Datasheet STB7003 Datasheet (SGS Thomson Microelectronics)

• SUPPLY VOLTAGE 2.8V

S

• LOW CURRENT CONSUMPTION

• VERY LOW NOISE FIGURE:

NF=1.5dB @ 950MHz
NF=1.9dB @ 1850MHz
NF=2dB @ 1950MHz

• DIGITAL GAIN CONTROL

APPLICATIONS

TRI-BAND GSM/DCS/PCS FRONT-ENDS

STB7003

TRI-BAND GSM/DCS/PCS LNA

MSOP10-EP

(exposed pad)

ORDER CODE

STB7003

FUNCTIONAL BLOCK DIAGRAM

BRANDING

7003

DESCRIPTION

PD

The STB7003 is a tri-band LNA designed for GSM/DCS/
PCS applications. The GC pin sets the LNA gain levels.

AI1

LNA 1

The innovative architecture implemented allows to
reach very low current consumption. LNA1 works at

0.9-1.0 GHz and LNA2 over the 1.8-2GHz frequency

GND

BIAS

range.

AI2

BSW

LNA2

ABSOLUTE MAXIMUM RATING

Symbol Parameter Value Unit

Vcc Supply voltage 4.5 V

Tj Junction temperature 150

T

stg

Storage temperature -40 to +85 °C

THERMA L D ATA

Symbol Parameter Value Unit

R

th(j-a)

Thermal resistance junction- ambi ent TBD

o

C/W

GC

AO1

GSM

Vcc

AO2

DC

Vcc

o

C

1/9January, 22 2002

STB7003

ELECTRICAL CHARACTERISTICS (Vcc = 2.8V, Tamb= 25 oC)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Vcc Supply voltage 2.7 3.3 V

I

PD

LNA1 @ 950MHz

Icc Supply current 4.5 mA

G Power gain

NF

P1dB

IIP3

VSWRi Input VSWR 2:1

VSWRo Output VSWR 2:1

LNA2 @ 1850MHz

Icc Supply current 7.3 mA

G Power gain

NF Noise figure

P1dB

IIP3

VSWRi Input VSWR 2:1

VSWRo Output VSWR 2:1

Sleep supply current 5 uA

(1)

Noise figure

Input 1 dB compr.

power

Input third order

intercept

Input 1 dB compr.

power

Input third order

intercept

G

p1

(1)

G

p2

G

p1

G

p2

G

p1

G

p2

(2)

G

p1

(2)

G

p2

(1)

G

p1

(1)

G

p2

G

p1

G

p2

G

p1

G

p2

(3)

G

p1

(3)

G

p2

-1

16

5.5

1.5

-19

-21

-10.8

-12.6

-4

14.7

9.6

1.9

-11.5

-13.1

-1.4

-3.5

dB

dB

dBm

dBm

dB

dB

dBm

dBm

LNA2 @ 1950MHz

Icc Supply current 7.3 mA

(1)

G

G Power gain

NF Noise figure

P1dB

IIP3

Input 1 dB compr.

power

Input third order

intercept

p1

(1)

G

p2

G

p1

G

p2

G

p1

G

p2

(4)

G

p1

(4)

G

p2

VSWRi Input VSWR 2:1

VSWRo Output VSWR 2:1

Note(1) : Gp1 min gain, Gp2 max gain.
Note(2) : Measured data with two tones f
Note(3) : Measured data with two tones f
Note(4) : Measured data with two tones f

= 945 MHz, f

IN1

= 1850 MHz, f

IN1

= 1960 MHz, f

IN1

= 945.8 MHz, P

IN2

= 1850.8 MHz, P

IN2

= 1960.8 MHz, P

IN2

= - 33 dBm for each tone

IN

= - 33 dBm fo r each tone

IN

= - 33 dBm fo r each tone

IN

2/9

-4.5

14.7

9.8
2

-10.8

-12.6

-1.5

-3.7

dB

dB

dBm

dBm

GAIN SELECTI ON

BSW GC

0 0 High gain Off
0 1 Low gain Off
1 0 Off High gain
1 1 Off Low gain

GSM

LNA1

DCS/PCS

LNA2

PINOUT

Pin Number Symbol Description

1 PD Power down
2 AI1 GSM LNA1 input
3 GND Ground
4 AI2 DCS/PCSl LNA2 input
5 BSW Band switch between GSM and DCS/PCS RF output
6
7 AO2 DCS/PCS LNA2 output

Vcc

DCS

DCS Supply voltage

STB7003

8
9 AO1 GSM LNA1 output

10 GC LNA1/2 gain control

Vcc

GSM

GSM/BiAS Supply voltage

3/9

STB7003

)

0

)

TYPICAL PERFORMANCE (GSM BAND)

Power Gain vs. Frequency Noise Figure vs. Frequency

Power Gain vs. Frequency

20

High Gain

15

10

5

S21(Log Mag) (dB

0

Low Gain

-5
800 820 840 860 880 900 920 940 960 980 1000

FREQUENCY (MHz)

Input Return Loss vs. Frequency

0

-2

-4

-6

-8

-10

RETURN LOSS (dB)

-12

-14
800 820 840 860 880 900 920 940 960 980 100

HIgh Gain

Low Gain

FREQUENCY (MHz)

7
6
5
4

NF (dB)

3
2

1
920 930 940 950 960 970

Output Return Loss vs. Frequency

0

-5

-10

-15

RETURN LOSS

-20

0

-25
800 820 840 860 880 900 920 940 960 980 1000

Low Gain

High Gain

Frequency (MHz)

High Gain

Low Gain

FREQUENCY (MH z)

Reverse Isolation vs. Frequency

-40

-41

-42

-43

-44

-45

-46

S21(Log Mag) (dB

-47

-48
800 820 840 860 880 900 920 940 960 980 1000

4/9

HIgh Gain

Low Gain

FREQUENCY (MHz)

TYPICAL PERFORMANCE (DCS / PCS BAND)

)

)

Power Gain vs. Frequency

STB7003

Noise Figure vs. Frequency

20

15

High Gain

10

5

0

S21(Log Mag) (dB

-5

Low Gain

-10
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000

FREQUENCY (MHz)

Input Return Loss vs. Frequency

0

-2

-4

-6

-8

-10

-12

RETURN LOSS

-14

-16

-18

-20

1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000

High Gain

Low Gain

FREQUENCY (MHz)

11

10

Low Gain

9
8
7
6

NF (dB)

5
4
3

High Gain

2

1

1800 1850 1900 1950 2000

FREQUENCY (MHz)

Output Return Loss vs. Frequency

0

-2

-4

-6

-8

RETURN LOSS (dB)

-10

-12
1800 1820 1840 1860 1880 1900 1920 1940 1960 1980 2000

High Gain

Low Gain

FREQUENCY (MHz)

Reverse Isolation vs. Frequency

-35

-36

-37

-38

-39

-40

-41

-42

S12 (Log Mag) (dB

-43

-44
18001820184018601880190019201940196019802000

High Gain

Low Gain

FREQUENCY (MHz)

5/9

STB7003

TEST CIRCUIT SCHEMATIC

J1
SMA_in900

C4

0.5p

S1

SW SPDT

C3
2p2

L2

2n7

S2

SW SPDT

L1

12n

C5
10n

VCC

J2

SMA in1800

VCC

C2
10n

U1

PD

GC

AI1

AO1

GND

VCC

AI2

AO2

BSW VCClna

STB7003

12

L3
5n1

R1
510

C6
10n

JP1

VCC

2 HEADER

L5
4n3

1
2

J3

SMA

J4

SMA

R3

130

VCC

C14

C9
10n

VCC

C10

L7

110n

L8

68n

C12

10n

L4
110n

n/c

470p

S3
SW SPDT

C8
100p

C11

n/c

R2
0

C13
33p

C15
12p

C1
4u7

VCC

C7

4p

C17

2p

L6
1n

VCC

VCC

BILL OF MATERIAL

Used Part Type Designator Footprint Description

1 12n L1 0603 COILCRAFT KIT C124-2
1 2n7 L2 0603 COILCRAFT KIT C124-2
1 5n1 L3 0603 COILCRAFT KIT C124-2
2 110n L4, L7 0603 COILCRAFT KIT C124-2
1 4n3 L5 0603 COILCRAFT KIT C124-2
1 1n L6 0402 COILCRAFT KIT C128
1 68n L8 0603 COILCRAFT KIT C124-2
1 1u C1 TAG A
6 10n C2, C5, C6 0603 MURATA 0603 KIT

C9, C14
1 2p2 C3 0603 MURATA 0603 KIT
1 0.5p C4 0603 MURATA 0603 KIT
1 4p C7 0603 MURATA 0603 KIT
1 100p C8 0603 MURATA 0603 KIT
1 470p C10 0603 MURATA 0603 KIT
2 n/c C11, C12 0603
1 33p C13 0603 MURATA 0603 KIT
1 12p C15 0603 MURATA 0603 KIT
1 2p C17 0603 MURATA 0603 KIT
1 510 R1 0603
1 0 R2 0603
1 130 R3 0603

6/9

EVALUATION BOARD

STB7003

TOP LAYER

COMPONENTS PLACEMENT

37mm

27mm

PCB CROSS SECTION

0.01 inch/0.25 m m

0.01 inch/0.25 m m

0.02 inch/0.5m m

0.02 inch/0.5m m
Layer for m e ch anical rigidity of PC B

Layer for m e ch anical rigidity of PC B

Top Layer

Top Layer

Internal La yer ( Ground Layer)

Internal La yer ( Ground Layer)

Bottom La yer

Bottom La yer

7/9

STB7003

MECHNANICAL DATA

8/9

STB7003

p

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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
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