
Elektronische Bauelemente
KEY FEATURES
Low R
Low thermal impedance
Fast switching speed
trench technology
DS(on)
T ypical Applications
PoE Power Sourcing Equipment
PoE Powered Devices
Telecom DC/DC converters
While LED boost converters
PRODUCT SUMMARY
PRODUCT SUMMARY
V
(V) R
DS
(on) m( I
DS
78 @V
100
92 @VGS= 4.5V
A suffix of “-C” specifies halogen free
= 10V 21
GS
RoHS Compliant Product
(A)
D
19
Gate
SSD30N10-70D
N-Ch Enhancement Mode Power MOSFET
21A, 100V, R
Drain
Source
M
REF.
78 mΩ
DS(ON)
TO-252(D-Pack)
A
B
G E
FHK
J
Millimeter
Min. Max. Min. Max.
A 6.4 6.8 J 2.30 REF.
B 5.20 5.50 K 0.70 0.90
C 2.20 2.40 M 0.50 1.1
D 0.45 0.58 N 0.9 1.6
E 6.8 7.3 O 0 0.15
F 2.40 3.0 P 0.43 0.58
G 5.40 6.2
H 0.8 1.20
REF.
Millimete
C
D
N
O
P
ABSOLUTE MAXIMUM RATINGS (T
= 25°C unless otherwise specified)
A
PARAMETER SYMBOL RATINGS UNIT
Drain-Source Voltage VDS 100 V
Gate-Source Voltage VGS ±20 V
Continuous Drain Current I
Pulsed Drain Current
b
IDM 100 A
@T
=25℃ 21 A
D
C
Continuous Source Current (Diode Conduction) IS 30 A
Power Dissipation PD @TC=25℃ 50 W
Operating Junction and Storage Temperature Range TJ, T
-55 ~ 175 °C
STG
THERMAL RESISTANCE RATINGS
Maximum Thermal Resistance Junction-Ambienta R
Maximum Thermal Resistance Junction-Case R
50 °C / W
θJA
3.0 °C / W
θJC
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
11-Aug-2010 Rev. A Page 1 of 4

Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (T
PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
= 25°C unless otherwise specified)
A
N-Ch Enhancement Mode Power MOSFET
Static
SSD30N10-70D
21A, 100V, R
DS(ON)
78 mΩ
Gate-Source Threshold Voltage V
Gate-Body Leakage I
GS(th)
- - ±10 μA VDS= 0V, VGS= 20V
GSS
1.0 - - V V
- - 1
Zero Gate Voltage Drain Current I
DSS
- - 25
On-State Drain Current I
34 - - A VDS= 5V, VGS= 10V
D(ON)
- - 78
Drain-Source On-Resistance R
DS(ON)
- - 92 VGS= 4.5V, ID= 6.1A
Forward Transconductance g
Diode Forward Voltage V
fs
SD
- 20 - S VDS= 40V, ID= 5.5A
- 0.8 - V IS= 9A, VGS = 0V
Dynamic
Total Gate Charge Qg - 21 -
Gate-Source Charge Qgs - 3.8 -
Gate-Drain Change Q
Turn-on Delay Time2 T
- 14.2 -
gd
- 7.5 -
d(on)
Rise Time Tr - 13.6 -
Turn-off Delay Time T
- 41 -
d(off)
Fall Time Tf - 35 -
Notes
a. Pulse test: PW ≦ 300 us duty cycle ≦ 2%.
b. Guaranteed by design, not subject to production testing.
= VGS, ID = 250μA
DS
VDS= 80V, VGS= 0V
μA
V
= 80V, VGS= 0V,
DS
TJ= 55°C
= 10V, ID= 9.2A
V
GS
mΩ
I
= 9 A
D
nC
VDS= 50 V
V
= 4.5 V
GS
V
= 50 V
DD
ID= 9.6 A
nS
= 5.2
R
L
V
GEN
R
GEN
= 10 V
= 6
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
11-Aug-2010 Rev. A Page 2 of 4

Elektronische Bauelemente
CHARACTERISTICS CURVES
SSD30N10-70D
N-Ch Enhancement Mode Power MOSFET
21A, 100V, R
DS(ON)
78 mΩ
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
11-Aug-2010 Rev. A Page 3 of 4

Elektronische Bauelemente
CHARACTERISTICS CURVES
SSD30N10-70D
N-Ch Enhancement Mode Power MOSFET
21A, 100V, R
DS(ON)
78 mΩ
http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually.
11-Aug-2010 Rev. A Page 4 of 4