Datasheet STB5610 Datasheet (SGS Thomson Microelectronics)

• ONE CHIP SYSTEM TO INTERFACE GPS

ANTENNA TO GPS MICRO CONTROLLER

• ABLE TO SUPPORT ACTI VE AND PASSIVE
ANTENNA

• MINIMUM EXTERNAL COMPONENTS

• COMPATIB LE WITH GPS L1 SPS SIGNAL AN D

GALILEO FREQU ENCIES

• CMOS OUTPUT LEVELS

• 2.7 V .. 3.6 V SUPPLY VO LTAGE

• EMBEDDED LOW PHASE NOISE PLL

• ACTIVE ANTENNA SENSOR

• SMART CHIP ENABLE FUNCTION FOR POWER

CONSUMPTION OPTIMIZATION

• ESD PROTECTED

STB5610

GPS RF FRONT-END IC

PRELIMINARY DATA

TQFP48

ORDER CODE

STB5610

BRANDING

STB5610

DESCRIPTION

The STB5610, using ST Microelectronics RF Bipolar
technology, implements a Global Positioning System
RF front-end. The chip provides down conversion
from the 1575.42 MHz GPS (L1) signal to 4.092 MHz
Output signal. The integrated PLL with on-chip
reference oscillator uses a low cost 16.368 MHz
crystal. No TCXO is required.

PIN CONNECTION

XTAL_out

R
F
+

L
A

n

i

T

F

_

X

I

L

_

_

A

d

c

c

n

T

V

X

G

LNA_out+

Gnd_RF

RF-

V
c

c

_
R
F

Vcc_XTAL

Vcc_Logic

Vcc_VCO

Gnd

TNK1
TNK2

Gnd
Gnd
IF1+

IF1­Gnd

L
A
T
X
_
d
n
G

47 46 45 44 434241 40 39 38

47 46 45 44 434241 40 39 38 37

47 46 45 44 434241 40 39 38

47 46 45 44 434241 40 39 38

48

48

48

48

1

1
2

2
3

3

LF

4

4
5

5
6

6
7

7
8

8
9

9
10

10
11

11
12

13 14 15 16 17 18 19 20 21 22 23 24

Gnd_RF

F

I
_

-

d

2

n

F

I

G

IF2+

L

V

N

c

c

A

_

_

L

o

N

u

A

t

-

E
C

Gnd_IF

Fselect

CE2

36

Vcc_Logic2

35

Gnd

34

DATA

33

CLK

32

Gnd_Driver

31

Vcc_Driver

30

Gnd_Loic

29

Vcc_Logic

28

AS1

27

AS2

26

As_out

25

GC

G

LNA_in+

L

G

N

n

d

n

A

d
_

i

n

-

May, 7 2002

1/11

STB5610

PIN CONFIGURATION

PIN Symbol Typ. DC Bias Description External Circuit

1 Vcc_XTAL Power supply
2 Vc c_Lo gic P ower suppl y
3 LF Loop filter
4 Vcc_VCO Power supply
5 Gnd Ground
6 TNK1 Tank Input
7 TNK2 Tank Input
8 Gnd Ground

9 Gnd Ground
10 IF1+ Mixer Output
11 IF1- Mixer Output
12 Gnd Ground
13 Gnd_RF Ground
14 RF+ RF amp. input
15 RF- RF amp. input
16 Gnd_RF Ground
17 Vcc_ RF Power supply
18 LNA_Out+ LNA output
19 LNA_Out- LNA output
20 Vcc_LNA Power supply
21 Gnd_L NA Ground
22 LNA_in+ LNA input
23 LNA_in- LNA input
24 Gnd_LNA Ground

2/11

PIN CONFIGURATION

PIN Symbol Typ. DC Bias Description External Circuit

25 GC LNA Gain control
26 AS_Out Antenna sensor output
27 AS2 Antenna sensor input
28 AS1 Vcc Antenna Supply
29 Vc c_Lo gic P ower suppl y
30 Gnd_Logic Ground
31 Vcc_Driver Supply Voltage
32 Gnd_Driver Ground
33 CLK Clock
34 DATA Data
35 Gnd Ground
36 Vcc_Logic2 Supply Voltage
37 CE2 Chip Enable (no data)
38 CE Chip Enable
39 Fselect Frequency Selector
40 Gnd_IF Ground
41 IF2- Lim. Amp. Output
42 IF2+ Lim. Amp. Output
43 Gnd_IF Ground
44 Vcc_IF Supply Voltage
45 Gnd_XTAL Ground
46 XTAL_in Crystal Input
47 XTAL_out Crystal Output
48 Gnd_XTAL Ground

STB5610

3/11

STB5610

BLOCK DIAGRAM (GPS L1)

SAW F ilt e r

Passive
Antenna

Two gain

LNA

Gain

Select.

16.368 MHz
Quartz

1.57 GHz

PLL

LC Filter

RF Amp. Mixer D Latc h Output buffer

1.55 GHz

VCO

~

LC Filter

1ST Lim. amp. 2ND Lim. amp.

20 MHz

20 MHz

D

Q

CK

4 MHz

16 MHz

Data @ 4 MHz
CMOS levels

CLK @ 16MHz
CMOS levels

Loop

Freq.

Filter

select

ExternalTank

FUNCTIONAL DESCRIPTION

LNA section

The RF input signal is amplified by two gain levels
LNA. Using gain control pin the LNA gain is set to
19 dB to support passive antenna or 10 dB to sup­port active antenna. The LNA ou tput signal i s fil­tered by 1575.42 MHz SAW filter.

RF Amplifier plus mixer section

The 1575.42 MHz input signal, amplified by RF
amp., is mixed with the VCO signal to generate a
differential 20.46MHz IF signal

IF section

Two LC filters at mixer output and at first limiting
output are used to s uppress undesirab le signals
and mixer products. The second stage limiting
amplifier is connected to a D-Type latch clocked
by 16.368MHz crystal oscillator signal. The effect
of sampling the 20.46MHz signal at 16.368MHz is
to create sub-sampling alias at 4.092MHz. This is
fed to the output level converter.

Output section

The output buffers perform level translation from
the internal ECL levels to CMOS output levels re­ferred to ground. The Data signal changes during
the clock signal negative edge.

CE

ASout

CE2

VCO and PLL

Using external tank the VCO is able to provide
very low phase noise signal. Through the freq. se­lector pin the VC O signal is set at 1554.96 M Hz
and at 1571.328 MHz. The on-chip ref erence os­cillator uses a low cost 16.368 MHz crystal.

Antenna sensor circuitry

Integrated sensor circuitry is ab le to eval uate th e
antenna current consum ption; the As out pin out­put provides this info externally. Using external
sensing resistor of 10 Ohm if the antenna current

consumption is inside the range 10mA…40mA
(active antennas typical current consumption) the
Asout output logic level is High, if the antenna cur­rent consumption is outside the ab ove reported
range (passive anten na or problem on antenna
connection) the Asout output logic level is low.

Chip enable

Using the CE pin it is possible to switch off all the
chip ( neither data nor clock available).

Using CE2 pin it is possible to disable the analog
portion of the chip (no data available) maintaining
the digital portion active (Clock available) optimiz­ing the chip current consumption.

Power supplies

The STB5610, has been designed to support
from 2.7 V to 3.6 V supply voltage.

4/11

STB5610

ABSOLUTE MAXIMUM RATING

Symbol Parameter Value Unit

Vcc Supply voltage 5.9 V

Tj Junction operating temperature -40 to 125

THERMA L D ATA

Symbol Parameter Value Unit

2.1

o

C/W

Rthj-case Thermal resistance junction- case TBD

ELECTRICAL CHARACTERISTICS (Vcc = 3+/-10%, Tcase= 25 oC)

Symbol Parameter Test conditions Min. Typ. Max. Unit

SUPPLY

Vcc Supply voltage 2.7 3.3 3.6 V

Icc Supply current 37 mA

AS1

Vcc Antenna

Supply

2.7 3.3 / 5 5.5 V

LNA

Gp Power gain

NF Noise figure

IIP3 Input IP3

VSWRin

Voltage St at. Wave

Ratio

Pin GC at GND

Pin GC at Vcc

Pin GC at GND

Pin GC at Vcc

Pin GC at GND

Pin GC at Vcc

=50Ω

Z

L

19
10

3

10

-20

-5

o

C

dB

dB

dBm

RF AMPLIFIER AND MIXER CHAIN

IIP3 Input IP3 -19 dBm

NF Noise Figure 5.5 dB
Z

IN

Z

OUT

fRF Input signal RF 1.575 MHz

G

Input impedance 50 Ω

Differential output

impedance

Voltage Convertion

Gain

1.4 ΚΩ

30 dB

FIRST LIMI TI N G AM P L I FI ER

G Voltage Gain 60 dB

Z

OUT

Differential output

impedance

2.4 ΚΩ

5/11

STB5610

ELECTRICAL CHARACTERISTICS (Vcc = 3+/-10%, Tcase= 25 oC)

Symbol Parameter Test conditions Min. Typ. Max. Unit

SECOND LIMITING AMPLIFIER

G Voltage Gain 30 dB

VCO

(GPS LO frequency 1555MHz)

VCO

Phase noise

∆f = 1KHz, SSB (10KHz PLL

closed loop bandwith)

-60 dBc/Hz

OUTPUT BUFFER

V

OH

V

OL

(square wave CMOS level)

High output voltage Vcc-0.4 Vcc V

Low output voltage 0 0+0.4 V

PHASE LOCKED LOOP

XTAL

INPUT CONTROL PINS TABLE

Reference crystal 16.368 MHz

(The logic levels are TTL compatible)

GC Pin (lna gain control pin)

Logic level Value

Low Max Gain
High Min Gain

CE2 Pin (Analog porti on e n a bl e pi n)

Logic level Value

Low Switch-o ff
High Switch-on

CE Pin (Tot al chip enable pin)

Logic level Value

Low Switch-off
High Switch-on

FSELECT ( Frequencie s Selector Pin)

Logic level Value

Low GPS frequency
High Galileo frequency

OUTPUT CONTROL PINS TABLE

The Asout pin output provides information on Antenna current consumption

ASout Pi n (A nt enna sensor pi n)

*

Logic level V alue

Low** Iant<10mA

Iant.>40mA

High** 10mA<Iant<40mA

* It is referred to external sensing resistor of 10 O Hm

Application requiring higher or lower current threshold should adjust the resistor value appropiately

** The logic levels are referred to STB5610 Supply Voltage

6/11

APPLICATION BOARD SCHEMATIC (ACTIVE ANTENNA)

STB5610

T

S

QUE

A

V

A

I

L

A

B

L

E

ON

RE

7/11

STB5610

APPLICATION BOARD LAYOUT (ACTIVE ANTENNA)

T

S

QUE

A

V

A

I

L

A

B

L

E

ON

RE

8/11

BILL OF MATERIALS

STB5610

T

S

QUE

A

V

A

I

L

A

B

L

E

ON

RE

9/11

STB5610

MECHANICAL DATA

mm

DIM.

A 1.60
A1 0.05 0.15
A2 1.35 1.40 1.45

D 8.75 9.00 9.25

D1 6.9 7.00 7.1

E 8.75 9.00 9.25
E1 6.9 7.00 7.1

L 0.5 0.60 0.75
e0.5
b 0.17 0.22 0.27

ccc 0.08

ddd 0.08

TETA

Note: L is measured at gage plane (at 0.25 above the seating plane)

MIN. TYP. MAX

o

0

o

7

10/11

STB5610

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to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
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11/11