Datasheet ST303C12LFK1 Specification

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B-PUK (TO-200AC)
Inverter Grade Thyristors
(Hockey PUK Version), 515 A
PRIMARY CHARACTERISTICS
Package B-PUK (TO-200AC)
Circuit configuration Single SCR
I
T(AV)
V
DRM/VRRM
V
TM
I
at 50 Hz 7950 A
TSM
I
at 60 Hz 8320 A
TSM
I
GT
T
C/Ths
400 V, 800 V, 1000 V, 1200 V
515 A
2.16 V
200 mA
55 °C
VS-ST303CL Series
Vishay Semiconductors
FEATURES
• Metal case with ceramic insulator
• All diffused design
• Center amplifying gate
• Guaranteed high dV/dt
• Guaranteed high dI/dt
• International standard case B-PUK (TO-200AC)
• High surge current capability
• Low thermal impedance
• High speed performance
• Designed and qualified for industrial level
• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
•Inverters
• Choppers
• Induction heating
• All types of force-commutated converters
 
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER TEST CONDITIONS VALUES UNITS
I
T(AV)
I
T(RMS)
I
TSM
2
t
I
V
DRM/VRRM
t
q
T
J
Note
= 10 μs to 20 μs for 400 V to 800 V devices
•t
q
t
= 15 μs to 30 μs for 1000 V to 1200 V devices
q
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515 A
T
hs
T
hs
50 Hz 7950
60 Hz 8320
50 Hz 316
60 Hz 289
Range 10 to 30 μs
1
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55 °C
995 A
25 °C
400 to 1200 V
-40 to 125 °C
A
kA2s
Document Number: 94374
Page 2
VS-ST303CL Series
100 µs
I
TM
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ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE NUMBER
VS-ST303C..L
VOLTAGE
CODE
V
DRM/VRRM
REPETITIVE PEAK VOLTAGE
, MAXIMUM
NON-REPETITIVE PEAK VOLTAGE
V
04 400 500
08 800 900
10 1000 1100
12 1200 1300
V
RSM
CURRENT CARRYING CAPABILITY
I
FREQUENCY UNITS
180° el
TM
180° el
50 Hz 1130 950 1800 1540 5660 4990
400 Hz 1010 820 1850 1570 2830 2420
1000 Hz 680 530 1560 1300 1490 1220
2500 Hz 230 140 690 510 540 390
Recovery voltage V
R
Voltage before turn-on V
D
50 50 50
V
DRM
Rise of on-state current dI/dt 50 - - A/μs
Heatsink temperature 40554055405C Equivalent values for RC circuit 10/0.47 10/0.47 10/0.47 /μF
V
DRM
I
TM
Vishay Semiconductors
, MAXIMUM
V
V
DRM
I
DRM/IRRM
AT T
= TJ MAXIMUM
J
MAXIMUM
mA
50
A
V
ON-STATE CONDUCTION
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average on-state current at heatsink temperature
Maximum RMS on-state current I
T(RMS)
Maximum peak, one half cycle, non-repetitive surge current
Maximum I
Maximum I
2
t for fusing I2t
2
t for fusing I2t t = 0.1 to 10 ms, no voltage reapplied 3160 kA2s
Maximum peak on-state voltage V
Low level value of threshold voltage V
High level value of threshold voltage V
Low level value of forward slope resistance
High level value of forward slope resistance
Maximum holding current I
Typical latching current I
I
T(AV)
180° conduction, half sine wave double side (single side) cooled
DC at 25 °C heatsink temperature double side cooled 995
I
TSM
TM
T(TO)1
T(TO)2
r
t1
r
t2
H
L
t = 10 ms
t = 8.3 ms 8320
t = 10 ms
t = 8.3 ms 7000
t = 10 ms
t = 8.3 ms 289
t = 10 ms
t = 8.3 ms 204
ITM = 1255 A, TJ = TJ maximum, t
= 10 ms sine wave pulse
p
(16.7 % x x I (I > x I
(16.7 % x x I
(I > x I
TJ = 25 °C, IT > 30 A 600
TJ = 25 °C, VA = 12 V, Ra = 6 , IG = 1 A 1000
No voltage reapplied
100 % V reapplied
No voltage
RRM
Sinusoidal half wave, initial T
= TJ maximum
J
reapplied
100 % V reapplied
T(AV)
), TJ = TJ maximum 1.48
T(AV)
T(AV)
), TJ = TJ maximum 0.56
T(AV)
RRM
< I < x I
< I < x I
), TJ = TJ maximum 1.44
T(AV)
), TJ = TJ maximum 0.57
T(AV)
515 (190) A
55 (85) °C
7950
6690
316
224
kA
2.16
m
mA
A
2
V
s
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VS-ST303CL Series
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SWITCHING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum non-repetitive rate of rise of turned on current
Typical delay time t
minimum
Maximum turn-off time
(1)
maximum 30
dI/dt
d
t
q
T
= TJ maximum, V
J
I
= 2 x dI/dt
TM
TJ = 25 °C, VDM = Rated V Resistive load, gate pulse: 10 V, 5 source
= rated V
DRM
DRM
, ITM = 50 A DC, tp = 1 μs
DRM
TJ = TJ maximum, I
= 550 A, commutating dI/dt = 40 A/μs
TM
V
= 50 V, tp = 500 μs, dV/dt: See table in device code
R
Note
(1)
tq = 10 μs to 20 μs for 400 V to 800 V devices; tq = 15 μs to 30 μs for 1000 V to 1200 V devices
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
T
= TJ maximum, linear to 80 % V
Maximum critical rate of rise of off-state voltage dV/dt
Maximum peak reverse and off-state leakage current
I
RRM
I
DRM
,
J
higher value available on request
TJ = TJ maximum, rated V
TRIGGERING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum peak gate power P
Maximum average gate power P
Maximum peak positive gate current I
Maximum peak positive gate voltage + V
Maximum peak negative gate voltage - V
Maximum DC gate current required to trigger I
Maximum DC gate voltage required to trigger V
Maximum DC gate current not to trigger I
Maximum DC gate voltage not to trigger V
GM
G(AV)
GM
GM
GM
GT
GT
GD
GD
TJ = TJ maximum, f = 50 Hz, d% = 50
TJ = TJ maximum, tp 5 ms
TJ = 25 °C, VA = 12 V, Ra = 6
TJ = TJ maximum, rated V
Vishay Semiconductors
DRM/VRRM
DRM
,
DRM
applied 50 mA
applied
1000 A/μs
0.83
10
500 V/μs
60
10
10 A
20
5
200 mA
3V
20 mA
0.25 V
μs
W
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum operating junction temperature range T
Maximum storage temperature range T
Maximum thermal resistance, junction to heatsink R
Maximum thermal resistance, case to heatsink R
J
Stg
thJ-hs
thC-hs
DC operation single side cooled 0.11
DC operation double side cooled 0.05
DC operation single side cooled 0.011
DC operation double side cooled 0.005
Mounting force, ± 10 %
Approximate weight 250 g
Case style See dimensions - link at the end of datasheet B-PUK (TO-200AC)
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3
-40 to 125
-40 to 150
9800
(1000)
Document Number: 94374
°C
K/W
N
(kg)
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20
30
40
50
60
70
80
90
100
110
120
130
0 100 200 300 400 500 600
DC
30°
60°
90°
120°
180°
Average On-state Current (A)
Conduction Period
Maximum Allowable Heatsink Temperature (°C)
ST303C..L Se ries (Single Side Cooled) R (DC) = 0.11 K/W
thJ-hs
30
40
50
60
70
80
90
100
110
120
130
0 100 200 300 400 500 600 700
30°
60°
90°
120°
180°
Average On-state Current (A)
Cond uction Ang le
Maximum Allowable Heatsink Temperature (°C)
ST3 0 3 C . . L Se r i e s (Double Side Cooled) R (DC) = 0.05 K/ W
thJ-hs
)
VS-ST303CL Series
Vishay Semiconductors
R
CONDUCTION
thJ-hs
CONDUCTION ANGLE
SINUSOIDAL CONDUCTION RECTANGULAR CONDUCTION
SINGLE SIDE DOUBLE SIDE SINGLE SIDE DOUBLE SIDE
180° 0.012 0.010 0.008 0.008
120° 0.014 0.015 0.014 0.014
90° 0.018 0.018 0.019 0.019
60° 0.026 0.027 0.027 0.028
30° 0.045 0.046 0.046 0.046
Note
• The table above shows the increment of thermal resistance R
130
120
110
100
90
80
70
60
50
40
0 50 100150200250300350
Maximum Allowable Heatsink Temperature (°C)
Average On-state Current (A)
ST3 0 3C . .L Se ri e s (Single Side Cooled) R (DC ) = 0.11 K/ W
thJ-hs
Conduction Angle
30°
60°
90°
120°
180°
TEST CONDITIONS UNITS
T
= TJ maximum K/W
J
when devices operate at different conduction angles than DC
thJ-hs
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
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Fig. 3 - Current Ratings Characteristics
130
120
110
100
90
80
70
60
50
40
30
20
Maximum Allowable Heatsink Temperature (°C
30°
0 200 400 600 800 1000 1200
Average On-state Current (A)
ST3 0 3 C . . L Se r ie s (Doub le Side Cooled ) R ( DC) = 0.05 K/ W
thJ-hs
60°
90°
120°
Fig. 4 - Current Ratings Characteristics
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Conduction Period
180°
DC
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0
200
400
600
800
1000
1200
1400
1600
1800
2000
0 100 200 300 400 500 600 700 800
180° 120°
90° 60° 30°
RM S Li m it
Cond uction Ang le
Maximum Average On-sta te Power Loss (W)
Average On-state Current (A)
ST303C..L Se ries T = 12 5° C
J
3000
3500
4000
4500
5000
5500
6000
6500
7000
110100
Number Of Eq ual Amplitude Half Cycle Current Pulses (N)
Peak Half Sine Wave On-state Curre nt (A)
Initial T = 125°C
at 60 Hz 0.0083 s at 50 Hz 0.0100 s
J
ST303C..L Se rie s
At Any Rate d Loa d Co nd ition And With
Rated V Applied Following Surge.
RRM
3000
3500
4000
4500
5000
5500
6000
6500
7000
7500
8000
0.01 0.1 1
Pulse Train Duration (s)
Versus Pulse Train Dura tion. Control
Of Conduction May Not Be Maintained.
Peak Half Sine Wave On-state Current (A)
Init ia l T = 125°C
No Vo lt a g e Rea pp lied
Ra t e d V Re a p p l i e d
RRM
J
ST3 03 C . . L Se r i e s
Maximum Non Repetitive Surge Current
VS-ST303CL Series
Vishay Semiconductors
Fig. 5 - On-State Power Loss Characteristics
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
Maximum Average On-sta te Power Loss (W)
DC 180° 120°
90°
60°
30°
RM S Li m i t
Conduction Period
ST3 0 3 C . . L Se r i e s T = 1 2 5 °C
J
0
0 200 400 600 800 1000 1200
Average On-state Current (A)
Fig. 6 - On-state Power Loss Characteristics
Fig. 8 - Maximum Non-Repetitive Surge Current
Single and Double Side Cooled
10000
1000
Instantaneous On-state Current (A)
100
012345678
Instantaneous On-state Voltage (V)
T = 25 °C
J
T = 125°C
J
ST30 3 C .. L Se r i e s
Fig. 9 - On-state Voltage Drop Characteristics
1
Steady State Value
R = 0.11 K/ W
thJ-hs
(Single Side Cooled)
thJ-hs
R = 0.05 K/ W
thJ-hs
0.1 (Double Side Cooled)
(DC Operation)
Fig. 7 - Maximum Non-Repetitive Surge Current
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Single and Double Side Cooled
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0.01
ST3 0 3 C . . L Se r i e s
0.001
Tra n si e n t Th e rm a l I m p e d a n c e Z ( K/ W )
0.001 0.01 0.1 1 10
Sq u a r e W a v e Pu l se D u r a t i o n ( s)
Fig. 10 - Thermal Impedance Z
5
Characteristics
thJ-hs
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30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
10 20 30 40 50 60 70 80 90 100
Maximum Reverse Rec overy Current - Irr (A)
Rate Of Fall Of Forward Current - di/dt (A/µs)
200 A
ST3 03 C . .L Se r i e s T = 1 2 5 ° C
J
I = 1000 A
TM
500 A
300 A
100 A
1E2
1E3
1E4
1E11E21E31E
50 Hz
400
2500
100
Pu l se Ba se w i d t h ( µs)
Peak On-state Curre nt (A)
1000
1500
3000
200
500
ST303C..L Series Si n u so i d a l p u l s e T = 40 ° C
C
2000
Snub b er c irc uit R = 10 o h m s C = 0.47 µF V = 80% V
s s
D
DRM
tp
1E1
1E2
1E3
1E4
1E1 1E2 1E3 1E4
50 Hz
400
2500
100
1000
1500
2000
3000
200
500
Pu lse Ba se w id t h ( µs)
Pe a k O n -st a t e C ur re nt ( A )
Sn u b b e r c i r c u i t R = 1 0 o h m s C = 0.47 µF V = 80% V
s s D
DRM
ST3 03 C . . L Se r i e s Trapezoidal pulse T = 40 ° C di/dt = 50A/µs
C
tp
VS-ST303CL Series
Vishay Semiconductors
320
300
280
260
240
220
I = 1000 A
TM
500 A
300 A
200 A
100 A
200
180
160
140
120
100
80
10 20 30 40 50 60 70 80 90 100
Maximum Reverse Recovery Charge - Qrr (µC)
Rate Of Fall Of On-state Current - di/dt (A/µs)
ST303C..L Serie s T = 125 °C
J
Fig. 11 - Reverse Recovered Charge Characteristics Fig. 12 - Reverse Recovery Current Characteristics
100
200
400
500
1000
1500
2000
2500
3000
1E1
1E1 1E2 1E3 1 E4
Pu l se Ba se w i d t h ( µs)
tp
Sn u b b e r c i r c u i t R = 10 o h ms
s
C = 0.47 µF
s
V = 80% V
D
ST3 03 C . . L Se r i e s Si n u so i d a l p u l se T = 5 5 ° C
C
50 Hz
DRM
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Fig. 13 - Frequency Characteristics
Snub b er c irc uit R = 10 o h m s C = 0.47 µF V = 80% V
1E1 1E2 1E3 1E4
Fig. 14 - Frequency Characteristics
6
s s D
3000
DRM
2500
2000
1500
1000
400
500
ST3 03 C . . L Se r i e s Trapezoidal pulse T = 55°C
tp
di/dt = 50A/µs
200
C
100
50 Hz
Pu lse Ba se w i d t h ( µs)
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1E1
1E2
1E3
1E4
1E5
1E1 1E2 1E3 1E4
Pul se Ba sew id th ( µs)
20 joules per pulse
2
1
0.5
10
5
Peak On-stat e C urre nt (A)
3
ST3 03 C . . L Se r ie s Si n u so i d a l p u l se
0.4
tp
0.1
1
10
100
0.001 0. 01 0.1 1 10 100
VGD
IGD
(b)
(a)
Tj=25 °C
T j=125 °C
T j=-40 °C
(1)
(2)
Instantaneous Gate Current
(A)
Instantaneous Gate Voltage (V)
Rec tangular gate pulse a) Recommended load line for
b) Recommended load line for
<=30% ra ted di / dt : 10V, 10o hms
rated di/ dt : 20V, 10ohms; tr<=1 µs
tr<=1 µs
(1) PGM = 10W, tp = 20ms (2) PGM = 20W, tp = 10ms (3) PGM = 40W, t p = 5ms (4) PGM = 60W, t p = 3. 3ms
(3)
De vi ce : ST303C. .L Series Freq uency Limite d by PG(AV)
(4)
VS-ST303CL Series
Vishay Semiconductors
1E4
Snub b er c irc ui t R = 10 o h ms
s
C = 0.47 µF
s
Pe a k O n -st a te Curr e nt ( A )
1E3
1E2
V = 80% V
D
3000
2500
DRM
2000
1500
1000
500
tp
100
200
400
ST3 03 C . . L Se r i e s Tra pezoid al p ulse T = 40°C
C
di/ dt = 100A/ µs
1E1
1E1 1E2 1E3 1E4
Pu lse Ba se w i d t h ( µs)
Snub ber circuit R = 1 0 o h m s
s
C = 0.47 µF
s
V = 80% V
50 Hz
D
1E1 1E2 1E3 1E4
Fig. 15 - Frequency Characteristics
DRM
2500
3000
ST3 03 C . . L Se r i e s Rectangular pulse
di/dt = 50A/µs
tp
1000
1500
2000
Pu lse Ba se w id t h ( µs)
1
0.5
0.4
500
400
tp
10
5
3
2
50 Hz
100
200
ST303C..L Se ries Trapezoidal pulse T = 55 ° C
C
di/dt = 100A/µs
20 jo ule s per p ulse
Fig. 16 - Maximum On-State Energy Power Loss Characteristics
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Fig. 17 - Gate Characteristics
1E1 1E2 1E3 1E4
1E1
Pu l se Ba se w id t h ( µs)
7
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ORDERING INFORMATION TABLE
VS-ST303CL Series
Vishay Semiconductors
Device code
STVS- 30 3 C12L H K 1 -
51 32 4 6 7 8 9 10 11
1 -
2
3
4
5
6
7
8
9
10
11
Vishay Semiconductors product
- Thyristor
-Essential part number
- 3 = fast turn-off
- C = ceramic PUK
- Voltage code x 100 = V
RRM
(see Voltage Ratings table)
- C = PUK case B-PUK (TO-200AC)
- Reapplied dV/dt code (for tq test condition)
-tq code
- 0 = eyelet terminals (gate and auxiliary cathode unsoldered leads)
1 = fast-on terminals
(gate and auxiliary cathode unsoldered leads)
2 = eyelet terminals
(gate and auxiliary cathode soldered leads)
3 = fast-on terminals
(gate and auxiliary cathode soldered leads)
- Critical dV/dt:
None = 500 V/μs (standard value)
L = 1000 V/μs (special selection)
dV/dt - tq combinations available
dV/dt (V/µs) 20 50 100 200 400
t
(µs)
q
up to 800 V
t
(µs)
q
only for 1000 V/1200 V
CN DN EN
10
CM DM EM FM HM
12
CL DL EL FL* HL
15
CK DK EK FK* HK
20
CL - -
15
CP DP - -
18
CK DK EK FK* HK
20
CJ DJ EJ FJ* HJ
25
-DHEHFHHH
30
FN* HN
--
-
* Standard part number. All other types available only on request.
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95076
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Pin receptacle AMP. 60598-1
0.7 (0.03) MIN.
34 (1.34) DIA. MAX.
2 places
53 (2.09) DIA. MAX.
58.5 (2.3) DIA. MAX.
2 holes DIA. 3.5 (0.14) x 2.5 (0.1) deep
4.7 (0.18)
27 (1.06) MAX.
0.7 (0.03) MIN.
6.2 (0.24) MIN.
36.5 (1.44)
Creepage distance: 36.33 (1.430) minimum Strike distance: 17.43 (0.686) minimum
Quote between upper and lower pole pieces has to be considered after application of mounting force (see thermal and mechanical specification)
20° ± 5°
C
A
Note:
A = Anode
C = Cathode
DIMENSIONS in millimeters (inches)
Outline Dimensions
Vishay Semiconductors
B-PUK (TO-200AC)
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Document Number: 95076
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Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2023 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2023
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Document Number: 91000
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