This applicationspecific Power Mosfet is the third
generation of STMicroelectronics unique ”Single
Feature Size” strip-based process. The resulting transistor shows the best trade-off between
on-resistance and gate charge. When used as
high and low side in buck regulators, it gives the
best performancein termsof both conductionand
switching losses. This is extremely important for
motherboardswhere fast switching and high efficiencyare of paramount importance.
R
DS(on)
TRADE-OFF
I
D
Ω
- 70AD2PAK
PRELIMINARY DATA
3
1
D2PAK
TO-263
ADD SUFFIX ”T4” FOR ORDERING IN TAPE & REEL
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ SPECIFICALLYDESIGNEDAND
OPTIMISEDFOR HIGH EFFICIENCY CPU
CORE DC/DC CONVERTERS
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
V
V
V
I
DM
P
T
(•) Pulse width limited by safeoperating area
Dra in- sour c e Volt age ( VGS=0)20V
DS
Dra in- gate V ol t age ( RGS=20kΩ)20V
DGR
Gat e-source Voltage
GS
I
Dra in C u rr ent (c ontinuous) at Tc=25oC70A
D
I
Dra in C u rr ent (c ontinuous) at Tc=100oC50A
D
(•)Dra in Current ( p uls ed )280A
Tot al Dis s ipation at Tc=25oC100W
tot
Der ati ng Fac t or0.67W/
St orage Tempe rat ure-65 t o 175
stg
T
Max. O perating Junc t ion T emperat ure175
j
20V
±
o
C
o
C
o
C
20/01/2000
1/6
Page 2
STB70NF02L
THERMAL DATA
R
thj-case
R
thj-amb
T
Ther mal Resistanc e Junct ion-caseMax
Ther mal Resistanc e Junct ion-ambientMax
Maximum Lead Tem pe ra tur e For Solder ing Purpose
l
1.5
62.5
300
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
ID=250µAVGS=020V
Break dow n V o lt age
I
DSS
I
GSS
Zero Gate Voltage
Drain Cur re nt ( V
GS
Gat e- bod y L eakage
Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRatingTc=125oC
V
DS
V
= ± 20 V± 100nA
GS
1
10
ON(∗)
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Volt age VDS=VGSID= 250 µA12.5V
Sta t ic Drain -s ource On
Resistance
On State Drain Current VDS>I
VGS=10VID=35A
V
=5VID=18A
GS
D(on)xRDS(on )max
0.006
0.011
0.009
0.015
70A
VGS=10V
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capac i t ance
iss
Out put Capacitance
oss
Reverse Tr ansfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=35 A40S
VDS=25V f=1MHz VGS= 01500
900
200
µA
µ
Ω
Ω
pF
pF
pF
A
2/6
Page 3
STB70NF02L
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
t
Tur n-on Delay Time
Rise Ti me
r
VDD=10VID=35A
R
=4.7
G
Ω
VGS=4.5V
25
480
(Resis t iv e Loa d, s ee fig. 3)
Q
Q
Q
Tot al Gat e Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD=16V ID=46A VGS=10V36
5
10
45nC
SWITCHING OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(off)
Tur n-of f Delay Time
t
Fall T ime
f
VDD=10VID=35A
R
=4.7
G
Ω
VGS=4.5V
30
110
(Resis t iv e Loa d, s ee fig. 3)
SOURCEDRAINDIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
(∗) Pulsed:Pulse duration = 300µs, duty cycle 1.5%
(•) Pulse width limited by safe operating area
Source-drain Current
(•)
Source-drain Current
70
280
(pulsed)
(∗)ForwardOnVoltage ISD=70 AVGS=01.2V
Reverse Recovery
rr
Time
Reverse Recovery
rr
ISD= 70 Adi/dt = 100 A /µs
=15VTj=150oC
V
DD
(see test circuit, fig. 5)
60
100
Charge
Reverse Recovery
2
Current
ns
ns
nC
nC
ns
ns
A
A
ns
nC
A
3/6
Page 4
STB70NF02L
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For
ResistiveLoad
Information furnishedis believed to be accurateand reliable.However, STMicroelectronics assumes no responsibilityfor the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may resultfrom its use. No licenseis
granted by implication or otherwise under any patent or patentrights of STMicroelectronics. Specificationmentioned in this publicationare
subjecttochange withoutnotice.Thispublication supersedes andreplaces all informationpreviously supplied.STMicroelectronicsproducts
are not authorized for use as critical components in lifesupportdevices or systems without express written approval of STMicroelectronics.
The STlogo is a trademark of STMicroelectronics
1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
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6/6
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