Datasheet ST6225LM1, ST6225LB1, ST6225L, ST6215LM1, ST6215LB1 Datasheet (SGS Thomson Microelectronics)

November 1997 1/10

R

Rev. 1.0

ST6215L/25L

LOW VOLTAGE 8-BIT ROM MCUs WITH

A/D CONVERTER AND 28 PINS

■

2.4 to 3.9V Supply Operating Range

■ 4 MHz Maximum Clock Frequency

■

0to+70°C Operating Temperature Range

■

Run, Wait and Stop Modes

■

5 Interrupt Vectors

■ Look-up Table capability in Program Memory

■

Data Storage in Program Memory:
User selectable size

■

Data RAM: 64bytes

■ 20 I/O pins, fully programmable as:

– Input with pull-up resistor
– Input without pull-up resistor
– Input with interrupt generation
– Open-drain or push-pull output
– Analog Input

■

8 I/O lines can sink up to 12mA to drive LEDs

■

8-bit Timer/Counter with 7-bit programmable
prescaler

■ Digital Watchdog

■

8-bit A/D Converter with 16 analog inputs

■

On-chip Clock oscillator can be driven byQuartz
Crystal Ceramic resonator or RC network

■ Power-on Reset

■

One external Non-Maskable Interrupt

■

ST626x-EMU2 Emulation and Development
System (connects to an MS-DOS PC via an
RS232 serial line)

DEVICE SUMMARY

PDIP28

PSO28

DEVICE

ROM

(Bytes)

ST6215L 1836
ST6225L 3884

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ST6215L/25L

1 GENERAL DESCRIPTION

1.1 INTRODUCTION

The ST6215L/25L are low voltage mask pro­grammed ROM version of ST62T15C,T25C OTP
devices.

They offer the same functionality as OTP devices,
selecting as ROM options the options defined in
the programmable option byte of the OTP version,
with the exception of the LVD Reset that is not
available.

Figure 1. Programming wave form

1.2 ROM READOUT PROTECTION

If the ROM READOUT PROTECTION option is
selected, a protection fuse can be blown to pre­vent any access to the program memory content.

In case the user wants to blow this fuse, high volt­age must be applied on the TEST pin.

Figure 2. Programming Circuit

Note: ZPD15 is used for overvoltage protection

VR02001

0.5s min

15
10

5

14V typ

100 s max

t

t

4mA typ

100mA

150 s typ

max

TEST

TEST

VR02003

PROTECT

ZPD15

5V

V

SS

V

DD

TEST

47 F

m

100nF

100nF

15V

14V

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ST6215L/25L

ST6215L/25L MICROCONTROLLER OPTION LIST

Customer . . . ..........................

Address .............................

.............................

Contact . . . ..........................

PhoneNo .............................

Reference . . . ..........................

SGS-THOMSON Microelectronics references
Device: [ ] ST6215L [ ] ST6225L
Package: [ ] Dual in Line Plastic[ ] Small Outline Plastic with conditionning:

[ ] Standard (Stick)

[ ] Tape & Reel
Temperature Range: [ ] 0°Cto+70°C
Special Marking: [ ] No [ ] Yes ”_ _ _ _ _ _ _ _ _ _ _ ”
Authorized characters are letters, digits, ’.’, ’-’, ’/’ and spaces only.
Maximum character count: DIP28: 10

SO28: 8

Oscillator Source Selection: [ ] Crystal Quartz/Ceramic resonator

[ ] RC Network

Watchdog Selection: [ ] Software Activation

[ ] Hardware Activation

ROM Readout Protection: [ ] Disabled (Fuse cannot be blown)

[ ] Enabled (Fuse can be blown by the customer)

Note: No part is delivered with protected ROM.

The fuse must be blown for protection to be effective.

External STOP Mode Control[ ] Enabled [ ] Disabled
TIMER pin pull-up [ ] Enabled [ ] Disabled
NMI pin pull-up [ ] Enabled [ ] Disabled

Comments :
Supply Operating Range in the application:
Oscillator Fequency in the application:

Notes . . . ..........................

Signature . . . ..........................

Date .............................

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ST6215L/25L

1.3 ORDERING INFORMATION

The following section deals with the procedure for
transfer of customer codes to SGS-THOMSON.

1.3.1 Transfer of Customer Code

Customer code is made up of the ROM contents
and the list of the selected mask options. The
ROM contents are to be sent on diskette, or by
electronic means, with the hexadecimal file gener­ated by the development tool. All unused bytes
must be set to FFh.

The selected mask options are communicated to
SGS-THOMSON using the correctly filled OP­TION LIST appended.

1.3.2 Listing Generation and Verification

When SGS-THOMSON receives the user’s ROM
contents, a computer listing is generated from it.
This listing refers exactly to the mask which will be
used to produce the specified MCU. The listing is
then returned to the customer who must thorough­ly check, complete, sign and return it to
SGS-THOMSON. The signed listing forms a part
of the contractual agreement for the creation of the
specific customer mask.

The SGS-THOMSON Sales Organization will be
pleased to provide detailed information on con­tractual points.

Table 1. ROM Memory Map for ST6215L

Table 2. ROM Memory Map for ST6225L

Table 3. ROM version Ordering Information

Device Address Description

0000h-087Fh
0880h-0F9Fh

0FA0h-0FEFh

0FF0h-0FF7h

0FF8h-0FFBh

0FFCh-0FFDh

0FFEh-0FFFh

Reserved

User ROM

Reserved

Interrupt Vectors

Reserved

NMI Interrupt Vector

Reset Vector

Device Address Description

0000h-007Fh
0080h-0F9Fh

0FA0h-0FEFh

0FF0h-0FF7h

0FF8h-0FFBh

0FFCh-0FFDh

0FFEh-0FFFh

Reserved

User ROM

Reserved

Interrupt Vectors

Reserved

NMI Interrupt Vector

Reset Vector

Sales Type ROM Temperature Range Package

ST6215LB1/XXX

1836 Bytes

0 to +70°C

PDIP28
ST6215LM1/XXX PSO28
ST6225LB1/XXX

3884 Bytes

PDIP28
ST6225LM1/XXX PSO28

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ST6215L/25L

2 ELECTRICAL CHARACTERISTICS

2.1 ABSOLUTE MAXIMUM RATINGS

This product contains devices to protect the inputs
against damage due to high static voltages, how­ever it is advisable to take normal precaution to
avoid application of any voltage higher than the
specified maximum rated voltages.

For proper operation it is recommended that V

I

and VObe higher than VSSand lower than VDD.
Reliability is enhanced if unused inputs are con­nected to an appropriate logic voltage level (V

DD

or VSS).

Power Considerations.The average chip-junc­tion temperature, Tj, in Celsius can be obtained
from:

Tj=TA + PD x RthJA

Where:TA = Ambient Temperature.

RthJA =Package thermal resistance(junc-

tion-to ambient).
PD = Pint + Pport.
Pint =IDD x VDD (chip internal power).
Pport =Port power dissipation(determined

by the user).

Notes:

- Stresses above those listed as “absolute maximum ratings” may cause permanent damage to thedevice. This is a stress ratingonly and
functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.

- (1) Withinthese limits,clamping diodes are guarantee to be not conductive. Voltages outside these limits are authorised as longas injection
current is kept withinthe specification.

Symbol Parameter Value Unit

V

DD

Supply Voltage -0.3 to 7.0 V

V

I

Input Voltage VSS- 0.3 to VDD+ 0.3

(1)

V

V

O

Output Voltage VSS- 0.3 to VDD+ 0.3

(1)

V

I

O

Current Drain per Pin Excluding VDD,V

SS

±10 mA

IV

DD

TotalCurrent into VDD(source) 50 mA

IV

SS

TotalCurrent out of VSS(sink) 50 mA

Tj Junction Temperature 150 °C

T

STG

Storage Temperature -60 to 150 °C

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ST6215L/25L

2.2 RECOMMENDED OPERATING CONDITIONS

Notes:

1. Care must be taken in case of negative current injection, where adapted impedance must be respected on analog sources to not affect the

A/D conversion. For a -1mA injection, a maximum 10 KΩ is recommended.

2.An oscillator frequency above 1MHz is recommended for reliable A/D results

Figure 3. Maximum Operating FREQUENCY (Fmax) Versus SUPPLY VOLTAGE (VDD)

The shaded area is outside the recommended operating range; device functionality is not guaranteed under these conditions.

Symbol Parameter Test Conditions

Value

Unit

Min. Typ. Max.

T

A

Operating Temperature 1 Suffix Version

070

°C

V

DD

Operating Supply Voltage

f

OSC

=2MHz

f

OSC

=4MHz

2.4
3

3.9

3.9

V

f

OSC

Oscillator Frequency

2)

VDD= 2.4V
V

DD

= 3.0V

0
0

2.0

4.0

MHz

I

INJ+

Pin Injection Current (positive) VDD= 2.4 to 3.9V +5 mA

I

INJ-

Pin Injection Current (negative) VDD= 2.4 to 3.9V -5 mA

4.0

3.5

3.0

2.5

2.0

1.5

1

0.5

2.1 2.4 2.7 3.3 3.6 3.9

SUPPLY VOLTAGE (VDD)

Maximum FREQUENCY (MHz)

FUNCTIONALITY IS NOT

GUARANTEED IN

THIS AREA

3.0

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ST6215L/25L

2.3 DC ELECTRICAL CHARACTERISTICS

(TA= 0 to +70°C unless otherwise specified)

Notes:

(1) Hysteresis voltage between switching levels
(2) All peripherals running
(3) All peripherals in stand-by

Symbol Parameter Test Conditions

Value

Unit

Min. Typ. Max.

V

IL

Input Low LevelVoltage
All Input pins

V

DD

x 0.2 V

V

IH

Input High Level Voltage
All Input pins

V

DD

x 0.8 V

V

Hys

Hysteresis Voltage

(1)

All Input pins

V

DD

= 3V 0.2 V

V

OL

Low Level Output Voltage
All Output pins

V

DD

= 3.0V; IOL= +10µA

V

DD

= 3.0V; IOL= + 3.0mA

V

DD

= 2.4V; IOL= + 1.5mA

0.1

0.8

0.8
V

Low Level Output Voltage
20 mA Sink I/O pins

V

DD

= 3.0V; IOL= +10µA

V

DD

= 3.0V; IOL= + 8mA

V

DD

= 3.0V; IOL= +12mA

V

DD

= 2.4V; IOL= + 5mA

0.1

0.8

1.3

0.8

V

OH

High Level Output Voltage
All Output pins

V

DD

= 3.0V; IOH= -10µA

V

DD

= 3.0V; IOH= -1.5mA

V

DD

= 2.4V; IOH= -10µA

2.9

2.0

2.3

V

R

PU

Pull-up Resistance

All Input pins 100 250 600

ΚΩ

RESET pin 400 600 1200

I

IL

I

IH

Input Leakage Current
All Input pins but RESET

VIN=VSS(No Pull-Up configured)
V

IN=VDD

0.1 1.0
µA

Input Leakage Current
RESET pin

V

IN=VSS

VIN=V

DD

-8 -16 -30
10

I

DD

Supply Current in RESET
Mode

V

RESET=VSS

f

OSC

=4MHz

1.5 mA

Supply Current in
RUN Mode

(2)

VDD=3.0V f

INT

=4MHz 1.5 mA

Supply Current in WAIT
Mode

(3)

VDD=3.0V f

INT

=4MHz 0.5 mA

Supply Current in STOP
Mode

(3)

I

LOAD

=0mA

V

DD

=3.0V

2 µA

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ST6215L/25L

DC ELECTRICAL CHARACTERISTICS(Cont’d)

2.4 AC ELECTRICAL CHARACTERISTICS

((TA=0to+70°C unless otherwise specified

Notes:

1. Period for which V

DD

has to be connected at 0V toallow internal Reset function at next power-up.

2 An oscillator frequency above 1MHz is recommended for reliable A/D results.

3. Measure performed withOSCin pin soldered on PCB,with an around 2pF equivalent capacitance.

Symbol

Parameter Test Conditions

Value

Unit

Min. Typ. Max.

t

REC

Supply Recovery Time

(1)

100 m s

f

RC

Internal frequency with RC
oscillator

2) 3)

VDD=3.0V
R=47kΩ
R=100kΩ
R=470kΩ

2.5

1.4

450

3

1.7

520

3.5

2.1

600

MHz
MHz

kHz

C

IN

Input Capacitance All Inputs Pins 10 pF

C

OUT

Output Capacitance All Outputs Pins 10 pF

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ST6215L/25L

2.5 A/D CONVERTER CHARACTERISTICS

(TA= 0 to +70°C unless otherwise specified)

Notes:

1. Noise at VDD,VSS <10mV

2. With oscillator frequencies less than 1MHz, the A/D Converter accuracy is decreased.

2.6 TIMER CHARACTERISTICS

((TA=0to+70°C unless otherwise specified)

.

Symbol Parameter Test Conditions

Value

Unit

Min. Typ. Max.

Res Resolution 8 Bit

A

TOT

TotalAccuracy

(1) (2)

f

OSC

> 1.2MHz, VDD=3.0V

f

OSC

> 1.2MHz, VDD=2.4V

f

OSC

> 32kHz, VDD=3.0V

±25
±35
±50

mV

t

C

Conversion Time

f

OSC

= 2MHz

f

OSC

= 4 MHz

280
140

µs

ZIR Zero Input Reading

Conversion result when
V

IN=VSS

00 Hex

FSR Full Scale Reading

Conversion result when
V

IN=VDD

FF Hex

AD

I

Analog Input Current During
Conversion

V

DD

= 4.0V 1.0 µA

AC

IN

Analog Input Capacitance 2 5 pF

Symbol Parameter Test Conditions

Value

Unit

Min. Typ. Max.

f

IN

Input Frequency on TIMER Pin MHz

t

W

Pulse Width at TIMER Pin VDD= 2.4V 250 ns

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ST6215L/25L

Notes:

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights ofthird parties which may result from itsuse. No
license is granted by implication or otherwise under any patentor patent rights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without
express written approval of SGS-THOMSON Microelectronics.



1997 SGS-THOMSON Microelectronics -Printed in Italy - All Rights Reserved.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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