The ST8812FP is manuf actured us ing late st Multi
Epitaxial Planar technology with high voltage
capability. It shows wide R.B.S.O.A. and high
switching speed thanks to its Cellular Emitter
structure with planar edge termination and d eep
base diffusion.
TO-220FP
Internal Schematic Diagram
Order codes
Part NumberMarking PackagePacking
ST8812FPST8812FPTO-220FPTUBE
rev.1
November 20051/10
www.st.com
10
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Obsolete Product(s) - Obsolete Product(s)
1 Electrical RatingsST8812FP
1 Electrical Ratings
Table 1.Absolute Maximum Rating
SymbolParameterValueUnit
V
CBO
V
CEO
V
EBO
I
I
CM
I
P
TOT
V
isol
T
STG
T
Table 2.Thermal Data
SymbolParameterValueUnit
R
thJ-case
Collector-Base Voltage (IE = 0)
Collector-Emitter Voltage (IB = 0)
Emitte-Base Voltage (IC = 0)
Collector Current7A
C
Collector Peak Current (tP < 5ms)
Base Current4A
B
Total dissipa tion at Tc = 25°C
Insulation Withst and Voltage (RMS) from All Three Leads to
External Heatsink
Storage Temperature-65 to 150°C
Max. Operating Junction Temperature150°C
Figure 3.Collector Emitter Saturation Voltage Figure 4.Base Emitter Saturation Voltage
Figure 5.Inductive Load Storage TimeFigure 6.Inductive Load Fall Time
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ST8812FP2 Electrical Char acteristics
Figure 7.Reverse Biased S.O.A.
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Obsolete Product(s) - Obsolete Product(s)
2 Electrical CharacteristicsST8812FP
Figure 8.Inductive Load Switching Test Circuit
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Obsolete Product(s) - Obsolete Product(s)
ST8812FP3 Package Mechanical Data
3 Package M echanical Da ta
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second Level Interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
f use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grante
y implic ation or otherwise under any patent or patent ri ghts of STM i croelectr onics. Specifications menti oned in thi s publicati on are subje
o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are n
uthoriz ed for use as critical compo nents in life support devic es or systems without express writt en approval of STMicroel ectronics.
The ST logo is a registered t rademark of S TM i croelectr oni cs.
All other nam es are the pro perty of thei r respectiv e owners
Austra l i a - Be l gi um - Brazil - Canada - Chi na - Czech Rep ubl i c - Finland - F rance - Germ any - Hong Kon g - In di a - Israel - It aly - Japan -
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www.st.com
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