Datasheet SSM3K7002FU Datasheet (Toshiba) [ru]

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TOSHIBA Field Effect Transistor Silicon N Channel MOS Type
SSM3K7002FU

High Speed Switching Applications

SSM3K7002FU

Analog Switch Applications

Low ON resistance : R
: R
: Ron = 3.0 Ω (max) (@VGS = 10 V)
Absolute Maximum Ratings
Characteristics Symbol Rating Unit
Drain-Source voltage V
Gate-Source voltage V
Drain current
Drain power dissipation (Ta = 25°C) PD (Note 1) 150 mW
Channel temperature Tch 150 °C
Storage temperature range T
Note: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: mounted on FR4 board
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 0.6mm
= 3.3 Ω (max) (@VGS = 4.5 V)
on
= 3.2 Ω (max) (@VGS = 5 V)
on
(Ta = 25°C)
DS
± 20 V
GSS
DC ID 200
Pulse I
800
DP
55~150 °C
stg
60 V
mA
2
× 3)
Unit: mm
2.1± 0.1
1.25 ± 0.1
+0.1
1
0.65
2.0 ± 0.2
1.3 ± 0.1
USM
JEDEC
JEITA SC-70
TOSHIBA 2-2E1E
2
0.65
0.7
0.9 ± 0.1
0~0.1
1. GATE
2. SOURCE
3. DRAIN
0.3 - 0
3
+0.1
0.15 -0.05
0.6 mm
1.0 mm
Marking Equivalent Circuit
3
1 2
NC
12
3
(top view)

Handling Precaution

When handling individual devices (which are not yet mounting on a circuit board), be sure that the environment is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects that come into direct contact with devices should be made of anti-static materials.
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SSM3K7002FU
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Electrical Characteristics
Characteristics Symbol Test Condition Min Typ Max Unit
Gate leakage current I
Drain-Source breakdown voltage V
Drain cut-off current I
Gate threshold voltage Vth VDS = 10 V, ID = 0.25 mA 1.0 2.5 V
Forward transfer admittance ⎪Yfs⎪ V
Drain-Source ON resistance R
Input capacitance C
Reverse transfer capacitance C
Output capacitance C
Switching time
Turn-on delay time td
Turn-off delay time td
(Ta = 25°C)
VGS = ± 20 V, VDS = 0 ± 10 μA
GSS
(BR) DSSID
DSS
DS (ON)
17 pF
iss
1.4 pF
rss
oss
(on)
(off)
= 0.1 mA, VGS = 0 60 V
VDS = 60 V, VGS = 0 1 μA
= 10 V, ID = 200 mA 170 mS
DS
ID = 500 mA, VGS = 10 V 2.0 3.0
ID = 100 mA, VGS = 5 V 2.1 3.2
= 100 mA, VGS = 4.5 V 2.2 3.3
I
D
V
= 25 V, VGS = 0, f = 1 MHz
DS
2.4 4.0
= 30V, ID = 200 mA,
V
DD
= 0 ~ 10V
V
GS
5.8 pF
26 40

Switching Time Test Circuit

(a) Test circuit
10V
IN
0
10 μs
VDD = 30 V
1%
Duty
=
: tr, tf < 2 ns
V
IN
(Z
= 50 Ω)
out
Common Source Ta = 25°C
(b) V
OUT
IN
50 Ω
RL
V
DD
(c) V
OUT
V
V
DS (ON
10 V
0 V
DD
90%
10%
td
(on)
t
r
10%
90%
t
f
td
(off)

Precaution

Ω
ns
Vth can be expressed as voltage between gate and source when low operating current value is ID = 250 μA for this product. For normal switching operation, V than V
. (Relationship can be established as follows: V
th
requires higher voltage than Vth and V
GS (on)
< Vth < V
GS (off)
GS (on)
requires lower voltage
GS (off)
)
Please take this into consideration for using the device.
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ID - VDS
1000
Common Source
900
Ta=25°C
800
700
600
500
400
300
Drain current ID (mA)
200
100
0
0 0.5 1 1.5 2
Drain-Source voltage VDS (V)
5
4
3
VGS=4.5V
2
1
RDS(ON) - ID
5.0V
10
Common Source Ta=25°C
10V
5
7
VGS=2.3V
4.04.5
3.3
3.0
2.7
2.5
ID - VGS
1000
Common Source VDS=10V
100
Ta=100°C
10
25°C
1
Drain current ID (mA)
-25°C
0.1
0.01
012345
Gate-Source voltage VGS (V)
5
4
3
2
1
RDS(ON) - VGS
Common Source ID=100mA
Ta=100°C
25°C
-25°C
Drain-Source on resistance RDS(ON) (Ω)
0
10 100 1000
Drain current ID (mA)
5
Common Source
4
3
2
1
Drain-Source on resistance RDS(ON) (Ω)
0
-25 0 25 50 75 100 125 150
RDS(ON) - Ta
VGS=4.5V,ID=100mA
10V,500mA
5.0V,100mA
Ambient temperature Ta (°C)
0
Drain-Source on resistance RDS(ON) (Ω)
0246810
Gate-Source voltage VGS (V)
Vth - Ta
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
Gate threshold voltage Vth(V)
0.2
0
-25 0 25 50 75 100 125 150 Ambient temperature Ta (°C)
Common Source ID=0.25mA VDS=10V
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1000
100
|Yfs| (mS)
Forward transfer admittance
10
10 100 1000
100
|Yfs| - ID
Common source VDS=10V Ta=25°C
Drain current ID (mA)
C - VDS
Common Source VGS=0V f=1MHz Ta=25°C
1000
900
800
700
600
500
400
300
200
Drain reverse current IDR (mA)
100
10000
1000
Common Source VGS=0V Ta=25°C
G
0
0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4
IDR - VDS
D
IDR
S
Drain-Source voltage VDS (V)
t - ID
Common Source VDD=30V
tf
VGS=0~10V Ta=25°C
10
Capacitance C (pF)
1
0.1 1 10 100 Drain-Source voltage VDS (V)
PD - Ta
250
mounted on FR4 board
200
150
100
50
Drain power dissipation PD (mW)
0
0 20 40 60 80 100 120 140 160
Ambient temperature Ta (°C)
25.4mm×25.4mm×1.6t
Cu Pad:0.6mm
Coss
2
×3
Ciss
Crss
100
td(off)
Switching time t (ns)
10
1
1 10 100 1000
tr
td(on)
Drain current ID (mA)
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RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
BSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
A
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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