Page 1
SPI based on 32-bit ARM® SecurCore® SC300™ CPU
TSSOP28
VQFN32
Features
TPM features
■ Single-chip Trusted Platform Module (TPM)
■ Compliant with Trusted Computing Group
(TCG) Trusted Platform Module (TPM) Main
specifications 1.2, Level 2, Revision 116
■ Based on TCG PC Client Specific TPM
Interface Specifications 1.21
■ SPI support up to 10 MHz
■ Provisioned with Endorsement key and
Endorsement Key certificate
■ Support of clock suspension for power saving
mode
■ Support of Field Upgrade and Dictionary Attack
protection
■ Monotonic counter endurance guaranteed for
7 years
■ Support of software and hardware physical
presence
Hardware features
■ ARM® SecurCore® SC300™ 32-bit RISC core
■ Highly reliable CMOS EEPROM submicron
technology
– 30-year data retention at 25° C
– 500,000 Erase/Write cycles endurance
typical at 25° C
■ Temperature range: 0°C to +70°C
■ ESD protection up to 4 kV (HBM)
■ 3.3 V supply voltage range
■ 28-lead thin shrink small outline and 32-lead
very thin fine pitch quad flat pack ECOPACK®
packages
ST33TPM12SPI
Trusted Platform Module with
Data brief
Security features
■ Active shield and environmental sensors
■ Memory protection unit (MPU)
■ Monitoring of environmental parameters
(power and clock)
■ Hardware and software protection against fault
injection
■ AIS-31 Class P2 compliant true random
number generator (TRNG)
■ Cryptographic algorithms:
– RSA key generation from 512 to 2048 with
a 2-byte step
– RSA signature and encryption
– SHA-1 and SHA-256
– AES-128 in CTR mode
Performance and resource features
■ SHA1 computation for 64-byte block: 155 µs
■ Signature with a 2048-bit key: 150 ms
■
Signature with a 1024-bit key: 30 ms
■
NV storage allocated space: 4 Kbytes
(a)
(1.2 Kbytes used by EK certificate)
■ Supported 2048-bit key slots:
– up to 10 key slots (without EK and SRK)
– 1 key slot in volatile memory for high-
frequency loading use case
(a)
(a)
a. Typical value with clock configuration in secure mode
without communication time.
April 2012 Doc ID 023143 Rev 1 1/11
For further information contact your local STMicroelectronics sales office.
www.st.com
1
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Description ST33TPM12SPI
1 Description
The ST33TPM12SPI is a cost-effective and high performance Trusted Platform Module
(TPM) targeting embedded system applications.
This device implements the functions defined by the Trusted Computing Group
(www.trustedcomputinggroup.org) in the TCG Trusted Platform Module Specifications
version 1.2 Level 2 Revision 116 ([1][2][3]), and is also based on the TCG PC Client specific
TPM interface specifications 1.21 [5] and the PC Client implementation specification for
conventional BIOS [6] for what concerns the TPM internal register list and bit definitions.
The ST33TPM12SPI is based on a secure MCU hardware platform.
The ST33TPM12SPI is built on a 32-bit ARM® reduced instruction set computing (RISC)
processor which provides high cryptographic and general performances. A crypto-processor
NESCRYPT is also present to support efficiently all public key cryptographic algorithms.
1.1 Hardware features
The ST33TPM12SPI is based on a smartcard-class secure MCU that incorporates the most
recent generation of ARM processors for embedded secure systems. Its SecurCore®
SC300™ 32-bit RISC core is built on the Cortex™ M3 core with additional security features
to help to protect against advanced forms of attacks.
Cadenced at 30 MHz, the SC300™ core brings great performance and excellent code
density thanks to the Thumb®-2 instruction set.
The ST33TPM12SPI offers a fast slave serial peripheral interface (SPI) supported by an
embedded hardware communication engine.
The ST33TPM12SPI features hardware accelerators for advanced cryptographic functions.
The EDES peripheral provides a secure DES (Data Encryption Standard) algorithm
implementation, while the NESCRYPT crypto-processor efficiently supports the public key
algorithm.
The ST33TPM12SPI operates in the 0 to +70°C temperature and 3.3V supply voltage
ranges.
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and device status are available at: www.st.com.
ECOPACK® is an ST trademark.
2/11 Doc ID 023143 Rev 1
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ST33TPM12SPI Description
Figure 1. ST33TPM12SPI hardware block diagram
ARM®
SecurCore®
SC300™ CPU
Code/Data
Signature
Clock
Generator
Module
MPU
RAM
EEPROM
CRC
Module
User
ROM
ST ROM
(Boot
software)
ST ROM
Firewall
AHB/APB Internal Bus
I/O Buffer
TIS Engine
SPI
EDES
Accelerator
RAM
Three
16-bit
timers
Security
Monitor-
ing and
Control
NES-
CRYPT
RAM
True
Random
Number
Generator
RESET
TPMSTB
Multiplexed I/Os
SS
MOSI
MISO
SCLK
PP
MS20046V1
TPMIRQ
Doc ID 023143 Rev 1 3/11
Page 4
Pin and signal description ST33TPM12SPI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
NC
NC
GND
NC
NC
PP
NC
NC
VPS
GND
NC
NC
NC
TPMSTB
TPMIRQ
MOSI
NC
VPS
MISO
SS
SCLK
NC
NC
NC
RESET
GND
NC
TSSOP28
1
2
3
4
5
6
7
8
9 1011121314
28 27 26 25
24
23
22
21
20
19
18
17
1615
GND
NC
NC
NC
NC
PP
NC
NC
VPS
GND
NCNCNC
TPMSTB
TPMIRQ
MOSINCVPS
MISO
SS
SCLK
NC
NC
NC
RESET
GND
NC
QFN32
29303132
NC
NC
NC
NC
NC
2 Pin and signal description
2.1 Pinout descriptions
Figure 2. TSSOP28 pinout
Figure 3. VQFN32 pinout
4/11 Doc ID 023143 Rev 1
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ST33TPM12SPI Pin and signal description
Table 1. Pin descriptions
Signal Type Description
VPS Input
3.3V Power supply. This pin must be connected to 3.3V DC power rail
supplied by the motherboard.
GND Input GND has to be connected to the main motherboard ground.
Power Down indicates that the peripheral should prepare for power to be
TPMSTB
Input
removed from the interface devices. Actual power removal is system
dependent.
RESET
Input Reset used to re-initialize the device
MISO SPI Master Input, Slave Output (output from slave)
MOSI SPI Master Output, Slave Input (output from master)
SLCK SPI Serial Clock (output from master)
SS
PP Input
SPI Slave Select (active low; output from master)
Physical Presence, active high, internal pull-down. Used to indicate
Physical Presence to the TPM.
TPMIRQ Output TPM IRQ is used by TPM to handle interrupt support.
Doc ID 023143 Rev 1 5/11
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Package mechanical data ST33TPM12SPI
3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
3.1 28-pin thin shrink small outline package (TSSOP) with 4.4mm body width
Dimensional features of the TSSOP28 package: Body width 4.4 mm. Pitch 0.65 mm.
Unless otherwise specified, general tolerance is ± 0.1 mm.
Figure 4. 28-lead thin shrink small outline package outline
D
28
15
EE1
c
1
A
aaa
b
Table 2. 28-lead thin shrink small outline package mechanical data
Symbol
Min. Typ. Max. Min. Typ. Max.
A1.200.047
A1 0.05 0.15 0.002 0.006
A2 0.80 1.00 1.05 0.031 0.040 0.041
b 0.19 0.30 0.007 0.012
c 0.09 0.20 0.004 0.008
D 9.60 9.70 9.80 0.378 0.382 0.386
E 6.20 6.40 6.60 0.244 0.252 0.260
E1 4.30 4.40 4.50 0.170 0.173 0.177
millimeters inches
14
A1
A2
e
L
L1
k
YM_ME
6/11 Doc ID 023143 Rev 1
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ST33TPM12SPI Package mechanical data
Table 2. 28-lead thin shrink small outline package mechanical data (continued)
Symbol
Min. Typ. Max. Min. Typ. Max.
e 0.65 0.026
L 0.45 0.60 0.75 0.018 0.024 0.0230
L1 1.00 0.040
k0° 8°0° 8°
aaa 0.10 0.004
millimeters inches
Doc ID 023143 Rev 1 7/11
Page 8
Package mechanical data ST33TPM12SPI
Seating plane
ddd C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
42_ME
Bottom view
3.2 32-lead very thin fine pitch quad flat pack no-lead (VFQFPN) package
Figure 5. VFQFPN32 5x5 mm 0.5 mm pitch package outline
Table 3. VFQFPN32 5x5 mm package mechanical data
millimeters inches
Symbol
Min. Typ. Max. Min. Typ. Max.
A 0.800 0.900 1.000 0.0315 0.0354 0.0394
A1 0.000 0.020 0.050 0.0000 0.0008 0.0020
A3 0.200 0.0079
b 0.180 0.250 0.300 0.0071 0.0098 0.0118
D 4.850 5.000 5.150 0.1909 0.1969 0.2028
D2 3.500 3.600 3.700 0.1378 0.1417 0.1457
E 4.850 5.000 5.150 0.1909 0.1969 0.2028
E2 3.500 3.600 3.700 0.1378 0.1417 0.1457
e 0.500 0.0197
L 0.300 0.400 0.500 0.0118 0.0157 0.0197
ddd 0.050 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
8/11 Doc ID 023143 Rev 1
(1)
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ST33TPM12SPI Delivery packing
!)$
!
$
"
#
.
4
'
4 Delivery packing
Surface-mount packages can be supplied with Tape and Reel packing. The reels have a 13"
typical diameter. They contain 2500 devices each.
Reels are in plastic, either antistatic or conductive, with a black conductive cavity tape. The
cover tape is transparent antistatic or conductive.
The devices are positioned in the cavities with the identifying pin (normally Pin “1”) on the
same side as the sprocket holes in the tape.
The STMicroelectronics Tape & Reel specifications are compliant to the EIA 481-A standard
specification.
Table 4. Packages on Tape and Reel
Package Description Tape width Tape pitch Reel diameter Quantity per reel
TSSOP 28
Thin shrink small
outline package
Figure 6. Reel diagram
Table 5. Reel dimensions
16 mm 8 mm 13 in. 2500
Reel size Tape size A Max. B Min. C D Min. G Max. N Min. T Max. Unit
13” 16 330 1.5 13 ±0.2 20.2 16.4 +2/–0 60 22.4 mm
Doc ID 023143 Rev 1 9/11
Page 10
Revision history ST33TPM12SPI
Revision history
Table 6. Document revision history
Date Revision Changes
23-Apr-2012 1 Initial release.
10/11 Doc ID 023143 Rev 1
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ST33TPM12SPI
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Doc ID 023143 Rev 1 11/11
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