Datasheet sqd40n10-25 Datasheet

Page 1
Automotive
N-Channel 100 V (D-S) 175 °C MOSFET
SQD40N10-25
Vishay Siliconix
PRODUCT SUMMARY
VDS (V) 100
R
() at VGS = 10 V 0.025
DS(on)
() at VGS = 4.5 V 0.029
R
DS(on)
(A) 40
I
D
Configuration Single
TO-252
D
FEATURES
•TrenchFET® Power MOSFET
• Package with Low Thermal Resistance
• AEC-Q101 Qualified
• Compliant to RoHS Directive 2002/95/EC
• Find out more about Vishay’s Automotive Grade Product
d
Requirements at: www.vishay.com/applications
G
Drain Connected to Tab
SGD
Top View
S
N-Channel MOSFET
ORDERING INFORMATION
Package TO-252
Lead (Pb)-free and Halogen-free SQD40N10-25-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
Gate-Source Voltage V
= 25 °Ca
T
Continuous Drain Current
Continuous Source Current (Diode Conduction)
Pulsed Drain Current
b
a
Single Pulse Avalanche Energy
Single Pulse Avalanche Current I
Maximum Power Dissipation
b
C
= 125 °C 26
T
C
L = 0.1 mH
TC = 25 °C
T
= 125 °C 45
C
Operating Junction and Storage Temperature Range T
DS
± 20
GS
I
D
I
S
IDM 160
E
AS
AS
P
D
, T
J
stg
100
V
40
40
A
80 mJ
40 A
136
W
- 55 to + 175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-Ambient PCB Mount
c
Junction-to-Case (Drain) R
Notes
a. Package limited. b. Pulse test; pulse width 300 μs, duty cycle 2 %. c. When mounted on 1" square PCB (FR-4 material). d. Parametric verification ongoing.
Document Number: 69064 www.vishay.com S10-1997-Rev. B, 20-Sep-10 1
R
thJA
thJC
50
1.1
°C/W
Page 2
SQD40N10-25
Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
Gate-Source Threshold Voltage V
Gate-Source Leakage I
Zero Gate Voltage Drain Current I
a
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
b
I
a
R
b
Input Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
c
Turn-Off Delay Time
Fall Time
c
c
c
c
c
c
Source-Drain Diode Ratings and Characteristics
Pulsed Current
a
Forward Voltage V
DS
GS(th)
V
GSS
DSS
V
D(on)
DS(on)
g
fs
iss
- 312 390
oss
- 127 160
rss
Qg
Qgs -8.2-
Qgd -13-
t
d(on)
t
r
t
-2741
d(off)
tf -69
b
I
SM
SD
Notes
a. Pulse test; pulse width 300 μs, duty cycle  2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
V
VGS = 0 V, ID = 250 μA 100 - -
VDS = VGS, ID = 250 μA 1.5 - 2.5
= 0 V, VGS = ± 20 V - - ± 100 nA
DS
VGS = 0 V VDS = 100 V - - 1.0
= 0 V VDS = 100 V, TJ = 125 °C - - 50
GS
= 0 V VDS = 100 V, TJ = 175 °C - - 250
V
GS
= 10 V VDS5 V 50 - - A
GS
V
= 10 V ID = 40 A - 0.019 0.025
GS
= 10 V ID = 40 A, TJ = 125 °C - - 0.050
V
GS
V
= 10 V ID = 40 A, TJ = 175 °C - - 0.063
GS
= 4.5 V ID = 20 A - 0.021 0.029
GS
VDS = 15 V, ID = 40 A - 73 - S
- 2703 3380
V
= 0 V VDS = 25 V, f = 1 MHz
GS
-4670
= 10 V VDS = 50 V, ID = 40 A
V
GS
-1117
= 50 V, RL = 1.25
V
DD
I
40 A, V
D
= 10 V, Rg = 1
GEN
-1117
- - 160 A
IF = 40 A, V
= 0 V - 0.9 1.5 V
GS
V
μA V
pF Output Capacitance C
nC Gate-Source Charge
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
www.vishay.com Document Number: 69064 2 S10-1997-Rev. B, 20-Sep-10
Page 3
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
0
20
40
60
80
100
120
048121620
VGS=10Vthru5V
VGS=4V
VGS=3V
VDS - Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
0
0.02
0.04
0.06
0.08
0.10
0 20406080100
VGS=4.5V
VGS=10V
R
DS(on)
- On-Resistance (Ω)
ID - Drain Current (A)
0
20
40
60
80
100
012345
TC= 125 °C
TC= 25 °C
TC= - 55 °C
VGS - Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
0
1000
2000
3000
4000
0 20406080100
C
iss
C
oss
C
rss
VDS - Drain-to-Source Voltage (V)
C - Capacitance (pF)
SQD40N10-25
Vishay Siliconix
Output Characteristics
1.5
1.2
0.9
0.6
- Drain Current (A)
D
I
0.3
0
012345
TC= 25 °C
TC= 125 °C
TC= - 55 °C
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
Transfer Characteristics
125
100
TC= - 55 °C
75
50
- Transconductance (S)
fs
g
25
0
0 1224364860
TC= 125 °C
ID- Drain Current (A)
TC= 25 °C
Transconductance
On-Resistance vs. Drain Current
Document Number: 69064 www.vishay.com S10-1997-Rev. B, 20-Sep-10 3
Capacitance
Page 4
SQD40N10-25
0
2
4
6
8
10
0 1020304050
ID=40A
VDS=50V
Qg - Total Gate Charge (nC)
V
GS
- Gate-to-Source Voltage (V)
TJ= 25 °C
TJ= 150 °C
0 0.2 0.4 0.6 0.8 1.0 1.2
1
0.01
0.001
0.1
10
100
VSD - Source-to-Drain Voltage (V)
I
S
- Source Current (A)
- 50 - 25 0 25 50 75 100 125 150 175
ID=5mA
ID= 250 μA
V
GS(th)
Variance (V)
TJ - Temperature (°C)
- 1.5
- 1.1
- 0.7
- 0.3
0.1
0.5
0.5
0.9
1.3
1.7
2.1
2.5
- 50 - 25 0 25 50 75 100 125 150 175
ID=40A
VGS=10V
TJ - Junction Temperature (°C)
(Normalized)
R
DS(on)
- On-Resistance
0
0.04
0.08
0.12
0.16
0.20
0246810
TJ= 25 °C
TJ= 150 °C
R
DS(on)
- On-Resistance (Ω)
VGS - Gate-to-Source Voltage (V)
100
106
112
118
124
130
- 50 - 25 0 25 50 75 100 125 150 175
V
DS
- Drain-to -Source Voltage (V)
TJ- Junction Temperature (°C)
ID= 10 mA
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
Gate Charge
Source Drain Diode Forward Voltage
On-Resistance vs. Junction Temperature
On-Resistance vs. Gate-to-Source Voltage
Threshold Voltage
www.vishay.com Document Number: 69064 4 S10-1997-Rev. B, 20-Sep-10
Drain Source Breakdown vs. Junction Temperature
Page 5
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
VDS- Drain-to-Source Voltage (V)
* V
GS
minimum VGS at which R
DS(on)
is specified
-
Drain Current (A)I
D
TC = 25 °C Single Pulse
1 ms
100 ms, 1 s, 10 s, DC
100 µs
R
DS(on)*
Limited by
10 ms
0.01 0.1 1 10 100
BVDSS Limited
IDM Limited
0.01
0.1
1
10
100
1000
I
D
Limited
Square Wave Pulse Duration (s)
2
1
0.1
0.01 10
-4
10
-3
10
-2
10
-1
10
Normalized Effective Transient
Thermal Impedance
1000
0.2
0.1
0.05
0.02
Single Pulse
Duty Cycle = 0.5
1001
Safe Operating Area
SQD40N10-25
Vishay Siliconix
Document Number: 69064 www.vishay.com S10-1997-Rev. B, 20-Sep-10 5
Normalized Thermal Transient Impedance, Junction-to-Ambient
Page 6
SQD40N10-25
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
Thermal Impedance
Normalized Effective Transient
0.01
-4
10
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction to Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction to Case (25 °C) are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities can widely vary depending on actual application parameters and operating conditions.
0.05
0.02
Single Pulse
-3
10
-2
10
Square Wave Pulse Duration (s)
-1
10
1
Normalized Thermal Transient Impedance, Junction-to-Case
10
100
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?69064
.
www.vishay.com Document Number: 69064 6 S10-1997-Rev. B, 20-Sep-10
Page 7
TO-252AA CASE OUTLINE
Package Information
Vishay Siliconix
E
b2
L2
D
L1
L3
b
e1
E1
b1
e
D1
A
C1
H
L
C
A2
A1
gage plane height (0.5 mm)
MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX.
A 2.21 2.38 0.087 0.094
A1 0.89 1.14 0.035 0.045
A2 0.030 0.127 0.001 0.005
b 0.71 0.88 0.028 0.035
b1 0.76 1.14 0.030 0.045
b2 5.23 5.44 0.206 0.214
C 0.46 0.58 0.018 0.023
C1 0.46 0.58 0.018 0.023
D 5.97 6.22 0.235 0.245
D1 4.10 4.45 0.161 0.175
E 6.48 6.73 0.255 0.265
E1 4.49 5.50 0.177 0.217
e 2.28 BSC 0.090 BSC
e1 4.57 BSC 0.180 BSC
H 9.65 10.41 0.380 0.410
L 1.40 1.78 0.055 0.070
L1 0.64 1.02 0.025 0.040
L2 0.89 1.27 0.035 0.050
L3 1.15 1.52 0.040 0.060
ECN: T11-0110-Rev. L, 18-Apr-11 DWG: 5347
Note
• Dimension L3 is for reference only.
Document Number: 71197 www.vishay.com 18-Apr-11 1
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
This document is subject to change without notice.
www.vishay.com/doc?91000
Page 8
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.224
(5.690)
Application Note 826
Vishay Siliconix
0.243 (6.180)
Return to Index
Return to Index
0.420 (10.668)
0.180
(4.572)
Recommended Minimum Pads
Dimensions in Inches/(mm)
0.087
0.090
0.055
(1.397)
(2.202)
(2.286)
APPLICATION NOTE
Document Number: 72594 www.vishay.com Revision: 21-Jan-08 3
Page 9
Legal Disclaimer Notice
Vishay

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com Revision: 11-Mar-11 1
Loading...