The SPX1202 is a low power positive-voltage regulator designed to satisfy moderate power
requirements with a cost effective, small footprint solution. This device is an excellent choice for
use in battery-powered applications and portable computers. The SPX1202 features very low
quiescent current and a low dropout voltage of 1.1V at a full load. As output current decreases,
quiescent current flows into the load, increasing efficiency. SPX1202 is available in adjustable
or fixed 2.5V, 3V and 3.3V output voltages.
The SPX1202 is offered in several 3-pin surface mount packages: SOT-223, TO-252, TO-220
and TO-263. An output capacitor of 10µF provides unconditional stability while a smaller 2.2µF
capacitor is sufficient for most applications.
Long Term Stability125°C, 1000Hrs0.03%
RMS Output Noise% of V
Thermal ResistanceJunction to Case, at tab15°C/W
NOTES:
Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at
Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied excluding load or line regulation effect.
+ 1.5V, TA = 25°C, CIN = C
OUT
= 10mA, VIN = 5.00V2.4752.5002.525V
OUT
0 ≤ I
OUT
= 10mA, VIN = 5.00V2.9703.0003.030V
OUT
0 ≤ I
OUT
= 10mA, VIN = 5.00V3.2673.3003.333V
OUT
0 ≤ I
OUT
=10mA, (V
OUT
10≤I
OUT
4.80V≤VIN≤ 12V,V
6.50V≤VIN≤ 12V,V
OUT
0≤I
OUT
0≤I
OUT
=120Hz, (VIN-V
RIPPLE
V
RIPPLE
very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
= 10µF, unless otherwise specified. Limits in Boldface applies over the
To ensure the stability of the SPX1202, an
output capacitor of at least 10µF (tantalum or
ceramic)or 50µF (aluminum) is required. The
value may change based on the application
requirements of the output load or temperature
range. The value of ESR can vary based on the
type of capacitor used in the applications. The
recommended value for ESR is 0.5Ω or less. A
larger value of output capacitance (up to 100µF)
can improve the load transient response.
SOLDERING METHODS
The SPX1202 SOT-223 package is designed to
be compatible with infrared reflow or vaporphase reflow soldering techniques. During soldering, the non-active or mildly active fluxes
may be used. The SPX1202 die is attached to
the heatsink lead which exits opposite the input,
output, and ground pins.
50 X 50mm
35 X 17mm
16 X 10mm
Figure 7. Substrate Layout for SOT-223
in the application can effect the thermal resistance of the SPX1202. The actual thermal resistance can be determined with experimentation.
SPX1202 power dissipation is calculated as
follows:
PD = (VIN - V
OUT
)(I
OUT
)
Maximum Junction Temperature range:
Hand soldering and wave soldering should be
avoided since these methods can cause damage
to the device with excessive thermal gradients
on the package. The SOT-223 recommended
soldering method are as follows: vapor phase
reflow and infrared reflow with the component
preheated to within 65°C of the soldering temperature range
THERMAL CHARACTERISTICS
The thermal resistance of SPX1202 depends on
the type of package and PC board layout as
shown in Table 1. The SPX1202 features the
internal thermal limiting to protect the device
during overload conditions. Special care needs
to be taken during continuous load conditions
such that the maximum junction temperature
does not exceed 125°C. Thermal protection is
activated at >144°C and deactiviated at <137°C.
Taking the FR-4 printed circuit board and 1/16
thick with 1 ounce copper foil as an experiment,
the PCB material is effective at transmitting
heat with the tab attached to the pad area and a
ground plane layer on the backside of the substrate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components
TJ = T
(max) + PD* (Thermal Resistance)
AMBIENT
(Junction-to-ambient)
Maximum junction temperature must not exceed the 125°C.
Ripple Rejection
Ripple rejection can be improved by adding a
capacitor between the ADJ pin and ground as
shown in Figure 7. When ADJ pin bypassing is
used, the value of the output capacitor required
increases to its maximum. If the ADJ pin is not
bypassed, the value of the output capacitor can
be lowered to 10µF for an electrolytic aluminum
capacitor or 2.2µF for a solid tantalum capacitor
(Fig 10).
However the value of the ADJ-bypass capacitor
should be chosen with respect to the following
equation:
C = 1 / ( 6.28 * FR * R1 )
Where C = value of the capacitor in Farads
(select an equal or larger standard value),
FR = ripple frequency in Hz,
R1 = value of resistor R1 in Ohms.
tude of the output ripple will be independent of
the output voltage. If an ADJ-bypass capacitor
is not used, the output ripple will be proportional
to the ratio of the output voltage to the reference
voltage:
M = V
OUT
/ V
REF
Where M = multiplier for the ripple seen when
the ADJ pin is optimally bypassed.
V
=1.25V
REF
The output of the adjustable regulator can be set
to any voltage between 1.25V and 15V. The
value of V
using the formula. (Figure 9)
can be quickly approximated
OUT
=1.25 *(R1 + R2)/R1.
V
OUT
A small correction to this formula is required
depending on the values of resistors R1 and R2,
since adjustable pin current (approx 50µA) flows
through R2. When I
formula becomes
is taken into account, the
ADJ
Output Voltage
PC BOARD TOPSIDE COPPER BACKSIDE COPPERTHERMAL RESISTANCE
Parasitic line resistance can degrade load regulation. In order not to affect the behavior of the regulator,
it is best to connect R1 to the case as illustrated in Figure 12. For the same reason, R2 should be
connected to the negative side of the load.
Parasitic Line
R
P
V
IN
SPX1202
ADJ
Resistance
Connect R1to
Case of Regulator
R
R
1
2
V
OUT
R
L
Connect R
to Load
2
Figure 12. Recommended Connections for Best Results