Datasheet SPX1117M3, SPX1117M3-1.5, SPX1117M3-2.5, SPX1117M3-3.0, SPX1117U-2.5 Datasheet (Sipex Corporation)
...Page 1
SPX1117
800mA Low Dropout Regulator
FEATURES
Guaranteed 800mA Output
•
Three Terminal Adjustable Or Fixed 1.5V, 2.5V, 3V, 3.3V & 5V
•
Very Low Quiescent Current
•
Low Dropout Voltage Of 1.2 Volts At Full Load
•
Extremely Tight Load And Line Regulation
•
Very Low Temperature Coefficient
•
Logic-Controlled Electronic Shutdown
•
Internal Overcurrent Limiting & Thermal Overload Protection
•
Surface Mount Package SOT-223, TO-252, TO-220, SOT-89, TO-263, & SO-8
•
PRODUCT DESCRIPTION
The SPX1117 is a low power positive-voltage regulator designed to meet 800mA output current. This device is an excellent choice for
use in battery-powered applications. The SPX1117 features very low quiescent current and very low dropout voltage of 1.2V at a full
load and lower as output current decreases. SPX1117 is available as an adjustable or fixed 1.5V, 2.5V, 3.0V, 3.3V, and 5.0V output
voltages.
The SPX1117 is offered in a 3-pin surface mount package SOT-223, TO-252, TO-220 and TO-263. The output capacitor of 10µF or
larger is needed for output stability of SPX1117 as required by most of the other regulator circuits.
PIN CONNECTIONS
8-Pin Surface Mount (S)
TO-220-3 (U)
SOT-223 (M3)
APPLICATIONS
Portable/ Palm Top / Notebook Computers
•
Battery Chargers
•
Disk Drives
•
Portable Consumer Equipment
•
Portable Instrumentation
•
SMPS Post-Regulator
•
TO-263-3 (T)
TO-252 (R)
GND
N/C
V
V
1
2
3
OUT
4
OUT
SPX1117
Top View
8
V
IN
7
V
IN
6
V
IN
5
N/C
ADJ/GND
SPX1117
1
23
V
OUT
Front View
V
IN
ADJ/GND
SPX1117
132
V
OUT
Top View
SPX1117
2
V
OUT
Top View
3
V
IN
1
V
IN
ADJ/GND
ADJ/GND
SPX1117
1
23
V
OUT
Front View
V
IN
Rev. 10/20/00
Page 2
SPX1117
ABSOLUTE MAXIMUM RATINGS
Power Dissipation..........................................Internally Limited Input Supply Voltage ......................................-20V to +20V
Lead Temp. (Soldering, 5 Seconds) ................................ 260°C ESD Rating ............................................................2KV Min
Storage Temperature Range ............................ -65° to +150°C
Operating Junction Temperature Range
SPX1117................................................ -40C° to +125°C
ELECTRICAL CHARACTERISTICS at
Boldface
apply over the full operating temperature range.
Parameter
1.5V Version
Output Voltage
2.5V Version
Output Voltage
3.0V Version
Output Voltage
3.3V Version
Output Voltage
5.0V Version
Output Voltage
All Output Options
Reference Voltage
Output Voltage
Temperature Stability
Line Regulation
Load Regulation
Dropout Voltage
( Note 2)
Quiescent Current
Current Limit
Thermal Regulation
Ripple Rejection
Long Term Stability
RMS Output Noise
Thermal Resistance
Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range
Note 2:
programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.
Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied. excluding load or line regulation effect.
Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at very low values of
I
= 10mA, V
OUT
0≤I
OUT
I
= 10mA, V
OUT
0≤I
OUT
I
= 10mA, V
OUT
0≤I
OUT
I
= 10mA, V
OUT
0≤I
OUT
I
= 10mA, V
OUT
0≤I
OUT
I
= 10mA, (V
OUT
10≤ I
OUT
(Note 1)
4.50V ≤V
4.80V ≤V
6.50V ≤V
0≤I
OUT
0≤I
OUT
0≤I
OUT
I
= 100mA
L
I
= 500mA
L
I
= 800mA
L
4.25V ≤V
(VIN-V
25°C,30mS Pulse
f
RIPPLE
V
RIPPLE
125°C, 1000Hrs 0.03 %
% of V
Junction to case, at tab 15
VIN = V
OUT
Conditions
= 4.85V
IN
800mA, 4.25≤V
≤
= 4.85V
IN
800mA, 4.25≤V
≤
= 4.85V
IN
800mA, 4.75≤V
≤
= 5.0V
IN
800mA, 4.75≤V
≤
= 7.0V
IN
800mA, 6.50≤V
≤
IN – VOUT
800mA, 1.4≤(V
≤
12V, V
≤
IN
12V, V
≤
IN
15V, V
≤
IN
800mA, V
≤
800mA, V
≤
800mA, V
≤
6.5V
≤
IN
) = 5V 1000 1200 mA
OUT
= 120Hz, (Vin-V
= 1V
p-p
, 10Hz≤f≤10kHz
out
IN
IN
IN
IN
IN
= 3.00, I
OUT
= 3.30, I
OUT
= 5.00, I
OUT
= 4.50V, V
IN
= 4.80V, V
IN
= 6.50V, V
IN
OUT
10V
≤
10V
≤
10V
≤
10V
≤
12V
≤
) = 2V
-VIN) ≤10V
IN
) = 3V,
+1, Ta=25°C, CL =3.3µf, unless otherwise specified. Limits in
OUT
OUT
OUT
OUT
OUT
OUT
= 0
= 0
= 0
= 3.00
= 3.30
= 5.00
Typ
1.500
2.500
3.000
3.300
5.000
1.250
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.05
1.10
5.00 10.00 mA
0.01 0.1 %/W
60 75 dB
0.003 %
SPX1117
Min Max
1.485
1.470
2.475
2.450
2.970
2.940
3.267
3.234
4.950
4.900
1.238
1.225
7.00
12.00
1.515
1.530
2.525
2.550
3.030
3.060
3.333
3.366
5.050
5.100
1.262
1.270
0.05
7.00
10.00
12.00
15.00
1.10
1.15
1.20
Units
°C/W°
V
V
V
V
V
V
%
mV
mV
V
Rev. 10/20/00
Page 3
SPX1117
APPLICATION NOTES EXTERNAL
CAPACITOR
To ensure the stability of the SPX1117 an output capacitor of
at least 10µF (tantalum)or 50µF (aluminum) is required. The
value may change based on the application requirements on
the output load or temperature range. The capacitor
equivalent series resistance (ESR) will effect the SPX1117
stability. The value of ESR can vary from the type of
capacitor used in the applications. The recommended value
for ESR is 0.5Ω. The output capacitance could increase in
size to above the minimum value. The larger value of output
capacitance as high as 100µF can improve the load transient
response.
SOLDERING METHODS
The SPX1117 SOT-223 package is designed to be
compatible with infrared reflow or vapor-phase reflow
soldering techniques. During soldering the non-active or
mildly active fluxes may be used. The SPX1117 die is
attached to the heatsink lead which exits opposite the input,
output, and ground pins.
Hand soldering and wave soldering should be avoided since
these methods can cause damage to the device with excessive
thermal gradients on the package. The SOT-223
recommended soldering method are as follows: vapor phase
reflow and infrared reflow with the component preheated to
within 65°C of the soldering temperature range.
THERMAL CHARACTERISTICS
The thermal resistance of SPX1117 is 15°C/W from junction
to tab and 31 °C/W from tab to ambient for a total of 46
C/W from junction to ambient. The SPX1117 features the
°
internal thermal limiting to protect the device during
overload conditions. Special care needs to be taken during
continuos load conditions the maximum junction temperature
does not exceed 125 °C.
Taking the FR-4 printed circuit board and 1/16 thick with 1
ounce copper foil as an experiment (fig.1 & fig.2), the PCB
material is effective at transmitting heat with the tab attached
to the pad area and a ground plane layer on the backside of
the substrate. Refer to table 1 for the results of the
experiment.
The thermal interaction from other components in the
application can effect the thermal resistance of the SPX1117.
The actual thermal resistance can be determined with
experimentation. SPX1117 power dissipation is calculated as
follows:
P
= (VIN - V
D
OUT
)(I
OUT
)
Maximum Junction Temperature range:
T
J
= T
(max) + PD* thermal resistance (Junction-to-
ambient
ambient)
Maximum Junction temperature must not exceed the 125°C.
50 X 50 mm
35 X 17 mm
16 X 10 mm
Fig. 1. Substrate Layout for SOT-223
Rev. 10/20/00
Page 4
SPX1117
Table 1.
TOTAL PC BOARD AREA TOPDIDE COPPER AREA BACKSIDE COPPER AREA THERMAL RESISTANCE
2500mm
2500mm
2500mm
2500mm
2500mm
1600mm
2500mm
2500mm
1600mm
900mm
900mm
2500mm
1250mm
950mm
2500mm
1800mm
600mm
1250mm
915mm
600mm
240mm
240mm
2500mm
2500mm
2500mm
0
0
1600mm
0
0
0
900mm
0
JUNCTION TO AMBIENT
°C/W
46
°°°°
°C/W
47
°°°°
°C/W
49
°°°°
°C/W
51
°°°°
°C/W
53
°°°°
°C/W
55
°°°°
°C/W
58
°°°°
°C/W
59
°°°°
°C/W
67
°°°°
°C/W
72
°°°°
°C/W
85
°°°°
V
IN
C
1
ADJ
SPX1117
IN
800mA Current output
OUT
R
1
LOAD
V
IN
C
1
V
= V
OUT
(1+R2/R1) +I
REF
Typical Adjustable Regulator
IN
SPX1117
ADJ
I
ADJ
50uA
ADJ R2
OUT
C
v
REF
R
1
R
2
V
OUT
2
Rev. 10/20/00
Page 5
SPX1117
PACKAGE DRAWING
TO-263-3L (T)
±
0.405
0.005
±
(10.287 0.127)
0.055 (1.397)
0.176
0.050
±
0.005
±
0.002
±
0.356 0.005
±
(9.042 0.127)
0.600
(15.24
+
0.025
-
±
0.635)
±
±
0.010
0.103 BSC
(2.616)
0.050 (1.270)
+
0.032
0.001
+
(0.813 0.025)
-
0.015
(0.381 0.074)
+
-
+
-
0° 8°
0.003
0.100
(2.540 0.254)
(4.470
(1.270
±
0.127)
±
0.051)
Rev. 10/20/00
Page 6
SPX1117
PACKAGE DRAWING
SOT-223-3L (M3)
0.124
0.116
0.146
0.130
0.295
0.264
0.0905 NOM
0.181 NOM
0.0040
0.0008
0.264
0.248
0.033
0.025
0.041
0.033
0.146
0.130
°
16
10°C
16°C
10°C Max
°
16
10°C
C
0.014
0.010
C
Rev. 10/20/00
Page 7
SPX1117
PACKAGE DRAWING
TO-220-3L (U)
0.408 ± 0.013
(10.36 ± 0.33)
0.151D ± 0.002
(3.835 D ± 0.051)
0.110 ± 0.010
(2.794 ± 0.254)
0.250 ± 0.010
(6.350 ± 0.254)
0.340 ± 0.010
(8.636 ± 0.254)
0.540 ± 0.015
(13.720 ± 0.381)
0.150 MIN
(3.81 MIN)
0.410
(10.41)
0.050 TYP
(1.27 TYP)
0.200 ± 0.010
(5.080 ± 0.254)
0.100 ± 0.010
(2.540 ± 0.254)
0.032 ± 0.005
(0.813 ± 0.127)
0.180 ± 0.005
(4.572 ± 0.127)
7o Typ.
0.015 ± 0.010/-0.002
(0.381± 0.254/-0.051)
0.050 ± 0.002
(1.270 ± 0.051)
SEATING PLANE
1.020 ± 0.015
(25.910 ± 0.381)
0.015 ± 0.010/-0.015
(2.667± 0.254/-0.381)
Tapered 1
2 Sides
o
Rev. 10/20/00
Page 8
SPX1117
PACKAGE DRAWING
8-PIN SOIC (S)
Pin 1
1.27 (0.50)
BSC
5.0 (0.197)
4.8 (0.188)
0.56 (0.022)
0.49 (0.019)
0.45 (0.018)
0.35 (0.014)
4.0 (0.158)
3.8 (0.150)
1.75 (0.069)
1.35 (0.053)
0.78 (0.031)
0.61 (0.024)
0.20 (0.008)
0.10 (0.004)
5.2 (0.205)
4.6 (0.181)
0.37 (0.015)
BSC
0.22 (0.009)
0.19 (0.007)
6.2 (0.244)
5.8 (0.228)
°
45
7
0.77 (0.030)
0.64 (0.025)
°
(4 PLCS)
3°-6
7°(4 PLCS)
°
Rev. 10/20/00
Page 9
SPX1117
PACKAGE DRAWING
TO-252-3L (R)
E
b
2
-A-
L
2
A
A
1
C
1
4
D
3
21
L
3
L
1
-C-
M
b
3 PLCS
A M
C
e1
D
1
.010
TERM 4
b
1
e
NOTES
1. Refer To Applicable Symbol List.
2. Dimensions And Tolerancing Per Ansi Y14.5m - 1982.
3. Lead Dimension Uncontrolled in L
E
1
4. Tab Contour Optional Within Dim. b
5. D1 & E1 Establishes A Minimum Mounting Surface for Terminal 4.
6. L is the Termal Length for Soldering.
7. Controlling Dimension: Inch
8. 2 Mils Suggested For Postive Contact At Mounting.
S
BACK VIEW A-A
Y
M
B
O
L
A 0.086 0.094 2.184 2.3876
A1 0.035 0.045 0.889 1.143
b 0.025 0.035 0.635 0.889
b1 0.300 0.045 7.620 1.143
b2 0.205 0.215 5.207 5.461 4
c 0.01 8 0.023 0.457 0.5842
c1 0.018 0.023 0.457 0.5842
D 0.235 0.245 5.969 6.22 3
D1 0.170 - 4.318 - 4,5
E 0.250 0.265 6.350 6.731
E1 0.170 - 4.318 - 4,5
e
e1
H 0.370 0.410 9.398 10.4 14
L 0.020 - 0.508 - 6
L1 0.025 0.040 0.635 1.016
L2 0.035 0.050 0.889 1.270 4
L3 0.045 0.060 1.143 1.524 3
MIN MAX MIN MAX
c
8
INCH ES
0.098
0.180
-B-
SEATING
PLANE
L
A
H
A
.
3
& L2 And E1 & D
2
1
MM
2.489
4.572
N
O
T
E
Rev. 10/20/00
Page 10
SPX1117
ORDERING INFORMATION
Ordering No. Precision Output Voltages Packages
SPX1117U
SPX1117U-1.5
SPX1117U-2.5
SPX1117U-3.0
SPX1117U-3.3
SPX1117U-5.0
SPX1117T
SPX1117T-1.5
SPX1117T-2.5
SPX1117T-3.0
SPX1117T-3.3
SPX1117T-5.0
SPX1117M3
SPX1117M3-1.5
SPX1117M3-2.5
SPX1117M3-3.0
SPX1117M3-3.3
SPX1117M3-5.0
SPX1117S
SPX1117S-1.5
SPX1117S-2.5
SPX1117S-3.0
SPX1117S-3.3
SPX1117S-5.0
SPX1117R
SPX1117R-1.5
SPX1117R-2.5
SPX1117R-3.0
SPX1117R-3.3
SPX1117R-5.0
1% Adj 3 Lead TO-220
1% 1.5V 3 Lead TO-220
1% 2.5V 3 Lead TO-220
1% 3.0V 3 Lead TO-220
1% 3.3V 3 Lead TO-220
1% 5.0V 3 Lead TO-220
1% Adj 3 Lead TO-263
1% 1.5V 3 Lead TO-263
1% 2.5V 3 Lead TO-263
1% 3.0V 3 Lead TO-263
1% 3.3V 3 Lead TO-263
1% 5.0V 3 Lead TO-263
1% Adj 3 Lead TO-223
1% 1.5V 3 Lead TO-223
1% 2.5V 3 Lead TO-223
1% 3.0V 3 Lead TO-223
1% 3.3V 3 Lead TO-223
1% 5.0V 3 Lead TO-223
1% Adj 3 Lead TO-220
1% 1.5V 8 Lead SOIC
1% 2.5V 8 Lead SOIC
1% 3.0V 8 Lead SOIC
1% 3.3V 8 Lead SOIC
1% 5.0V 8 Lead SOIC
1% Adj 3 Lead TO-252
1% 1.5V 3 Lead TO-252
1% 2.5V 3 Lead TO-252
1% 3.0V 3 Lead TO-252
1% 3.3V 3 Lead TO-252
1% 5.0V 3 Lead TO-252
SIGNAL PROCESSING EXCELLENCE
Corporation
Sipex Corporation
Headquarters and Main Offices:
22 Linnell Circle
Billerica, MA 01821
TEL: (978) 667-8700
FAX: (978) 670-9001
e-mail: sales@sipex.com
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 935-7600
FAX: (408) 934-7500
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described
hereing; neither does it convey any license under its patent rights nor the rights of others.
Rev. 10/20/00
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