5S5S6-bit input-only port with Schmitt-Trigger characteristics.
Port 5 pins also serve as timer inputs:
98I5SP5.10T6EUDGPT2 Timer T6 Ext.Up/Down
Ctrl.Input
99I5SP5.11T5EUDGPT2 Timer T5 Ext.Up/Down
Ctrl.Input
100I5SP5.12T6INGPT2 Timer T6 Count Input
1I5SP5.13T5INGPT2 Timer T5 Count Input
2I5SP5.1 4T4 EUDGPT1 Timer T4 Ex t. Up / Down
Ctrl.Input
3I5SP5.1 5T2 EUDGPT1 Timer T2 Ex t. Up / Down
Ctrl.Input
5I3TX TAL1:Input to the oscillator amplifier and internal clock
generator
6O3TXTAL2:Output of the oscillator amplifier circuit.
To clock the device from an external source, drive
XTA L1, while leaving XTAL2 unconnected.
Observe minimum and maximum high/low and
rise/fall times specified in the AC Characteristics.
Table 1 Pin definitions
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Page 6
ST10R172L - PIN DESCR IPTION
1)
Symbol
P3.0 –
P3.13
P3.15
Pin Number
(TQFP)
8-21
Input (I)
I/O
Output (O)
Kind
Function
5T 5TA 15-bit (P3.14 is missing) bidirectional I/O port. Port 3 is bit-
wise programmable for input or output via direction bits. For a
22
I/O
pin configured as input, the output driver is put into highimpedance state. Port 3 outputs can be configured as push/
pull or open drain drivers. The following pins have alternate
I/O5TAn 8-bit bidirectional I/O port. Port 8 is bit-wise programmable
for input or output via direction bits. For a pin configured as
input, the output driver is put into high-impedance state.
Port 4 can be used to output the segment address lines for
external bus configuration.
23O5TP4.0A16Least Significant Segment Addr. Line
..................
26O5TP4.3A19Segment Address Line
29O5TP4.4A20Segment Address Line
O5TSSPCE1 Chip Enable Line 1
30O5TP4.5A21Segment Address Line
O5TSSPCE0SSPChip Enable Line 0
31O5TP4.6A22Segment Address Line
I/O5TSSPDATSSP Data Input/O utpu t Line
RD
WR/
WRL
READY/
READY
32O5TP4.7A23Most Significant Segment Addr. Line
O5TSSPCLKSSP Clock Output Line
33O5TExternal Memory Read Strobe. RD is activated for every exter-
nal instruction or data read access.
34O5TExternal Memory Write Strobe. In WR-mode, this pin is acti-
vated for every external data write access. In WRL-mode, this
pin is activated for low byte data write accesses on a 16-bit
bus, and for every data write access on an 8-bit bus.
See WRCFG in the SYSCON register for mode selection.
35I5TReady Input. Active level is programmable. When the Ready
function is enabled, the selected inactive level at this pin dur-
ing an external memory access will f orce t he insertion of mem-
ory cycle time waitstates until the pin returns to the selected
active level. Polarity is pro gram mable.
Table 1 Pin definitions
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Page 8
ST10R172L - PIN DESCR IPTION
1)
Symbol
Pin Number
(TQFP)
Input (I)
Output (O)
Kind
Function
ALE36O5TAddress Latch Enable Output. Can be used for latching the
address into external memory or an address latch in the multi-
plexed bus modes.
EA
37I5TE xt ernal Access Enable pin. Low level at this pin during and
after reset forces the ST10R172L to begin instruction execu-
tion out of external memory. A high level forces execution out
of the internal ROM. The ST10R172L must have this pin tied
to ‘0’.
PORT0:
P0L.0–
P0L.7,
P0H.0 -
P0H.7
41 - 48
51 - 58
I/O5TPORT0 has two 8-bit bidirectional I/O ports P0L and P0H. It is
bit-wise programmable for input or output via direction bits. For
a pin configured as input, the output driver is put into high-
impedance state.
For exter nal bus configuration, PORT0 acts as address (A)
and address/data (AD) bus in multiplexed bus modes and as
I/O5TPORT1 has two 8-bit bidirectional I/O ports P1L and P1H. It is
bit-wise programmable for input or output via direction bits. For
a pin configured as input, the output driver is put into high-
impedance state. PORT1 acts as a 16-bit address bus (A) in
demultiplexed bus modes and also after switching from a
demultiplexed bus mode to a multiplexed bus mode.
Table 1 Pin definitions
Page 9
ST10R172L - PIN DESCR IPTION
1)
Symbol
Pin Number
(TQFP)
Input (I)
Output (O)
Kind
Function
RSTIN79I5TReset Input with Schmitt-Trigger characteristics. Resets the
device when a low level is applied for a specified duration while
the oscillator is running. An internal pullup resi stor enables
power-on reset using only a capacitor connected to
a bonding option, the RSTIN
pin can also be pulled-down for
V
SS
. With
512 internal clock cycles for hardware, software or watchdog
timer triggered resets
RSTOUT
80O5TInternal Reset Indication Output. This pin is set to a low level
when the part is executes hardware-, software- or watchdog
timer reset. RSTOUT
remains low until the EINIT (end of ini-
tialization) instruction is executed.
NMI
81I5SNon-Maskable Interrupt Input. A high to low transition at this
pin causes the CPU to vector to the NMI trap routine.
P6.0P6.7
If it is not used, NMI
82-89I/O5TAn 8-bit bidirectional I/O port. Port 6 is bit-wise programmable
for input or output via direction bits. For a pin configured as
should be pulled high externally.
input, the output driver is put into high-impedance state. Port 6
outputs can be configured as push/pull or open drain drivers.
The following Port 6 pins have alternate functions:
82O5TP6.0CS0
Chip Select 0 Output
..................
86O5TP6.4CS4
87I5TP 6. 5HOL D
Chip Select 4 Output
External Master Hold Request Input
(Master mode: O, Slave mode: I)
88I/O5TP6.6HLDA
89O5TP6.7BRE Q
Hold Acknowledge Output
Bus Request Output
Table 1 Pin definitions
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Page 10
ST10R172L - PIN DESCR IPTION
1)
Symbol
P2.8 –
P2.11
Pin Number
(TQFP)
Input (I)
Output (O)
Kind
Function
90 - 93I/O5TPor t 2 is a 4-bit bidirectional I/O port. It is bit-wise programma-
ble for input or output via di rection bits. For a pin configured as
input, the output driver is put into high-impedance state. Port 2
outputs can be configured as push/pull or open drain drivers.
The following Port 2 pins have alternate functions:
90I5TP 2.8EX0INFast External Interrupt 0 Input
..................
93I5TP 2.11EX 3INFast Externa l Interrupt 3 Input
P7.0 –
P7.3
94 - 97I/O5TPor t 7 is a 4-bit bidirectional I/O port. It is bit-wise programma-
ble for input or output via di rection bits. For a pin configured as
input, the output driver is put into high-impedance state. Port
7outputs can be configured as push/pull or open drain drivers.
The following Port 7 pins have alternate functions:
97O5TP7.3POUT3PWM (Channel 3) Output
RPD40I/O5TInput timing pin for the return from powerdown circuit and
power-up asynchronous reset.
V
DD
7, 28,
-PODi gital supply voltage.
38, 49,
69, 78
V
SS
4, 27,
-PODi gital ground.
39, 50,
70, 77
Table 1 Pin definitions
1) The following I/O kinds are used. Refer to
page 31 for a detailed description.
PO: Power pin
3T: 3 V tolerant pin (voltage max. respect to Vss is -0.5 to VDD + 0.5)
5V: 5 V tolerant pin (voltage max. respect to Vss is -0.5 to 5.5 only if chip is powered)
5S: 5 V tolerant and f ail-safe pin (-0.5-5.5 ma x. voltage w.r.t. Vss ev en if chip is n ot pow-
ered).
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ELECTRICAL CHARACTERISTICS
on
Page 11
ST10R172L - FUNCTIONAL DESCRIPTION
2FUNCTIONAL DESCRIPTION
ST10R172L architecture combines the advantages of both RISC and CISC processors wi th
an advanced peripheral subsystem. The following block diagram overviews the different onchip components and the internal bus structure.
The ST10R172L is a ROMless device, the internal RAM space is 1 KByte. The RAM address
space is used for variables, register banks, the system stack, the PEC pointers (in 00’FCE0h
- 00’FCFFh) and the bit-addressable space (in 00’FD00h - 00’FDFFh).
00’EFFFh
256 Byte
00’EF00h
00’1FFFh
8K-byte
00’0000h
RAM/SFR
XSSP
External
memory
internal
memory
System Segment 0
64 K-Byte
00’FFFFh
00’F000h
Data Page 3
00’F000h
Data Page 2
00’8000h
Data Page 1
Block 1
00’4000h
Data Page 0
Block 0
00’0000h
00’FF3Fh
00’FF20h
00’FE3Fh
00’FE20h
00’FF3Fh
00’FF20h
00’F03Fh
00’F020h
SFR Area
(reserved)
RAM
ESFR Area
(reserved)
DPRAM / SFR Area
4 K-Byte
00’FFFFh
00’FE00h
1K-Byte
00’FA00h
00’F200h
00’F000h
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Figure 3 Memory map
Page 13
ST10R172L - CENTRAL PROCESSING UNIT
4CENTRAL PROCESSING UNIT
The main core of the CPU contains a 4-stage instruction pipeline, a separate multiply and
divide unit, a bit-mask generator and a barrel shifter . Most instructions can be ex ecuted in one
machine cycle requiring 40ns at 50MHz CPU clock.
The CPU includes an actual register context consisting of 16 wordwide GPRs physically
located in the on-chip RAM area. A Context Pointer (CP) register determines the base
address of the activ e register bank to be ac cessed b y the CPU . T he number of r egister banks
is only restricted by the available internal RAM space. For easy parameter passing, one
register bank may overlap others.
A system stack of up to 1024 bytes is provided as a storage for temporary data. The system
stack is al located in the on-chip RAM area, and it i s accessed by the C PU via the stac k pointer
(SP) register. Two separate SFR s, STKOV and STKUN, are compared against the stack
pointer value during each stack access to detect stack overflow or underflow.
SP
STKOV
STKUN
Exec. Unit
Instr. Ptr
Instr. Reg
4-Stage
Pipeline
PSW
SYSCON
BUSCON 0
BUSCON 1
BUSCON 2
BUSCON 3
BUSCON 4
Data Pg. Ptrs
CPU
MDH
MDL
Mul./Div.-HW
Bit-Mask Gen.
ALU
16-Bit
Barrel-Shift
Context Ptr
ADDRSEL 1
ADDRSEL 2
ADDRSEL 3
ADDRSEL 4
Code Seg. Ptr.
R15
General
Purpose
Registers
R0
IDX0
QR0
IDX1
QX1QX0
QR1
Figure 4 CPU block diagram
16
16
Internal
RAM
1KByte
R15
R0
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Page 14
ST10R172L - INTERRUPT AND TRAP FUNCTIONS
5INTERRUPT AND TRAP FUNCTI ONS
The architecture of the ST10R172L supports s everal mechanisms for fast and flexible
response to the service requests that can be generated from various sources, internal or
external to the microcontroller. Any of these interrupt requests can be programmed to be
serviced, either by the Interrupt Controller or by the Peripheral Event Controller (PEC).
In a standard interrupt service, program executi on is suspended and a branch to the interrupt
service routine is performed. For a PEC service, just one cycle is ‘stolen’ from the current
CPU activity. A PEC service is a single, byte or word data transfer between any two memory
locations, with an additional increment of either the PEC source or the destination pointer. An
individual PEC transfer counter is decremented for each PEC servic e, except in the
continuous transfer mode. When this counter reaches zero , a standard interrupt is performed
to the corresponding source-related vector location. PEC services are very well suited, for
example, to the transmission or reception of blocks of data. The ST10R172L has 8 PEC
channels, each of which offers fast interrupt-driven data transfer capabilities.
A separate control register which contains an interrupt request flag, an interrupt enable flag
and an interrupt priority bitfield, exists f or each of the possib le interrupt sources. Via it s related
register, each source can be programmed to one of sixteen interrupt priority levels. Once
having been accepted by the CPU, an interrupt service can only be interrupted by a higher
priority service request. For standard interrupt processing, each of the possible interrupt
sources has a dedicated vector location.
Fast external interrupt inputs are provided to service external interrupts with high precision
requirements. These fast interrupt inputs, feature programmable edge detection (rising edge,
falling edge or both edges).
Software interrupts are supported by means of the ‘TRAP’ instruc tion in combination with an
individual trap (interrupt) number.
Table 2 List of possible interrupt sources, flags, vector and trap numbers
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Page 16
ST10R172L - INTERRUPT AND TRAP FUNCTIONS
5.2 Hard w are traps
Exceptions or error conditions that arise during run-time are called Hardware T raps. Hardware
traps cause immediate non-maskable system reaction similar to a standard interrupt service
(branching to a dedicated vector table location). The occurrence of a hardware trap is
additionally signified by an individual bit in the trap flag register (TFR). Except when another
higher prioritized trap service is in progress, a hardware trap will interrupt any actual progr am
ex ecution. In turn, hardware trap services can not normally be interrupted by standard or PEC
interrupts. The following tab le shows all of the possible ex ceptions or error conditions that can
arise during run-time:
The ST10R172L provides up to 77 I/O lines organized into 7 input/output ports and one input
port. All port lines are bit-addressable, and all input/output lines are individually (bit-wise)
programmable as inputs or outputs by direction registers. The I/O ports are true bi directional
ports which are switched to high impedance state when configured as inputs. The output
drivers of three I/O ports can be configured (pin by pin) for push/pull operation or open-drain
operation by control registers. During the internal reset, all port pins are configured as inputs.
All port lines have programmable alternate input or output functions associated with them.
PORT0 and PORT1 may be used as address and data lines when accessing external
memory , while P ort 4 outputs the additional segment address bits A23/19/17...A16 in systems
where segmentation is enabled to access more than 64 KBytes of memory. Port 6 provides
optional bus arbitration signals (BREQ
alternate functions of timers, serial interfaces, the optional bus control signal BHE
system clock output (CLKOUT). Port 5 is used for timer control signals. Port 2 lines can be
used as fast external interrupt lines. Port 7 includes alternate function for the PWM signal. All
port lines that are not used for these alternate functions may be used as general purpose I/O
lines.
, HLDA, HOLD) and chip select signals. Port 3 includes
and the
7EXTE RNAL BUS CONTROLLER
All external memory accesses are performed by the on-chip External B us Controller which
can be programmed either to single chip mode when no external memory is required, or to the
following external memor y ac ces s modes:
In the demultiplex ed b us modes, addresses are output on PORT1 and data is input/output on
PORT0/P0L, respectively. In the multiplex ed bus modes both addresses and data use PORT0
for input/output.
Memory cycle time, memory tri-state time, length of ALE and read write delay are
programmable so that a wide range of different memory types and external peripherals can be
used. Up to 4 independent address windows can be defined (via ADDRSELx / BUSCONx
register pairs) to access different resources with different bus characteristics. These address
windows are arranged hier archically where BUSCON4 ov errides BUSCON3 etc. All accesses
to locations not covered by these 4 address windows are controlled by BUSCON0. Up to 5
exte r nal CS
Access to very slow memories is supported by the READY function.
signals (4 windows plus default) can be generated to reduce external glue logic.
A HOLD
/HLDA protocol is available for bus arbitration so that external resources can be
shared with other bu s masters. In slav e mode, the s lave controller can be connec ted to another master controller without glue logic. For applications which require less than 16 MBytes
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Page 18
ST10R172L - PWM MODULE
of external memory space, the address space can be restricted to 1 MByte, 256 KByte or to 64
KByte.
8PWM MODULE
A 1-channel Pulse Width Modulation (PWM) Module operates on channel 3. The pulse width
modulation module can generate up to four PWM output signals using edge-aligned or centrealigned PWM. In addition, the PWM module can generate PWM burst signals and single shot
outputs. The table below shows the PWM frequencies for different resolutions. The level of
the output signals is selectable and the PWM module can generate interrupt requests.
Mode 0
edge aligned
CPU clock/120ns195.3 KHz48.83KHz12.21KHz3.052KHz762.9Hz
CPU clock/641.28ns3.052KHz762.9Hz190.7Hz47.68Hz11.92Hz
Mode 1
center aligned
CPU clock/120ns97.66KHz24.41KHz6.104KHz1.525KHz381.5Hz
CPU clock/641.28ns1.525Hz381.5 Hz95.37Hz23.84Hz0Hz
Resolution8-bit10-bit12-bit14-bit16-bit
Resolution8-bit10-bit12-bit14-bit16-bit
Table 4 PWM unit frequencies and resolution at 50MHz CPU clock
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Page 19
ST10R172L - GENERAL PURPOSE TIMERS
9GEN ERAL PURPOSE TIM ERS
The GPTs are flexible multifunctional timer/counters used f or time-related tasks such as e vent
timing and counting, pulse width and duty cycle measurements, pulse generation or pulse
multiplication. The GPT unit contains five 16-bit timers, organized in two separate modules,
GPT1 and GPT2. Each timer in each module m ay operate independently in a number of
different modes, or may be concatenated with another timer of the same module.
9.1 GPT1
Each of the three timers T2, T3, T4 of the GPT1 module can be configured individually f or one
of four basic modes of operation: timer, gated timer, counter mode and incremental interface mode. In timer mode, the input clock for a timer is derived from the CPU clock,
divided by a programmable prescaler. In counter mode, the timer is clocked in reference to
external events. Pulse width or duty cycle measurement is supported in gated timer mode
where the operation of a timer is controlled by the ‘gate’ level on an external input pin. For
these purposes, each timer has one associated port pin (TxIN) which serves as gate or clock
input. Table 5 GPT1 timer input frequencies, resolution and periods lists the timer input
frequencies, resoluti on and periods f or eac h pre-s caler option at 50MHz CPU cl oc k. T his al so
applies to the Gated Timer Mode of T3 and to the auxiliary timers T2 and T4 in Timer and
Gated Timer Mode
The count direction (up/down) for each timer is programmable by software or may additionally
be altered dynamically by an external signal on a port pin (TxEUD).
In Incremental Interface Mode, the GPT1 timers (T2, T3, T4) can be directly connected to the
incremental position sensor signals A and B by their respective inputs TxIN and TxEUD.
Direction and count signals are internally derived from these two input signals so that the
contents of the respective timer Tx corresponds to the sensor position. The third position
sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has output toggle latches (TxOTL) which changes state on each timer over-flow/
underflow. The state of this latch may be output on port pins (TxOUT) e. g. for time out
monitoring of external hardware components, or ma y be used internally to clock timers T2 and
T4 for measuring long time periods with high resolution.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload or
capture registers f or timer T3. When used as capture or reload registers, timers T2 and T4 are
stopped. The contents of timer T3 is captured into T2 or T4 in response to a signal at their
associated input pins (TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered
either by an ex ternal signal or by a selectabl e state transiti on of its toggle latch T3O TL. When
both T2 and T4 are configured to alternately reload T3 on opposite state tr ansitions of T 3O T L
with the low and high times of a PWM signal, this signal can be constantly generated without
software intervention.
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Page 20
ST10R172L - GENERAL PURPOSE TIMERS
Timer input selection
F
=50MHz
CPU
000b001b010b011b100b101b110b111b
Prescaler
81632641282565121024
Factor
Input
Frequency
6.25 MHz 3.125
MHz
1.5625
MHz
781
KHz
391
KHz
195
KHz
97.5
KHz
48.83
KHz
Resolution160ns320ns640ns1.28 us 2. 56 us5.12 us10.24 us 20.48 us
Period10.49ms20 .97 ms41 .94 ms83 .88ms168ms336m s672ms1. 342s
Table 5 GPT1 timer input frequencies, resolution and periods
T2EUD
CPU Clock
T2IN
CPU Clock
T3EUD
T3IN
T4IN
CPU Clock
T4EUD
2n n= 3 ...10
n
n= 3 ...10
2
n
n= 3 ...10
2
T2
Mode
T3
Mode
T4
Mode
GPT1 Timer T2
Reload
Capture
GPT1 Timer T3
U/D
Capture
Reload
GPT1 Timer T4
U/D
Interrupt
Request
T3OUT
T3OTL
Interrupt
Request
Interrupt
Request
U/D
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Figure 5 GPT1 block diagram
Page 21
ST10R172L - GENERAL PURPOSE TIMERS
9.2 GPT2
The GPT2 module provides precise event control and time measurement. It includes two
timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an
input clock derived from the CPU clock via a programmable prescaler or with e xternal signals.
The count direction (up/down) for each timer is programmable by software or altered
dynamically by an exter nal signal on a port pin (TxEUD). Concatenation of the timers is
supported by the output toggle latch (T6OTL) of timer T6, which changes its state on each
timer overflow/underflow.
The state of T6OT L may be used to cloc k timer T5, or ma y be output on a port pin T6OUT. The
overflow s/underflows of timer T6 reload the CAPREL register. The CAPREL register captures
the contents of T5 based on an external signal transition on the corresponding port pin
(CAPIN), and timer T5 may optionally be cleared after the capture procedure. This allows
absolute time differences to be measured or pulse multiplication to be performedwithout
software overhead.
Timer input selection
F
=50MHz
CPU
000b001b010b011b100b101b110b111b
Prescaler
Factor
Input
Frequency
Resolution80ns160 ns320ns640ns1.28 us 2.56 us5.12 us10.24 us
Period5.24ms10.49ms20.97ms41.94ms8 3.88 ms167.7ms335.5m s671m s
48163264128256512
12.5 MHz 6.25 MHz 3.125
MHz
1.563
MHz
781
KHz
391
KHz
195
KHz
97.6
KHz
Table 6 GPT2 timer input frequencies, resolution and periods
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Page 22
ST10R172L - SERIAL CHANNELS
T5EU D
CPU Clock
T5IN
CAPIN
T6IN
CPU Clock
T6EUD
2n n=2...9
n
n=2...9
2
U/D
T5
GP T2 Timer T5
Mode
Clear
Capture
GPT2 CAPREL
T6
Mode
GPT2 Timer T6
U/D
Figure 6 GPT2 block diagram
Reload
Toggle FF
T60TL
Inte rr upt
Request
Interrupt
Request
Inte rr upt
Request
T6OUT
10SERIAL CHANNELS
Serial communication with other microcontrollers, proces sors, terminals or external peripheral
components is provided by two serial interfaces with different functionality, an Asynchronous/
Synchronous Serial Channel (ASC0) and a Synchronous Serial Port (SSP).
ASC0
A dedicated baud rate generator sets up standard baud rates without oscillator tuning. 3
separate interrupt vectors are provided for transmission, reception, and erroneous reception.
In asynchronous mode, 8- or 9-bit data frames are transmitted or received, preceded by a start
bit and terminated by one or two stop bits. Fo r multiprocessor comm unication, a mechanism
to distinguish address from data bytes has been included (8-bit data + wake up bit mode).
In synchronous mode, the ASC0 transm its or receives bytes (8 bits) synchronously to a s hift
clock which is generated by the ASC0. The ASC0 always shifts the LSB first. A loop back
option is available for testing purposes.
A number of optional hardware error detection capabilities have been included to increase the
reliability of data transfers. A parity bit can be generated automatically on transmission, or
checked on reception. Framing error detection recognizes data frames with missing stop bits.
An overrun error is generated if the last character received was not read out of the receive
buffer register at the time the reception of a new character is complete.The table below lists
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Page 23
ST10R172L - SERIAL CHANN ELS
various commonly used baud rates together with the required reload values and the deviation
errors compared to the intended baudrate.
Table 7 Commonly used baud rates, required reload values and deviation errors
SSP transmits 1...3 bytes or receives 1 byte after sending 1...3 bytes synchronously to a shift
clock which is generated b y the SSP. T he SSP can s tart shifting with the LSB or with the MSB
and is used to select shifting and latching clock edges, and clock polarity . Up to two chip select
lines may be activ ated in order to direct data transf ers to one or both of two peripheral devices.
When the SSP is enabled, the four upper pins of Port4 can not be used as general purpose
IO. Note that the segment address selection done via the system st art-up configuration during
reset has priority and overrides the SSP functions on these pins.
SSPCKS ValueSynchronous baud rate
000SSP clock = CPU clock divided by 225 MBit/s
001SSP clock = CPU clock divided by 412.5 MBit/s
010SSP clock = CPU clock divided by 86.25 MBit/s
Table 8 Synchronous baud rate and SSPCKS reload values
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Page 24
ST10R172L - WATCHDOG TIMER
SSPCKS ValueSynchronous baud rate
011SSP clock = CPU clock divided by 163.13 MBit/s
100SSP clock = CPU clock divided by 321.56 MBit/s
101SSP clock = CPU clock divided by 64781 KBit/s
110SSP clock = CPU clock divided by 128391 KBit/s
111SSP clock = CPU clock divided by 256195 KBit/s
Table 8 Synchronous baud rate and SSPCKS reload values
11WATCHDOG TIMER
The Watchdog Timer is a fail-safe mechanism which limits the malfunction time of the
controller . The Watchdog Timer is always enabled after device reset and can only be disabled
in the time interval until the EINIT (end of initialization) instruction has been executed. In this
way, the chip’s start-up procedure is always monitored. The software must be designed to
service the Watchdog Timer before it overflows. If, due to hardware or software related
failures, the software fails to maintain the Watchdog Timer, it will overflow generating an
internal hardware reset and pulling the RSTOUT
components.
pin low to reset external hardware
The Watchdog Timer is a 16-bit timer, clocked with the system clock divided either by 2 or by
128. The high byte of the Watchdog Timer register can be set to a pre-specified reload value
(stored in WDTREL) in order to allow further variation of the monitored time interval. Each
time it is serviced by the application software, the high byte of the Watchdog Timer is
reloaded. The table below shows the watchdog time range which for a 50MHz CPU clock
rounded to 3 significant figures.
Reload value
in WDTREL
FF
H
00
H
Prescaler for f
2 (WD TIN = ‘0’ )128 (WDTIN = ‘ 1 ’)
10.24 µs655 µs
2.62 ms168 ms
CPU
Table 9 Watchdog timer range
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Page 25
ST10R172L - SYSTEM R ESET
12SYSTEM RESET
The following type of reset are implemented on the ST10R172L:
Asynchronous hardware reset: Asynchronous reset does not require a stabilized clock
signal on XTAL1 as it is not internally resynchronized, it resets the microcontroller into its
default reset state. Asynchronous reset is required on chip power-up and can be used during
catastrophic situations. The rising edge of the RSTIN pin is internally resynchronized before
exiting the reset condition, therefore, only the entry to hardware reset is asynchronous.
Synchronous hardware reset (warm reset): A war m synchronous hardware reset is
triggered when the reset input signal RSTIN
immediately (asynchronously) set in high impedance, RSTOUT
negation is detected, a short transition period elapses, during which pending internal hold
states are cancelled and any current internal access cycles are completed, external bus
cycles are aborted. Then, the internal reset sequence is active for 1024 TCL (512 CPU clock
cycles). During this reset sequence, if bit BDRSTEN was previously set by software (bit 5 in
SYSCON register), RSTIN
pin is driven low and internal reset signal is asserted to reset the
microcontroller in its default state . Note that after all reset sequence, bit BDRSTEN is cleared.
After the reset sequence has been completed, the RSTIN input is sampled. When the reset
input signal is active at that time the internal reset condition is prolonged until RSTIN
becomes inactive.
is latched low and Vpp pin is high. The I/Os are
is driven low. After RSTIN
Software reset: The reset sequence can be trigger ed at any time by the protected
instruction SRST (software reset). This instruction can be executed deliberately within a
program, e.g. to leave bootstrap loader mode, or on a hardware trap that reveals a system
failure. As for a synchronous hardware reset, the reset sequence lasts 1024 TCL (512 CPU
clock cycles), and drives the RSTIN
pin low.
Watchdog timer reset: When the watchdog timer is not disabled during the initialization or
serviced regularly during program execution it will overflow and trigger the reset sequence.
Unlike hardware and software resets, the watchdog reset completes a running external bus
cycle if this bus cycle does not use READY
programmed waitstates. When READY
, or if READY is sampled active (low) after the
is sampled inactive (high) after the programmed
waitstates the running external bus cycle is aborted. Then the internal reset sequence is
started. The watchdog reset cannot occur while the ST10R 172L is in bootstrap loader mode.
Bidirectional reset: This reset makes the watchdog timer reset and software reset
externally visible. It is active for the duration of an internal reset sequences caused by a
watchdog timer reset and software reset. Therefore, the bidirectional reset transforms an
internal watchdog timer reset or software reset into an external hardware reset with a
minimum duration of 1024 TCL.
13POWER REDUCTION MODES
Two different power reduction modes with different levels of power reduction can be entered
under software control.
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ST10R172L - SPECIAL FUNCTION REGISTERS
In Idle mode the CPU is stopped, while the peripherals continue their operation. Idle mode
can be terminated by any reset or interrupt request.
In Po wer Do wn mod e both the CPU and the peripheral s are stopped. P o wer Down mode can
now be configured by software in order to be terminated only by a hardware reset or by an
external interrupt source on fast external interrupt pins.
All external bus actions are completed before Idle or Power Down mode is entered. However,
Idle or Power Down mode is not entered if READY is enabled, but has not been activated
(driven low f or negativ e polarity, or driven high for positiv e pol arity) during the last bus access.
14SPECIAL FUNCTION REGISTERS
The following table lists all ST10R172L SFRs in alphabetical order.
Bit-addressable SFRs are marked with the letter “b” in column “Name”. SFRs within the
Extended SFR-Space (ESFRs) are marked with the letter “E” in column “Physical Address”.
An SFR can be specified by its individual mnemonic name. Depending on the selected
addressing mode, an SFR can be accessed by its physical address (using the Data Page
Pointers), or by its short 8-bit address (without using the Data Page Pointers).
CC10ICbFF8ChC6hEX2IN Interrupt Control Register00 00h
Table 10 Special functional registers
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ST10R172L - SPECIAL FUNCTION REGISTERS
Name
CC11ICbFF8E hC7hEX3IN Interrupt Control Register0000h
CPFE10h08hCPU Context Pointer RegisterFC00h
CRICbFF6AhB5hGPT2 CAPREL Interrupt Control Register0000h
CSPFE08h04hCPU Code Segment Pointer Register (read only)0000h
DP0LbF100hE80hP0L Direction Control Register00h
DP0HbF102hE81hP0h Direction Control Register00h
DP1LbF104hE82hP1L Direction Control Register00h
DP1HbF106hE83hP1h Direction Control Register00h
DP2bFFC2hE1hPort 2 Direction Control Register-0--h
DP3bFFC6hE3hPort 3 Direction Control Register 0000h
DP4bFFCAhE5hPort 4 Direction Control Register00h
DP6bFFCEhE7hPort 6 Direction Control Register00h
Physical
Address
8-Bit
Address
Description
Reset
Value
DP7bFFD2hE9hPort 7 Direction Control Register-0h
DPP0FE00h00hCPU Data Page Po inter 0 Register (10 bits)00 00h
DPP1FE02h01hCPU Data Page Po inter 1 Register (10 bits)00 01h
DPP2FE04h02hCPU Data Page Po inter 2 Register (10 bits)00 02h
DPP3FE06h03hCPU Data Page Po inter 3 Register (10 bits)00 03h
EBUSCON bF10EhE87HExtended BUSC O N register0000h
EXICONbF1C0hEE0hExternal Interrupt Control Register0000h
IDCHIPF07ChE3EhDevice Identifier Register1101h
IDMANUFF07EhE3FhManufacturer/Process Identifier Register0201h
IDMEMF07AhE3DhOn-chip Memory Identifier Register0000h
IDPROGF078hE3ChProgramming Voltage Identifier Register0000h
MDCbFF0Eh87hCPU Multiply Divide Control Register0000h
MDHFE0Ch06hCPU Multiply Divide Register – High Word0000h
ODP2bF1C2hEE1hPort 2 Open Drain Control Register-0--h
ODP3bF1C6hEE3hPort 3 Open Drain Control Register0000h
ODP6bF1CEhEE7hPort 6 Open Drain Control Register00h
ODP7bF1D2hEE9hPort 7 Open Drain Control Register-0h
ONESFF1Eh8FhConstan t Value 1’s Register (read only)FFFFh
P0LbFF00h80hPort 0 Low Register (Lower half of PORT0)00h
P0HbFF02h81 hPort 0 High Register (Upper half of PORT0)00h
P1LbFF04h82hPort 1 Low Register (Lower half of PORT1)00h
P1HbFF06h83 hPort 1 High Register (Upper half of PORT1)00h
P2bFFC0hE0hPort 2 Register (4 bits)-0--h
P3bFFC4hE2hPort 3 Register0000h
P4bFFC8hE4hPort 4 Register (8 bits)00h
Physical
Address
8-Bit
Address
Description
Reset
Value
P5bFFA2hD1hPort 5 Register (read only)XXXXh
P6bFFCChE6hPort 6 Register (8 bits)00h
P7bFFD0hE8hPort 7Register (4 bits)-0h
PECC0FEC0h60hPEC Channel 0 Control Register0000h
PECC1FEC2h61hPEC Channel 1 Control Register0000h
PECC2FEC4h62hPEC Channel 2 Control Register0000h
PECC3FEC6h63hPEC Channel 3 Control Register0000h
PECC4FEC8h64hPEC Channel 4 Control Register0000h
PECC5FECAh65hPEC Channel 5 Control Register0000h
PECC6FECCh66hPEC Channel 6 Control Register0000h
PECC7FECEh67hPEC Channel 7 Control Register0000h
PP3F03EhE1FhPWM Module Period Register 30000h
PSWbFF10h88hCPU Program Status Word0000h
PW3FE36h1BhPW M Module Pulse Widt h Register 30000h
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Table 10 Special functional registers
Page 29
ST10R172L - SPECIAL FUNCTION REGISTERS
Name
Physical
Address
8-Bit
Address
Description
Reset
Value
PWMCON0 bFF30h98hPWM Module Control Register 000 00h
PWMCON1 bFF32h99hPWM Module Control Register 100 00h
PWMICbF17EhEBFhPW M Module Interr upt Control Register00 00h
RP0HbF108 hE84hSystem Start-up Configuration Register (Rd. only) XXh
S0BGFEB4h5AhSerial Channel 0 baud rate generator reload reg0000h
S0CONbFFB0hD8hSer ial Channel 0 Control Register0000h
S0EICbFF70 hB8 hSerial Channel 0 Error Interrupt Control Register0000h
S0RBUFFEB2h59hS erial Channel 0 receive buffer reg. (rd only)XXh
S0RICbFF6EhB7hSerial Channel 0 Receive Interrupt Control Reg.00 00h
S0TBICbF19C h
E
CEhSerial Channel 0 transmit buffer interrupt control
0000h
reg
S0TBUFFEB0h58hSerial Channel 0 transmit buffer register (wr only)00h
S0TICbFF6ChB6hSerial Channel 0 Transmi t Interrupt Control Regis-
0000h
ter
SPFE12h09hCPU System Stack Pointer RegisterFC00h
SSPCON0EF00hX---SSP Control Register 00000h
SSPCON1EF02hX---SSP Control Register 10000h
SSPRTBEF04hX---SSP Receive/ Transmit Bu fferXXXXh
SSPTBHEF06hX---SSP Transmit Buffer HighXXXXh
STKOVFE 14 h0AhCPU Stack Overflow Pointer RegisterFA00h
STKUNFE16h0BhCPU Stack Underflow Pointer RegisterF C00h
SYSCONbFF12h89hCPU System Configuration Register
0xx0h
T2FE40h20 hGPT1 Timer 2 Register0000h
T2CONbFF40hA0hGPT1 Timer 2 Control Register0000h
T2ICbFF60hB0hGPT1 Timer 2 Interrupt Control Register0000h
T3FE42h21 hGPT1 Timer 3 Register0000h
T3CONbFF42hA1hGPT1 Timer 3 Control Register0000h
Table 10 Special functional registers
1)
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ST10R172L - SPECIAL FUNCTION REGISTERS
Name
T3ICbFF62hB1hGPT1 Timer 3 Interrupt Control Register0000h
T4FE44h22 hGPT1 Timer 4 Register0000h
T4CONbFF44hA2hGPT1 Timer 4 Control Register0000h
T4ICbFF64hB2hGPT1 Timer 4 Interrupt Control Register0000h
T5FE46h23 hGPT2 Timer 5 Register0000h
T5CONbFF46hA3hGPT2 Timer 5 Control Register0000h
T5ICbFF66hB3hGPT2 Timer 5 Interrupt Control Register0000h
T6FE48h24 hGPT2 Timer 6 Register0000h
T6CONbFF48hA4hGPT2 Timer 6 Control Register0000h
T6ICbFF68hB4hGPT2 Timer 6 Interrupt Control Register0000h
TFRbFFA ChD6hTrap Flag Register0000h
WDTFEAEh57hWatchdog Timer Register (read only)0000h
WDTCONFFAEhD7hWatchdog Timer Control Register
Physical
Address
8-Bit
Address
Description
Reset
Value
000xh
2)
XP1ICbF18E hEC7hSSP Interrupt Control Register0000h
XP3ICbF19EhECFhPLL unlock Interrupt Control Register0000h
ZEROSbFF1Ch8EhConstant Value 0’s Register (read only)0000h
Table 10 Special functional registers
Note1. The sy stem configuration is selected during reset.
Note2. Bit WDTR indicates a watchdog timer triggered reset.
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ST10R172L - ELECTRICAL CHARACTERISTICS
15ELECTRICAL CHARACTERISTICS
15.1 Absolute Maximum Ratings
Ambient temperature under bias (TA):......................................................-40°C to +85 °C
•
•Storage temperature (T
•Voltage on V
pins with respect to ground (VSS):..................................... – 0.5 to +4.0 V
DD
•Voltage on any pin with respect to ground (V
•Voltage on any 5V tolerant pin with respect to ground (V
•Voltage on any 5V fail-safe pin with respect to ground (V
):.......................................................................– 65 to +150 °C
ST
): ................................ –0.5 to VDD +0.5 V
SS
): .......................–0.5 to 5.5 V
SS
): .......................–0.5 to 5.5 V
SS
•Input current on any pin during overload condition: ..................................–10 to +10 mA
•Absolute sum of all input currents dur ing overload condition: .............................|100 mA|
•Power dissipation:.....................................................................................................1.0 W
NoteStresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not guaranteed. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. During
overload conditions (V
) must not exceed the values defined by the Absolute Maximum Ratings.
(V
SS
IN>VDD
The parameters listed in thi s section represent both the ST10R172L controller characteristics
and the system requirements. To aid parameters interpretation in design evaluation, the a
symbol column is marked:
or VIN<VSS) the voltage on pins with respect to ground
CC for Controller Characteristics: The ST10R172L logic provides signals with the
respective timing characteristics.
SR for System Requirement:The external system must provide signals with the
respective timing characteristics to the ST10R172L.
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ST10R172L - ELECTRICAL CHARACTERISTICS
Remarks on 5 volt tolerant (5T ) and 5 v olt fail-safe (5S) pins
The 5V tolerant input and output pi ns can sustain an absol ute maximum exte rnal voltage of
5.5V.
However, signals on unterminated bus lines might have overshoot above 5.5V, presenting
latchup and hot carrier ris ks. Whi le these r isks are under evaluation, observe the followi ng security recommendations:
•Maximum peak voltage on 5V tolerant pin with respect to ground (V
)= +6 V
SS
•If the ringing of the external signal exceeds 6V, then clip the signal to the 5V supply.
Power supply failure condition
The power supply failure condition is a state where the chip is NOT supplied but is connected
to active signal lines. There are several cases:
•3.3V external lines on 3.3V (3T) pin on the non powered chip:...............NOT Acceptable
•3.3V external lines on 5V tolerant (5T) pin on the non powered chip:............. Acceptable
The 5V tolerant buffer do not leak: external signals not altered. No reliability problem.
•3.3V external lines on 5V fail-safe (5S) pin on the non powered chip: ............Acceptable
The 5V tolerant buffer do not leak: external signals not altered. No reliability problem.
•5.5V external lines on 5V tolerant (5T) pin on the non powered chip:............. Acceptable
For VERY SHORT times only: the buffers do not leak (external signals not altered) but
there is a fast degr adati on of the gate oxides in the buffers. The total maximum ti me under
this stress condition is 2 days. This limits this configuration to shor t power-up/down
sequences. For 10 year life time, the maximum duty factor is 1/1800 allowing e.g. a
maximum stress duration of 48 seconds per day.
•5.5V external lines on 5V fail-safe (5S) pin on the non powered chip: ............Acceptable
•6V transient signals on 5V tolerant (5T) pin on the non powered chip:...NOT Acceptable
•6V transient signals on 5V fail-safe (5S) pin on the non powered chip:.......... Ac ceptable
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ST10R172L - ELECTRICAL CHARACTERISTICS
15.2 DC Characteristics
V
= 3.3V ± 0.3VVSS = 0 V Reset activeTA = -40°C to +85 °C°
DD
Limit Values
ParameterSymbol
min.max.
UnitTest Condition
Input low voltage
Input high voltage
(all except RSTIN
Input high voltage RSTIN,
and XTA L1)
RPD
Input high voltage XTA L1
Output low voltage
(ALE, RD
RSTIN
, WR, BHE, CLKOUT,
,RSTOUT, CSX)
Output low voltage
(all other outputs)
Output high voltage
ALE, RD
RSTIN
Output high voltage
, WR, BHE, CLKOUT,
,RSTOUT, CSX)
1)
(all other outputs)
Input leakage current (3T pins)
Input leakage current (5T, 5S
pins)
V
V
V
V
V
V
V
V
I
OZ
I
OZ1
SR– 0.30.8V–
IL
SR2.0
IH
SR
IH1
SR
IH2
CC–0.4V
OL
CC–0.4V
OL1
CC2.4–V
OH
CC2.4–V
OH1
0.6
0.7
V
DD
V
DD
V
+ 0.3
DD
V
+ 0.3
DD
V
+ 0.3
DD
CC–±10µA
CC–±10
7)
±100
V–
V–
V–
I
= 4 mA
OL
I
= 2 mA
OL1
I
= –4 mA
OH
I
= – 2mA
OH
0 V<
V
µA
µA
0 V<
V
VDD<VIN<5.0V
IN<VDD
IN<VDD
7)
RSTIN pull-up resistor
2)
Read/Write pullup current
Read/Write pullup current
ALE pulldown current
ALE pulldown current
Port 6 (C S
Port 6 (C S
) pullup current
) pullup current
3
3
R
3)
3
3
3
I
RWH
I
RWL
I
ALEL
I
ALEH
I
P6H
I
P6L
CC2030 0kΩ
RST
4)
5)
4
5
4
5
–-40µA
-500–µA
40–µA
–500µAV
–-40µAV
-500–µA
V
= 0 V
IN
V
= 2.4 V
OUT
V
= 0.4 V
OUT
V
= 0.4 V
OUT
= 2.4 V
OUT
= 2.4 V
OUT
= 0.4 V
V
OUT
Table 11 DC characteristics
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ST10R172L - ELECTRICAL CHARACTERISTICS
Limit Values
Parame terSymbol
min.max.
UnitTest Condition
PORT0 configuration current
RPD pulldown current
3
2
XTA L1 input current
Pin capacitance
6)
(digital inputs/outputs)
Power supply current
Idle mode supply current
Power-down mode supply current
I
P0H
I
P0L
I
RPD
I
IL
C
I
CC
I
ID
I
PD
4
5
5
–-4µAVIN = V
-50–µAVIN = V
100500µAV
CC–±20µA
CC–10pF
IO
–15 +
2.5 * f
–10 +
0.9 * f
8
–200µA
CPU
CPU
mA
mA
OUT
0 V <
f = 1 MHz
T
= 25 °C
A
f
in [MHz]
CPU
RSTIN
f
in [MHz]
CPU
V
= 3.6 V
DD
Table 11 DC characteristics
1) This specification is not valid for outputs which are switched to open drain mode. In this case
the resp ec ti ve out pu t w ill fl oa t and the re su lti n g vo ltage comes from the extern al c ir c uitry .
IHmin
ILmax
= V
V
IN
= V
DD
< V
IH1
DD
7))
7
9
2) This specification is only valid during reset, or interruptible power-down mode, after reception of an exte r nal in t e rr up t signal that will wak e u p the CPU.
3) This specification is only valid during reset, hold or adapt-mode. Port 6 pins are only affected
if they are used for CS
output and the open drain function is not enabled.
4) The maximum current may be drawn while the signal line remains inactive.
5) The minimum current must be drawn in order to drive the signal line active.
6) Not 100% tested, guaranteed by design characterization.
7) Supply current is a function of operating frequency as illustrated in Figure 7 on page 35.
This parameter is tested at V
and all inputs at V
or VIH with an infinite execution of NOP instruction fetched from external
IL
max and 50 MHz CPU clock with all outputs disconnected
DD
memory (16-bit dem ux bus mode, no waitstates, no memory tri-state waitstates, normal
ALE).
8) Typical value at 25°C = 20µA.
9) This parameter is tested including leakage currents. All inputs (including pins configured as
inputs) at 0 V to 0.1 V or at V
– 0.1 V to VDD, V
DD
= 0 V, all outputs (including pins con-
REF
figured as outputs) disconnected.
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Page 35
Supply/idle current [mA]
200
150
100
ST10R172L - ELECTRICAL CHARACTERISTICS
I
CCmax
I
IDmax
15
1020
3040
50
f
Figure 7 Supply/idle current vs operating frequency
CPU
[MHz]
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ST10R172L - ELECTRICAL CHARACTERISTICS
15.3 AC Characteristics
Test conditions
Input pulse levels:........................................................................................... 0 to +3.0 V
•
•Input rise and fall times (10%-90%):........................................................................ 2.5 ns
•Input timing reference levels:................................................................................. +1.5 V
•Output timing reference levels:.............................................................................. +1.5 V
For timing purposes a port pin is no longer floating when a 150 mV change from load
voltage occurs, but begins to float when a 150 mV change from the loaded VOH/VOL
level occurs.
CL is 5 pF for floating measurements only.
Figure 10 Float waveforms
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ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.1 Cpu Clock Generation Mec hani sm s
ST10R1 72L intern al ope ration is c ontrol led by the C PU cloc k f
. Both edges of the CPU
CPU
clock can trigger internal (e.g. pipeline) or external (e.g. bus cycles) operations. The external
timing (AC Characteristics) specification therefore depends on the time between two c onsec-
utive edges of the CPU clock, called “TCL” (see figure below).
The CPU clock signal can be generated by different mechanism s. The duration of TCLs and
their variation (and also the external timing) depends on the f
generation mechanism. This
CPU
must be considered when calculating ST10R172L timing.
The CPU clock generation mechanism is set during reset by the logic levels on pins P0.15-13
(P0H.7-5).
Phase Locked Loop Operation (PLL factor=4)
f
XTAL
f
CPU
TCLTCL
Direct Clock Drive
f
XTAL
f
CPU
Prescaler Operation
f
XTAL
f
CPU
Figure 11 CPU clock generation mechanisms
P0.15-13 (P0H.7-5)
111
110
101
Table 12 CPU clock generation mechanisms
CPU frequency
= f
f
CPU
F
* 4
XTAL
F
* 3
XTAL
F
* 2
XTAL
XTAL
* F
TCLTCL
TCLTCL
External clock
input range 10-
Notes
50MHz
2.5 to 12.5 MHzDefault configuration
3.33 to 16.66 MHz
5 to 25 MHz
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ST10R172L - ELECTRICAL CHARACTERISTICS
External clock
input range 1050MHz
2 to 10 MHz
1 to 50 MHz
6.66 to 33.33 MHz
2 to 100 MHzCPU clock via 2:1 prescaler
Notes
Direct drive
1)
P0.15-13 (P0H.7-5)
100
011
010
001
000
CPU frequency
f
= f
CPU
F
* 5
XTAL
F
* 1
XTAL
F
* 1.5
XTAL
F
/ 2
XTAL
F
* 2.54 to 20 MHz
XTAL
XTAL
* F
Table 12 CPU clock generation mechanisms
1) The maximum depends on the duty cycle of the external clock signal. The maximum input frequency is 25 MHz when using an ex ternal crystal oscillator, but
higher frequencies can be applied with an external clock source.
Prescaler operation
Set when pins P0.15-13 (P0H.7-5) equal ’001’ during reset, the CPU clock is derived from the
internal oscillator (input clock signal) by a 2:1 prescaler.
The frequency of f
duration of an individual TCL) is defined by the period of the input clock f
is half the frequency of f
CPU
and the high and low time of f
XTAL
XTAL
(i.e. the
CPU
.
The timings listed in the AC characteristics that refer to TCLs therefore can be calculated
using the period of f
for any TCL.
XTAL
Note that if the bit OWDDIS in SYSCON register is cleared, the PLL r uns on i ts free-running
frequency and delivers the clock signal for the Oscillator Watchdog. If bit OWDDIS is set, then
the PLL is switched off.
Direct drive
When pins P0.15-13 (P0H.7-5) equal ’011’ during reset, the on-chip phase locked loop is
disabled and the CPU clock is driven from the internal oscillator with the input clock signal.
The frequency of f
(i.e. the duration of an individual TCL) is defined by the duty cycle of the input clock f
The TCL timing below must be calculated using the minimum possible TCL which can be
calculated by the formula:
For two consecutive TCLs the deviation caused by the duty cycle of f
the duration of 2TCL is always 1/f
only once for timings that require an odd number of TCLs (1,3,...). Timings that require an
even number of TCLs (2,4,...) may use the formula: .
directly follows the frequency of f
CPU
TCL
min
1 f
⁄DC
. Therefore, the minimum value TCL
XTAL
×DC(=duty cycle)=
XTAL
XTAL
min
2TCL1 f
so the high and low time of f
XT AL
is compensated so
XTAL
has to be used
min
⁄=
XTAL
CPU
.
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ST10R172L - ELECTRICAL CHARACTERISTICS
NoteThe addr ess float timings in M u ltiplexed bus mode (t11 and t45) use
TCL
max
1 f
⁄DC
×=TCL
XTAL
instead of .
max
min
Note that if the bit OWDDIS in SYSCON register is cleared, the PLL r uns on i ts free-running
frequency and delivers the clock signal for the Oscillator Watchdog. If bit OWDDIS is set, then
the PLL is switched off.
Oscillator Watchdog (OWD)
When the clock option s elected i s direc t driv e or dir ect driv e w ith prescaler, in order to provide
a fail safe mechanism in case of a loss of the external clock, an oscillator watchdog is
implemented as an additional functionality of the PLL circuitry. This oscillator watchdog
operates as follows:
After a reset, the Oscillator Watchdog is enabled by default. To disable the OWD, set bit 4 of
SYSCON register OWDDIS.
When the OWD is enabled, the PLL runs on its free-running frequency and increments the
Oscillator Watchdog counter. On each transition of the XTAL1 pin, the Oscillator Watchdog is
cleared. If an external clock failure occurs, then the Oscillator Watchdog counter overflows
(after 16 PLL clock cycles). The CPU clock signal will be switched to the PLL free-running
clock signal, and the Oscillator Watchdog Interrupt Request (XP3INT) is flagged. The CPU
clock will not s witch back to the e xternal clock ev en if a valid e xternal clock e xits on XTAL1 pin.
Only a hardware reset can switch the CPU clock source back to direct clock input.
When the OWD is disabled, the CPU clock is always f ed from the oscillator input and the PLL
is switched off to decrease power supply current.
Phase locked loop
For all other combinations of pins P0.15-13 (P0H.7-5) during reset the on-chip phase locked
loop is enabled and provides the CPU clock. The PLL multiplies the input frequency by the
factor F which is selected via the combination of pins P0.15-13 (i.e. f
ever y F ’th transition of f
this way, f
of f
which affects individual TCL duration.Therefore, AC characteristics that refer to TCLs
CPU
is constantly adjusted so it is locked to f
CPU
the PLL circuit synchronizes the CPU clock to the input clock. In
XT AL
. The slight variation causes a jitter
XTAL
must be calculated using the minimum possible TCL.
The actual minimum value for TCL depends on the jitter of the PLL. As the PLL constantly
adjusts its output frequency, it corresponds to the applied input frequency (crystal or
oscillator). The relative de viation for periods of more than one TCL is lower than for one single
TCL. For a period of
deviation D
:
N
N
* TCL the minimum value is computed using the corresponding
TCL
TCL
min
D
N
NOM
4N15⁄–()%[]±=
1DN100⁄–()×=
CPU
= f
* F). With
XTAL
40/68
1
Page 41
ST10R172L - ELECTRICAL CHARACTERISTICS
where N = number of consecutive TCLs and 1 ≤ N ≤ 40. So f or a period of 3 TCLs (i.e. N = 3):
D
4315⁄–=
3
3.8%=
and
3TCL
min
3TCL
3TCL
NOM
NOM
13.8 100⁄–()×=
0.962 36.07nsec @fcpu=50MHz()×=
PLL jitter is an important factor for b us cycles using wai tstates and for the operation of timers,
serial interfaces, etc. For slower operations and longer periods (e.g. pulse train generation or
measurement, lower baudrates, etc.) the deviation caused by the PLL jitter is negligible.
M a x .jitter [%]
±
4
±
3
±
2
±
1
This formula is valid for 1<N<40 and 10<f
42
8
cpu
<50
3216
N
Figure 12 Approximated maximum PLL jitter
41/68
1
Page 42
ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.2 Memory Cycle V ar i abl es
The timing tables below use three variables derived from the BUSCONx registers and
represent programmed memory cycle characteristics. Table 13 describes how these v ariables
are computed.
DescriptionSymbolValues
ALE Extension
Memory Cycle Time Waitstates
Memory Tristate Time
t
A
t
C
t
F
TCL * <ALECTL>
2TCL * (15 - <MCTC>)
2TCL * (1 - <MTTC>)
Table 13 Memory cycle variables
42/68
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Page 43
ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.3 Multiplexed Bus
V
= 3.3 V ± 0.3 VVSS = 0 VTA = -40°C to +85 °CCL = 50 pF
DD
ALE cycle time = 6 TCL + 2
t
+ tC + tF (60 ns at 50-MHz CPU clock without waitstates)
A
ParameterSymbol
ALE high time
Address (P1, P4), BHE
CC
t
5
CC
t
6
setup to ALE
Address (P0) setup to ALE
Address hold after ALE
ALE falling edge to RD
WR
(with RW-delay)
ALE falling edge to RD
(no RW-delay)
WR
Address float after RD
(with RW-delay)
Address float after RD
(no RW-delay)
1
,
,
,
1)
,
t
t
t
t
t
t
6m
7
8
9
10
11
CC
CC
CC
CC
CC–
CC–
Max. CPU Clock
= 50 MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
7 +
3 +
5 +
5 +
5 +
-5 +
t
A
t
A
t
A
t
A
t
A
t
A
–
–
–
–
–
–
5
15
1
1
TCL - 3 +
TCL - 7 +
TCL - 5 +
TCL - 5 +
TCL - 5 +
-5 +
t
A
–
–
t
t
t
t
t
–ns
A
–ns
A
–ns
A
–ns
A
–ns
A
–ns
1
5
TCL + 5
Unit
ns
1
ns
RD
, WR low time
(with RW-delay)
, WR low time
RD
(no RW-delay)
RD
to valid data in
(wit h RW-del ay)
to valid data in
RD
(no RW-delay)
ALE low to va lid data in
Address to valid data in
CC
t
12
t
13
t
14
t
15
t
16
t
17
13 +
CC
23 +
SR–
SR–
SR–15
SR–20
Table 14 Mult iplexed bus
t
t
–
C
–
C
5 +
t
C
t
15 +
C
2TCL - 7+
t
3TCL - 7 +
–2TCL - 15
–3TCL - 15
–3TCL - 15
+
t
+ t
A
C
–4TCL - 20
+
2t
+ t
A
C
–ns
C
–ns
t
C
ns
+
t
C
ns
+
t
C
ns
+
t
+ t
A
C
ns
+
2t
+ t
A
C
43/68
1
Page 44
ST10R172L - ELECTRICAL CHARACTERISTICS
ParameterS ymbol
Data hold after RD
SR0–0–ns
t
18
rising edge
Data float after RD
12))
edge
rising
Data valid to WR
Data hold after WR
ALE rising edge after RD
,
SR–
t
19
CC
t
22
CC
t
23
CC
t
25
WR
Address hold after RD
Latched CS
Unlatched CS
setup to ALE
setup to
, WR
t
t
t
27
38
38u
CC
CC
CC
ALE
Latched CS
low to V alid
SR–13
t
39
Data In
Max. CPU Clock
= 50 MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
2
–
2TCL - 7 +
2TCL - 7+
t
2TCL - 10 +
2TCL - 10 +
-7 + t
A
TCL - 7 +
t
2TCL - 5 +
–ns
t
C
–ns
F
–ns
t
F
–ns
t
F
3 + t
–ns
A
13 +
13 +
10 +
10 +
-7 +
3 +
15 +
t
F
t
t
t
t
t
A
t
A
–
C
–
F
–
F
–
F
3 + t
A
–
–3TCL - 17
+
tC +2t
+
A
tC +2t
Unit
2
ns
t
F
A
ns
ns
A
Unlatched CS
low to Valid
Data In
Latched CS
hold after RD,
WR
Unlatched CS
RD
, WR
ALE fall. edge to RdCS
WrCS
(with RW delay)
ALE fall. edge to RdCS
WrCS
(no RW delay)
hold after
,
,
Address float after RdCS
(with RW delay)
1
Address float after RdCS
(no RW delay)
1
SR–23
t
39u
tC +2t
+
CC
CC
CC
CC
CC–
CC–
20 +
10 +
7 +
-3 +
t
t
t
A
t
A
t
40
t
40u
t
42
t
43
t
44
t
45
–
F
–
F
–
–
1
3
1
13
–4TCL - 17
A
3TCL - 10 +
2TCL - 10 +
TCL - 3 +
-3 +
t
A
t
F
t
F
t
A
–
–
ns
+
tC +2t
A
–ns
–ns
–ns
–ns
1
3
TCL + 3
1
ns
ns
Table 14 Mult iplexed bus
44/68
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Page 45
ST10R172L - ELECTRICAL CHARACTERISTICS
ParameterSymbol
RdCS to Valid Data In
SR–
t
46
(with RW delay)
to Valid Data In
RdCS
SR–
t
47
(no RW delay)
, WrCS Low Time
RdCS
CC
t
48
(with RW delay)
RdCS
, WrCS Low Time
CC
t
49
(no RW delay)
Data valid to WrCS
Data hold after RdCS
Data float after RdCS
Address hold after
RdCS
, WrCS
1 2
CC
t
50
SR0–0–ns
t
51
SR–
t
52
CC
t
54
Max. CPU Clock
= 50 MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
–2TCL - 17
–3TCL - 17
2
2TCL - 7+
3TCL - 7+
2TCL - 10 +
–
2TCL - 10 +
t
C
t
C
t
t
+
t
C
+
t
C
–ns
–ns
–ns
C
2TCL - 7 +
–ns
F
13 +
23 +
10 +
10 +
t
3 +
C
13 +
t
C
t
t
t
t
–
C
–
C
–
C
13 +
t
F
–
F
Unit
ns
ns
2
ns
t
F
Data hold after WrCS
CC
t
56
10 +
t
–
F
2TCL - 10 +
–ns
t
F
Table 14 Mult iplexed bus
1) Output loading is specified using Figure 10 (CL = 5 pF).
2) This delay assumes that the fo llowing bus cycle is a multiplexe d bus cycl e. If n ext bus cycl e
is demultiplexed, refer to demuxultiplexed equivalent AC timing.
45/68
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Page 46
ST10R172L - ELECTRICAL CHARACTERISTICS
CLKOUT
ALE
CSx
A23-A16
(A15-A8)
BHE
Read Cycle
BUS
P0
RD
t
t
38u
5
t
6
t
6m
t
38
Address
t
16
t
39u
t
39
t
17
t
25
t
40
t
40u
t
27
Address
t
16
Data In
t
18
Address
t
19m
t
7
t
t
8
10
t
14
46/68
1
Write Cycle
BUS
P0
WR,
WRL
, WRH
multiplexed bus, with/witho ut read/write delay, normal AL E
t
12
t
13
t
9
Address
t
9
t
11
t
15
Data Out
t
8
t
t
22
t
12
13
Figure 13 External memory cycle:
t
23
Page 47
CLKOUT
ST10R172L - ELECTRICAL CHARACTERISTICS
ALE
CSx
A23-A16
(A15-A8)
BHE
Read Cycle
BUS
P0
RD
t
38u
t
6d/b
t
t
5
6m
Address
t
16
t
38
t
39u
t
39
t
17
t
25
t
40
t
40u
Address
t
27
t
7
Data In
t
t
8
t
9
t
10
t
11
t
14
18
t
19m
Write Cycle
BUS
P0
WR
WRL,
WRH
t
15
t
12
t
13
Address
t
9
t
8
t
10
t
11
t
t
12
13
t
22
Data Out
t
23
Figure 14 External memory cycle:
multiplexed bus, with/without read/write delay, extended ALE
47/68
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Page 48
ST10R172L - ELECTRICAL CHARACTERISTICS
CLKOUT
ALE
A23-A16
(A15-A8)
BHE
Read Cycle
BUS
P0
RdCSx
t
t
t
6b/d
6m
5
Address
t
42
t
43
t
16
t
17
t
25
t
27
Address
t
16
t
7
t
44
t
46
t
48
t
49
t
45
Data In
t
51
Address
t
52m
t
Write Cycle
BUS
Address
47
t
56
Data Out
P0
t
42
t
50
WrCSx
t
43
t
48
t
49
Figure 15 External memory cycle:
multiplexed bus, with/witho ut read/write delay, normal AL E, read/write chip select
= 3.3 V ± 0.3 VVSS = 0 VTA = -40°C to +85 °CCL = 50 pF
DD
ALE cycle time = 4 TCL + 2
t
+ tC + tF (40 ns at 50 MHz CPU clock without waitstates)
A
ParameterSymbol
ALE high time
Address (P1, P4), BHE
CC
t
5
CC
t
6
setup to ALE
Address setup to RD
, WR
CC
t
80
(with RW-delay)
Address setup to RD
, WR
CC
t
81
(no RW-delay)
, WR low time
RD
CC
t
12
(with RW-delay)
RD
, WR low time
CC
t
13
(no RW-delay)
to valid data in
RD
t
14
SR–
(wit h RW-del ay)
to valid data in
RD
t
15
SR–
(no RW-delay)
Max CPU Clock 50MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
7 +
3 +
13 +
3 +
13 +
23 +
t
t
2t
A
A
2t
t
t
–
–
–
A
A
C
C
–
–
–
5 +
15 +
t
C
t
C
TCL - 3 +
TCL - 7 +
2TCL - 7 +
TCL - 7 +
2TCL - 7 +
3TCL - 7 +
–2T CL - 15
–3T CL - 15
–ns
t
A
–ns
t
A
–ns
2t
A
–ns
2t
A
–ns
t
C
–ns
t
C
+
t
C
+
t
C
Unit
ns
ns
ALE low to va lid data in
Address to valid data in
Data hold after RD
rising edge
Data float after RD
rising
edge (with RW-delay)
Data float after RD
edge (no RW-delay)
rising
1 2
Data valid to WR
50/68
1
1) 2)
SR–
t
16
SR–
t
17
SR0–0–ns
t
18
SR–15
t
20
SR–
t
21
CC
t
22
13 +
t
C
15 +
20 +
t
C
t
+
5 +
2t
A
–
F
t
2
t
A
2t
+ 2t
F
–3T CL - 15
+ t
C
+
t
+ t
A
–4T CL - 20
+
A
+
2t
+ t
A
–2TCL - 5
t
+ 2t
2
A
–TCL - 5
+
2TCL - 7 +
+
F
t
+ 2t
+
F
–ns
t
C
Table 15 D emu ltiplexed bus
ns
C
ns
C
ns
2
A
ns
2
A
Page 51
ST10R172L - ELECTRICAL CHARACTERISTICS
ParameterSymbol
Data hold after WR
ALE rising edge after RD
,
CC
t
24
CC
t
26
WR
Address hold after RD
Address hold after WRH
Latched CS
Unlatched CS
Latched CS
setup to ALE
setup to ALE
low to V alid
, WR
CC0 (no t
t
28
CC-1 (no t
t
28h
CC
t
38
CC
t
38u
SR–13
t
39
Data In
Unlatched CS
low to Valid
SR–23
t
39u
Data In
Max CPU Clock 50MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
5 +
-5 +
-9+t
+t
-8
-7 +
3 +
t
F
t
F
F)
F (tF>0)
F)
F (tF>0)
t
A
t
A
–
–
–
–
3 + t
–
TCL - 5 +
-5 +
t
F
0 (no
t
)
F
-9+
t
F (tF>0)
-1 (no
t
)
F
-8 +
t
F (tF>0)
A
-7 + t
A
TCL - 7 +
–ns
t
F
–ns
–ns
–ns
3 + t
–ns
t
A
–3T CL - 17
+
tC +2t
A
+
tC +2t
–4T CL - 17
+
tC +2t
A
+
tC +2t
Unit
A
ns
ns
A
ns
A
Latched CS
hold after RD,
WR
Unlatched CS
hold after RD,
WR
Address setup to RdCs
WrCs
(with RW-delay)
Address setup to RdCs
WrCs
(no RW-delay)
to Valid Data In
RdCS
(with RW-delay)
to Valid Data In
RdCS
(no RW-delay)
RdCS
, WrCS Low Time
(with RW-delay)
, WrCS Low Time
RdCS
(no RW-delay)
Data valid to WrCS
CC
t
41
CC0 (no t
t
41u
,
,
t
t
t
t
t
t
t
82
83
46
47
48
49
50
CC
CC
SR–
SR–
CC
CC
CC
3 +
+t
-7
13 +
3 +
11 +
21 +
13 +
t
F
F)
F (tF>0)
2t
2t
A
t
C
t
C
t
C
–
–
–
A
–
3 +
t
C
13 +
t
C
–
–
–
TCL - 7 +
0 (no
t
)
F
-7 +
t
F (tF>0)
2TCL - 7 +
TCL - 7 +
–
–
2TCL - 9 +
3TCL - 9 +
2TCL - 7 +
–ns
t
F
–ns
–ns
2t
A
–ns
2t
A
2TCL - 17 +
3TCL - 17 +
–ns
t
C
–ns
t
C
–ns
t
C
ns
t
C
ns
t
C
Table 15 D emu ltiplexed bus
51/68
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Page 52
ST10R172L - ELECTRICAL CHARACTERISTICS
Max CPU Clock 50MHz
ParameterSymbol
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
Data hold after RdCS
Data float after RdCS
(with RW-delay)
1 2
Data float after RdCS
(no RW-delay)
1 2
Address hold after
RdCS
, WrCS
Data hold after WrCS
SR0–0–ns
t
51
t
t
t
t
53
68
55
57
SR–
SR–
CC
CC
-5 +
3 +
13 +
t
F +
2
2tA
3 +
t
F+ 2tA
t
F
t
F
–
–
–2TCL - 7
t
+
F + 2tA
2
–TCL - 7
t
+
F + 2tA
-5 +
t
F
TCL - 7 +
–ns
–ns
t
F
Table 15 D emu ltiplexed bus
1) Output loading is specified using Figure 10 with CL = 5 pF.
2) This delay assumes that the following bus cycle is a demultiplexed bus cycle and that the
data bus will only be driven ext ernally when the RD
t
delay and
refer to the following bus cycle. If the following bus cycle is a muxtiplexed bus
A
cycle, refer to equival e nt mult i ple xe d AC timing (which are still applicable due to automati c
insertion an idle state (2TCL) when switching from Demultiplexed to Multiplexed Bus Mode.
or RdCs signal becomes active. RW-
Unit
ns
2
ns
2
52/68
1
Page 53
CLKOUT
ST10R172L - ELECTRICAL CHARACTERISTICS
ALE
CSx
A23-A16
(A15-A8)
BHE
Read Cycle
P0 BUS
(D15-D8)
D7-D0
RD
t
t
t
41
41u
26
t
28, t28h
t
5
t
38u
t
38
t
6
t
16
t
39u
t
39
t
17
Address
t
18
Data In
t
80
t
81
t
14
t
15
t
20d
t
21d
Write Cycle
P0 BUS
(D15-D8)
D7-D0
WR(L),
WRH
demultiplexed bus, with/without read/write delay, no rmal ALE
t
12
t
13
Data Out
t
80
t
81
t
13
t
t
12
t
22
24
Figure 17 External memory cycle:
53/68
1
Page 54
ST10R172L - ELECTRICAL CHARACTERISTICS
CLKOUT
t
ALE
CSx
A23-A16
(A15-A8)
BHE
5
t
38u
t
38
t
6
t
17
t
16
t
39u
t
39
Address
t
26
t
41
t
41u
t
,
t
28
28h
Read Cycle
P0 BUS
(D15-D8)
D7-D0
RD
Write Cycle
P0 BUS
(D15-D8)
D7-D0
WR(L),
WRH
t
18
Data In
t
80
t
81
t
14
t
15
t
12
t
13
t
20d
t
21d
Data Out
t
80
t
81
t
13
t
22
t
12
t
24
54/68
1
Figure 18 External memory cycle:
demultiplexed bus, with/without read/write delay, extended ALE
Page 55
CLKOUT
ST10R172L - ELECTRICAL CHARACTERISTICS
ALE
A23-A16
(A15-A8)
BHE
Read Cycle
P0 BUS
(D15-D8)
D7-D0
RdCsx
Write Cycle
P0 BUS
(D15-D8)
D7-D0
t
5
t
6
t
16
t
17
t
26
t
55
Address
t
51
Data In
t
82
t
83
t
46
t
47
t
48
t
49
t
53d
t
68d
Data Out
t
82
t
83
t
t
50
57
WrCSx
t
48
t
49
Figure 19 External memory cycle:
demultiplexed bus, with/without read/write delay, normal ALE, read/write chip select
55/68
1
Page 56
ST10R172L - ELECTRICAL CHARACTERISTICS
CLKOUT
t
ALE
A23-A16
(A15-A8)
BHE
5
t
6
t
17
t
16
Address
t
26
t
55
Read Cycle
P0 BUS
(D15-D8)
D7-D0
RdCSx
Write Cycle
P0 BUS
(D15-D8)
D7-D0
WrCSx
t
51
Data In
t
82
t
83
t
46
t
47
t
48
t
49
t
53d
t
68d
Data Out
t
82
t
83
t
49
t
50
t
48
t
57
Figure 20 External memory cycle:
demultiplexed bus, no read/write d e lay, extended ALE, read/write chip select
56/68
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Page 57
ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.5 CLKOUT and READY/READ Y
V
= 3.3 V ± 0.3 VVSS = 0 VTA = -40°C to +85 °CCL = 50 pF
DD
Parame terSymbol
CLKOUT cycle time
CLKOUT high time
CLKOUT low time
CLKOUT rise time
CLKOUT fa l l time
1)
1
CLKOUT rising edge to
CC 20202TCL2TCLns
t
29
CC 5–TCL – 5–ns
t
30
CC 5–TCL – 5–ns
t
31
CC –
t
32
CC –
t
33
CC
t
34
ALE falling edge
Synchronous READY
SR 9–9–ns
t
35
setup time to CLKOUT
Synchronous READY
SR 0–0–ns
t
36
hold time after CLKOUT
Asynchronous READY
SR 27–2TCL + 7–ns
t
37
low time
Max. CPU Clock
= 50 MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
-3 +
1
3
1
3
t
5 + t
A
A
–
–
-3 + t
A
1
3
1
3
5 + t
Unit
ns
ns
A
ns
Asynchronous READY
setup time
2)
Asynchronous READY
hold time
2
Async. REA DY hold time
after RD
plexed Bus)
, WR high (Demulti-
3)2
SR 9–9–ns
t
58
SR 0–0–ns
t
59
SR 00
t
60
2t
+ tc+ t
+
A
0TCL - 10
3
F
2t
+ tc+ t
+
A
Table16CLKOUT and READY/READY
1) Measured between 0.3 and 2.7 volts
2) These timings assure recognition at a specific clock edge for test purposes only.
3) Demultiplexed bus is the worst case. For multiplexed bus, 2TCL should be added
to the maximum values. This adds even more time for deactivating READY.
2t
and tC refer to the following bus cycle, tF refers to the current bus cycle.
A
ns
3
F
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ST10R172L - ELECTRICAL CHARACTERISTICS
CLKOUT
ALE
Command
RD, WR
Sync
READY
Async
READY
29
t
35
t
35
READY
waitstate
t
36
3)
t
36
MUX/Tris ta te 6)
4)
t
60
7)
Running cycle 1)
t
32
t
30
t
33
t
t
34
t
58
t
59
3)
t
31
2)
t
t
5)
t
35
58
t
35
36
3)
t
59
3)
t
37
t
36
Sync
READY
Async
READY
3)
58
t
59
3)
t
t
58
t
59
3)
t
37
5)
Figure 21 CLKOUT and READY
3)
/READY
4)
t
60
see 6)
1Cycle as programmed, including MCTC waitstates (Example shows 0 MCTC WS).
2The leading edge of the respective command depends on RW-delay.
3READY
READY controlled waitstate, READY
(or READY) sampled HIGH (resp. LOW) at this sampling point generates a
(resp. READY) sampled LOW (resp. HIGH) at this
sampling point terminates the currently running bus cycle.
4READY
corresponding command (RD
5If the Asynchronous READY
(resp. READY) may be deactivated in response to the trailing (rising) edge of the
or WR).
(or READY) signal does not fulfill the indicated setup and
hold times with respect to CLKOUT (e.g. because CLKOUT is not enabled), it must fulfill t
37 in order to be safely synchronized. This is guaranteed, if READY is removed in
response to the command (see Note 4)).
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ST10R172L - ELECTRICAL CHARACTERISTICS
6Multiplexed bus modes have a MUX waitstate added after a bus cycle, and an additional
MTTC waitstate may be inserted here. For a multiplexed bus with MTTC waitstate this
delay is 2 CLKOUT cycles, for a dem ultiplexed bus without MTTC waitstate this delay is
zero.
7The next external bus cycle may start here.
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Page 60
ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.6 External Bus Arbitration
V
= 3.3 V ± 0.3 VVSS = 0 VTA = -40°C to +85 °CCL = 50 pF
DD
Parame terSymbol
input setup time
HOLD
SR
t
61
to CLKOUT
CLKOUT to HLDA
or BREQ
low delay
CLKOUT to HLDA
or BREQ
CSx
CSx
high delay
release
drive
high
low
Other signals release
Other signals drive
CC
t
62
CC
t
63
CC
t
64
CC
t
65
CC
t
66
CC
t
67
Table 17 External bus arbitration
Max. CPU Clock
= 50 MHz
Variable CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
15–15–ns
–10–10ns
–10–10ns
–15–15ns
-315-315ns
–15–15ns
-315-315ns
Unit
60/68
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Page 61
CLKOUT
HOLD
HLDA
ST10R172L - ELECTRICAL CHARACTERISTICS
t
61
t
63
1)
t
62
BREQ
t
64
2)
3)
CSx
(On P6.x)
t
66
Other
Signals
1)
Figure 22 External bus arbitratio n, releasi ng the bus
1The ST10R172L will complete the running bus cycle before granting bus access.
2This is the first opportunity for BREQ
3The CS
outputs will be resistive high (pullup) after t64.
to become active.
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ST10R172L - ELECTRICAL CHARACTERISTICS
CLKOUT
HOLD
HLDA
BREQ
CSx
(On P6.x)
Other
Signals
2)
t
61
t
62
t
62
t
62
1)
t
63
t
65
t
67
Figure 23 External bus arbitration, (regaining the bus)
1This is the last chance for BREQ to trigger the r egain-sequence indicated.
Even if BREQ
Please note that HOLD
is activated earlier, the regain-sequence is initiated by HOLD going high.
may also be de-activated without the ST10R172L requesting the
bus.
2The next ST10R172L driven bus cycle may start here.
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ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.7 External Hardware Reset
V
= 3.3 V ± 0.3 VVSS = 0 VTA = -40°C to +85 °CCL = 50 pF
DD
ParameterSymbol
Sync. RSTIN
RSTIN
low to internal
low time
1)
SR
t
70
CC
t
71
reset sequence start
internal reset sequence,
(RSTIN
internally pulled
CC
t
72
low)
rising edge to inter-
RSTIN
CC
t
73
nal reset condition end
PORT0 syste m start-up
SR
t
74
configuration setup to
rising edge
RSTIN
PORT0 syste m start-up
2))
SR
t
75
configuration hold after
RSTIN
rising edge
Bus signals drive from
CC
t
76
internal reset end
Max. CPU Clock
= 50 MHz
V ari abl e CPU Clock
1/2TCL = 1 to 50 MHz
min.max.min.max.
Unit
50–4 TCL + 10–ns
416416 TCL
1024102410241024TCL
4646TCL
100–100–ns
1616TCL
020020ns
RSTIN
low to signals
CC
t
77
–50–50ns
release
ALE rising edge from inter-
CC
t
78
8888TCL
nal reset condition end
Async. RSTIN
low time
1
SR
t
79
1500–1500–ns
Table 18 External hardware reset
1) On power-up reset, the RSTIN pin must be asserted until a stable clock signal is available
(about 10...50 ms to allow the on-chip oscillator to stabilize) and until System Start-up Configuration is correct on P ORT 0 (abo ut 50 µs for internal pull up de vice s to loa d 50 pF from
V
min to VIHmin).
IL
2) The value of bits 0 (EMU), 1 (ADA PT), 13 to 15 (Clock Configuration) are loaded during
hardware reset as lo ng as i nterna l reset s ignal is act ive, and have an immediate ef fect on
the system.
1The pending internal hold states are cancelled and the current internal access cycle (if
any) is completed.
2RSTIN pulled low by internal device during internal reset sequence.
3The reset condition may ends here if RSTIN
pin is sampled high after t72.
4Internal pullup devices are active on the PORT0 lines. Their input level is high if the
respective pin is left open, or is low if the respective pin is connected to an external pulldown device by resistive high (pullup) after t64.
5The ST10R172L starts execution here at address 00’0000h.
6RSTOUT
stays active until execution of the EINIT (End of Initialization) instruction.
7Activation of the IO pins is controlled by software.
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Page 66
ST10R172L - ELECTRICAL CHARACTERISTICS
15.3.8 Synchronous Serial Port Timing
V
= 3.3 V ± 0.3 VVSS = 0 VTA = -40°C to +85 °CCL = 50 pF
CC
ParameterSymbol
SSP clock cycle time
SSP clock high time
SSP clock low time
SSP clock rise time
SSP clock fall time
CE active before shift edge
CE inactive after latch edge
Write data valid after shift edge
Write data hold after shift edge
Write data hold after latch edge
Read data active after latch edge
Read data setup time before latch edge
Max. Baudrate
= 25 MBd
Variable Baudrate
= 0.2 to 25 MBd
min.ma x.min.max.
t
CC40404 TCL512 TC Lns
200
t
CC13–t
201
t
CC13–t
202
t
CC–3–3ns
203
t
CC–3–3ns
204
t
CC13–t
205
t
CC3347t
206
t
CC–7–7ns
207
t
CC0–0–ns
208
t
CC1525t
209
t
SR27–t
210
t
SR15–15–ns
211
/2 - 7–ns
200
/2 - 7–ns
200
/2 - 7–ns
200
- 7t
200
/2 - 5t
200
/2 + 7–ns
200
+ 7ns
200
/2 + 5ns
200
Unit
Read data hold time after latch edge
Table 19 Synchronous seri al port ti ming
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1
t
SR0–0–ns
212
Page 67
ST10R172L - ELECTRICAL CHARACTERISTICS
SSPCLK
SSPCEx
SSPDAT
SSPCLK
t
1)
t
205
200
t
207
1st BitLast Bit2nd Bit
t
t
202
t
207
203
t
201
t
204
t
208
2)
t
206
3)
t
207
t
209
Figure 26 SSP wr ite timin g
1)
2)
t
206
SSPCEx
SSPDAT
t
t
209
last Wr. Bit
210
t
211
1st.In Bit
Lst.In Bit
t
212
3)
Figure 27 SSP read timing
1The transition of shift and latch edge of SSPCLK is programmable. This figure uses the
falling edge as shift edge (drawn bold).
2The bit timing is repeated for all bits to be transmitted or received.
3The active level of the chip enable lines is programmable. This figure uses an active low
CE (drawn bold). At the end of a transmission or reception the CE signal is disab led in si ngle transfer mode. In continuous transfer mode it remains active.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
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by implic ation or otherwise under any paten t or patent r i ghts of STMicroelectroni cs. Speci fications me nt i oned in this publication are subj ect
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as crit i cal component s i n l i f e support devices or systems wi thout the exp ress written approval of STMicroelectronics.
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2
C Components by STMicroelectronics conveys a license under the Philips I2C Patent. Rights to use these components in an
2
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C system i s granted provided that the system conform s to the I2C Standard Specification as defined by Philips.
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