Surface Mount Package SOT-223, TO-263, TO-252 , TO-220 & SO-8
•
PRODUCT DESCRIPTION
The SPX1202 is a low power positive-voltage regulator designed to meet 600mA output current. This device is an excellent choice for
use in battery-powered applications, as active terminators for the SCSI bus, and portable computers. The SPX1202 features very low
quiescent current and very low dropout voltage of 1.2V at a full load and lower as output current decreases. This product is available
as an adjustable or fixed 3V, 3.3V, and 5V output voltages.
The SPX1202 is offered in a 3-pin surface mount package SOT-223, TO-252, TO-220 & TO-263. The output capacitor of 10µF or
larger is needed for output stability of SPX1202 as required by most of the other regulator circuits.
PIN CONNECTIONS
APPLICATIONS
Portable/ Palm Top / Notebook Computers
•
Battery Chargers
•
Disk Drives
•
Portable Instrumentation
•
SMPS Post-Regulator
•
TO-263-3 Package
SPX1202
Front View
V
3
V
2
1
ADJ/GND
SOT-223 Package
IN
OUT
SPX1202
132
ADJ/GND
Front View
V
V
OUT
IN
TO-220 Package
SPX1202
Front View
V
V
ADJ/GND
8-Pin Surface Mount
GND
IN
N/C
OUT
V
OUT
V
OUT
1
2
SPX1202
3
4
Top View
TO-252 Package
8
V
IN
7
V
IN
V
6
IN
N/C
5
3
2
SPX1202
1
Front View
V
IN
V
OUT
ADJ/GND
Rev. 10/19/00
Page 2
SPX1202
ABSOLUTE MAXIMUM RATINGS
Power Dissipation..........................................Internally Limited Input Supply Voltage ......................................-20V to +20V
Lead Temp. (Soldering, 5 Seconds) ................................ 260°C ESD Rating ............................................................2KV Min
Storage Temperature Range ............................ -65° to +150°C
Operating Junction Temperature Range
SPX1202................................................ -40C° to +125°C
ELECTRICAL CHARACTERISTICS
Boldface
apply over the full operating temperature range.
Parameter
1.5V Version
Output Voltage
2.5V Version
Output Voltage
3.0V Version
Output Voltage
3.3 V Version
Output Voltage
5.0V Version
Output Voltage
All Output Voltage
Reference Voltage
Output Voltage
Temperature Stability
Line Regulation
Load Regulation
Dropout Voltage
( Note 2)
Quiescent Current
I
OUT
0
I
≤
I
OUT
0
I
≤
I
OUT
0
I
≤
I
OUT
0
I
≤
I
OUT
0
I
≤
I
OUT
10
≤
(Note 1)
4.50V ≤V
4.80V ≤V
6.50V ≤V
0≤I
0≤I
0≤I
I
= 100mA
L
I
= 600mA
L
4.25V ≤V
at VIN = V
Conditions
=10mA, VIN=5.00V
600mA, 4.50≤V
≤
OUT
=10mA, VIN=5.00V
600mA, 4.50≤V
≤
OUT
=10mA, VIN=5.00V
600mA, 4.50≤V
≤
OUT
=10mA, VIN=5.00V
600mA, 4.50≤V
≤
OUT
=10mA, VIN=5.00V
600mA, 4.50≤V
≤
OUT
=10mA, (V
I
OUT
OUT
OUT
OUT
IN- VIN
600mA, 1.4≤(V
≤
12V, V
≤
IN
12V, V
≤
IN
15V, V
≤
IN
600mA, V
≤
600mA, V
≤
600mA, V
≤
6.5V
≤
IN
IN
IN
IN
+1, Ta=25°C, CL =3.3µf, unless otherwise specified. Limits in
OUT
≤
IN
≤
IN
≤
IN
≤
IN
≤
IN
) =2V
-VIN) ≤10V
IN
=3.00, I
OUT
=3.30, I
OUT
=5.00, I
OUT
=4.50V, V
=4.80V, V
=6.50V, V
10V
10V
10V
10V
10
=0
OUT
=0
OUT
=0
OUT
=3.00
OUT
=3.30
OUT
=5.00
OUT
Typ
1.500
2.500
3.000
3.300
5.000
1.250
SPX1202
Min Max
1.485
1.470
2.475
2.450
2.970
2.940
3.267
3.234
4.950
4.900
1.238
1.225
1.00
7.00
1.00
1.00
1.00
12.00
1.00
1.00
1.00
1.10
1.05
1.515
1.530
2.525
2.550
3.030
3.060
3.333
3.366
5.050
5.100
1.262
1.270
0.05
7.00
10.00
12.00
15.00
1.15
5.00 10.00 mA
Units
V
V
V
V
V
V
%
mV
mV
V
Current Limit (VIN-V
Thermal Regulation
Ripple Rejection f
25
RIPPLE
V
RIPPLE
Long Term Stability 125
RMS Output Noise
% of V
)=5V
OUT
°C,
30mS Pulse
°
=120Hz, (VIN-V
=1V
p-p
°C, 1000Hrs
, 10Hz≤f≤10kHz
OUT
) = 3V,
OUT
Thermal Resistance Junction to case, at tab
Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range
Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at
Note 2:
very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied. excluding loads or line
regulation effect
850 1000 mA
0.01 0.1
60 75
0.03
0.003
15
%/W
dB
%
%
°C/W°
Rev. 10/19/00
Page 3
SPX1202
APPLICATION NOTES EXTERNAL
CAPACITOR
To ensure the stability of the SPX1202 an output capacitor of
at least 10µF (tantalum)or 50µF (aluminum) is required. The
value may change based on the application requirements on
the output load or temperature range. The capacitor
equivalent series resistance (ESR) will effect the SPX1202
stability. The value of ESR can vary from the type of
capacitor used in the applications. The recommended value
for ESR is 0.5Ω. The output capacitance could increase in
size to above the minimum value. The larger value of output
capacitance as high as 100µF can improve the load transient
response.
SOLDERING METHODS
The SPX1202 SOT-223 package is designed to be
compatible with infrared reflow or vapor-phase reflow
soldering techniques. During soldering the non-active or
mildly active fluxes may be used. The SPX1202 die is
attached to the heatsink lead which exits opposite the input,
output, and ground pins.
Hand soldering and wave soldering should be avoided since
these methods can cause damage to the device with excessive
thermal gradients on the package. The SOT-223
recommended soldering method are as follows: vapor phase
reflow and infrared reflow with the component preheated to
within 65°C of the soldering temperature range.
THERMAL CHARACTERISTICS
The thermal resistance of SPX1202 is 15°C/W from junction
to tab and 31 °C/W from tab to ambient for a total of 46
C/W from junction to ambient. The SPX1202 features the
°
internal thermal limiting to protect the device during
overload conditions. Special care needs to be taken during
continuos load conditions the maximum junction temperature
does not exceed 125 °C.
Taking the FR-4 printed circuit board and 1/16 thick with 1
ounce copper foil as an experiment (fig.1 & fig.2), the PCB
material is effective at transmitting heat with the tab attached
to the pad area and a ground plane layer on the backside of
the substrate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components in the
application can effect the thermal resistance of the SPX1202.
The actual thermal resistance can be determined with
experimentation. SPX1202 power dissipation is calculated as
follows:
P
= (VIN - V
D
OUT
)(I
OUT
)
Maximum Junction Temperature range:
T
J
= T
(max) + PD* thermal resistance(Junction-to-
ambient
ambient)
Maximum Junction temperature must not exceed the 125°C.
10V
+
10uF
SPX1202
+
10uF
PO = (10V - 2.85)(105mA) = (7.15)(105mA) = 703mW
Fig. 1. Circuit Layout, Thermal Experiments.
50 X 50 mm
35 X 17 mm
16 X 10 mm
Fig. 2. Substrate Layout for SOT-223
2.85V
27K
..
Ω
Rev. 10/19/00
Page 4
SPX1202
Table 1.
TOTAL PC BOARD AREA TOPDIDE COPPER AREA BACKSIDE COPPER AREA THERMAL RESISTANCE
1% Adj 3 Lead TO-220
1% 1.5V 3 Lead TO-220
1% 2.5V 3 Lead TO-220
1% 3.0V 3 Lead TO-220
1% 3.3V 3 Lead TO-220
1% 5.0V 3 Lead TO-220
1% Adj 3 Lead TO-263
1% 1.5V 3 Lead TO-263
1% 2.5V 3 Lead TO-263
1% 3.0V 3 Lead TO-263
1% 3.3V 3 Lead TO-263
1% 5.0V 3 Lead TO-263
1% Adj 3 Lead TO-223
1% 1.5V 3 Lead TO-223
1% 2.5V 3 Lead TO-223
1% 3.0V 3 Lead TO-223
1% 3.3V 3 Lead TO-223
1% 5.0V 3 Lead TO-223
1% Adj 3 Lead TO-220
1% 1.5V 8 Lead SOIC
1% 2.5V 8 Lead SOIC
1% 3.0V 8 Lead SOIC
1% 3.3V 8 Lead SOIC
1% 5.0V 8 Lead SOIC
1% Adj 3 Lead T0-252
1% 1.5V 3 Lead TO-252
1% 2.5V 3 Lead TO-252
1% 3.0V 3 Lead TO-252
1% 3.3V 3 Lead TO-252
1% 5.0V 3 Lead TO-252
SIGNAL PROCESSING EXCELLENCE
Corporation
Sipex Corporation
Headquarters and Main Offices:
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: sales@sipex.com
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 935-7600
FAX: (408) 934-7500
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described
hereing; neither does it convey any license under its patent rights nor the rights of others.
Rev. 10/19/00
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