Source-drain Current Source-drain Current (pulsed)
3
12
A A
VSD(1)
Forward On Voltage
ISD= 3 A, VGS=0
1.6 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
I
SD
= 3 A, di/dt = 100A/µs VDD=40V,Tj= 150°C (see test circuit, Figure 5)
145 464
6.4
ns
nC
A
Page 4
STP5NK40Z - STP5NK40ZFP - STD5NK40Z - STD5NK40Z -1
4/13
Thermal Impedan ce For TO-220/DPAK/IPAK
Output Characteristics
Safe Operating Area For TO-220FPSafe Operating Area For TO-220/DPAK/IPAK
Thermal Impedance For TO-220F P
Transfer Characteristics
Page 5
5/13
STP5NK40Z - STP5NK 40Z FP - STD5NK40Z - STD5NK40Z-1
Normalized Gate Threshold Voltage vs Temp. Normalized On Resistance vs Temperature
Capacitance VariationsGate Charge vs Gate-so urce Voltage
Static Drain-source On ResistanceTransconductance
Page 6
STP5NK40Z - STP5NK40ZFP - STD5NK40Z - STD5NK40Z -1
6/13
Source-drain Diode Forward Characteristics Normalized BVDSS vs Temperature
Maximum Avalanche Energy vs Temperature
Page 7
7/13
STP5NK40Z - STP5NK 40Z FP - STD5NK40Z - STD5NK40Z-1
Fig. 5: Test Circuit For Induct ive Load Switching
And Diode Recovery T imes
Fig. 4: Gate Charge test Circuit
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Page 8
STP5NK40Z - STP5NK40ZFP - STD5NK40Z - STD5NK40Z -1
8/13
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
L6
A
C
D
E
D1
F
G
L7
L2
Dia.
F1
L5
L4
H2
L9
F2
G1
TO-220 MECHANICAL DATA
P011C
Page 9
9/13
STP5NK40Z - STP5NK 40Z FP - STD5NK40Z - STD5NK40Z-1
L2
A
B
D
E
H
G
L6
¯
F
L3
G1
123
F2
F1
L7
L4
L5
DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.5 0.045 0.067 F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
TO-220FP MECHANICAL DATA
Page 10
STP5NK40Z - STP5NK40ZFP - STD5NK40Z - STD5NK40Z -1
10/13
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213
C 0.45 0.60 0.018 0.024
C2 0.48 0.60 0.019 0.024
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.252 0.260
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0
o
8
o
0
o
0
o
P032P_B
TO-252 (DPAK) MECHANICAL DATA
Page 11
11/13
STP5NK40Z - STP5NK 40Z FP - STD5NK40Z - STD5NK40Z-1
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
A
C2
C
A3
H
A1
D
L
L2
L1
1 3
= =
B3
B
B6
B2
E
G
= =
= =
B5
2
TO-251 (IPAK) MECHANICAL DATA
0068771-E
Page 12
STP5NK40Z - STP5NK40ZFP - STD5NK40Z - STD5NK40Z -1
12/13
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
DPAK FOOTPRINT
* on sales ty pe
DIM.
mm inch
MIN. MAX. MIN. MAX.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881
BASE QTY BULK QTY
2500 2500
REEL MECHANICAL DATA
DIM.
mm inch
MIN. MAX. MIN. MAX.
A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
TAPE MECHANICAL DATA
All dimensions
areinmillimeters
All dimensions are in millimeters
Page 13
13/13
STP5NK40Z - STP5NK 40Z FP - STD5NK40Z - STD5NK40Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
© The ST logo is a registered trademark of STMicroelectronics
© 2003 STMicroelectronics - Printed in Italy - All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco
Singapore - Spain - Sweden - Switzerland - United Kingdom - United States.
© http://www.st.com
Loading...