Derat ing Factor0.36W/
Sto rage Tem perature-65 to 150
stg
T
Max. Operat ing Junc tion Tem per ature150
j
o
o
o
C
C
C
1/10
Page 2
STD5N20
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax ValueUnit
I
AR
E
Ther mal Resistanc e Junct ion-caseMax
Ther mal Resistanc e Junct ion-ambie ntMax
Ther mal Resistanc e Case-sinkTy p
Maximum Lead Tem pera tu r e For Soldering Purpose
l
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
Single Pulse A v alan che Ener gy
AS
(starting T
=25oC, ID=IAR,VDD=50V)
j
max,)
j
2.77
100
1.5
275
5A
130mJ
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS= 0200V
Break dow n Volt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gat e- bod y Leakage
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc=125oC
V
DS
V
=± 20 V
GS
10
100
100nA
±
ON(∗)
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage VDS=VGSID= 250 µA234V
Sta t ic Drain-sour c e On
VGS=10V ID= 2.5 A0.70.8
Resistance
I
D(on)
On State Drain Current VDS>I
D(on)xRDS(on)ma x
5A
VGS=10V
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci tanc e
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on)ma xID
=2.5A1.53S
VDS=25V f=1MHz VGS= 0450
75
15
600
100
20
µ
µA
Ω
pF
pF
pF
A
2/10
Page 3
STD5N20
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
t
d(on)
t
r
Turn-on Time
Rise T ime
VDD=100VID=2.5A
R
=4.7
G
Ω
VGS=10V
7
6
10
8
(see test circuit, figure 3)
(di/dt)
Tur n-on Current SlopeVDD=160VID=5A
on
R
G
=47
Ω
VGS=10V
400A/µs
(see test circuit, figure 5)
Q
Q
Q
Tot al Gate Char ge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD= 160 VID=5A VGS=10V18
6
7
25nC
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
t
r(Voff)
t
t
Off-voltage Ris e Time
Fall T ime
f
Cross-over Tim e
c
VDD=160V ID=5A
=4.7 Ω VGS=10V
R
G
(see test circuit, figure 5)
15
7
5
10
7
20
SOURCEDRAINDIODE
SymbolParameterTest ConditionsMin.Typ.M ax.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed:Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safeoperating area
Source-drain Current
(•)
Source-drain Current
5
20
(pulsed)
(∗)ForwardOnVoltage ISD=5A VGS=01.5V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD= 5 Adi/dt = 100 A/µs
= 100 VTj=150oC
V
DD
(see test circuit, figure 5)
180
1125
Charge
Reverse Recovery
12.5
Current
ns
ns
nC
nC
ns
ns
ns
A
A
ns
nC
A
SafeOperating AreaThermalImpedance
3/10
Page 4
STD5N20
DeratingCurve
TransferCharacteristics
OutputCharacteristics
Transconductance
Static Drain-sourceOn Resistance
4/10
Gate Charge vs Gate-sourceVoltage
Page 5
STD5N20
CapacitanceVariations
NormalizedOn Resistancevs Temperature
NormalizedGate ThresholdVoltage vs
Temperature
Turn-onCurrent Slope
Turn-offDrain-source VoltageSlope
Cross-overTime
5/10
Page 6
STD5N20
SwitchingSafe Operating Area
Source-drainDiode Forward Characteristics
AccidentalOverloadArea
Fig. 1:
6/10
UnclampedInductiveLoad TestCircuit
Fig. 2:
UnclampedInductiveWaveform
Page 7
STD5N20
Fig. 3:
SwitchingTimes Test CircuitsFor
ResistiveLoad
Fig. 5: Test Circuit For Inductive Load Switching
AndDIode RecoveryTimes
Information furnished is believed tobe accurateand reliable.However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationmentioned in this publicationare
subjecttochange without notice. This publicationsupersedesandreplaces all information previouslysupplied.STMicroelectronics products
are not authorized for use as critical components in life support devices or systemswithout express written approval of STMicroelectronics.
The STlogo is a trademark ofSTMicroelectronics
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STMicroelectronics GROUP OF COMPANIES
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