Datasheet SPT8100SIT Datasheet (SPT)

Page 1
SPT8100
16-BIT, 5 MSPS CMOS A/D CONVERTER
FEATURES
• 16-bit, 5 MSPS CMOS analog-to-digital converter
• On-chip PGA: gain range from 0 to 20 dB in seven selectable settings:
0 dB, +3 dB, +6 dB, +12 dB, +15 dB, +18 dB, +20 dB
• DNL: ±0.5 LSB, INL: ±1.25 LSB
• SFDR: 94 dB @ ƒIN = 900 kHz, –8.1 dBFS
• Internal sample-and-hold and voltage reference
• Power dissipation: 465 mW at 5 MSPS; 230 mW at
2.5 MSPS
• +5 V analog supply and +3.3 to +5.25 V digital output supply
• 44-lead LQFP plastic package.
GENERAL DESCRIPTION
The SPT8100 is a high performance, 16-bit analog-to-digital converter that operates at a sample rate of up to 5 MSPS. Excellent dynamic performance and high linearity is achieved by a digitally calibrated pipelined architecture fab­ricated in CMOS process technology.
A low-noise programmable gain amplifier (PGA) is also in­corporated on chip. The PGA is digitally programmable in seven selected settings over a 0 to +20 dB range. The
APPLICATIONS
• Data acquisition systems
• IR imaging
• Scanners and digital copiers
• High-end CCD cameras
• Medical imaging
• Wireless communications
• Lab and test equipment
• Automatic test equipment
SPT8100 also features an on-chip internal sample-and-hold and internal reference for minimal external circuitry.
It operates from a single +5 V supply. Total power dissipa­tion, including internal reference, is 465 mW. A separate digital output supply pin is provided for +3.3 V or 5 V logic output levels. The SPT8100 is available in a 44-lead LQFP package over the industrial temperature range of –40 °C to +85 °C.
BLOCK DIAGRAM
Signal Processing Technologies, Inc.
Phone: (719) 528-2300 FAX: (719) 528-2370 Website: http://www.spt.com E-Mail: sales@spt.com
V
IN
V
V
CM
GS2 – GS0
(Gain Set)
AV
+5V
Low-Noise
PGA
+
IN
VREF
AGND
BIAS
OGNDDGND
(Ext Bias
Capacitor)
BIAS
C
(Ext Bias Resistor)
DV
DD
16-bit, 5 MSPS ADC
V
R
RTVRB
+5V
OV
DD
DD
+3/5 V
16-bits
CLK
4755 Forge Road, Colorado Springs, Colorado 80907, USA
OE (Output Enable)
OVR (Over-Range)
D15 – D0 (Data Outputs)
RS (Reset) RDY (Ready)
Page 2
ABSOLUTE MAXIMUM RATINGS (Beyond which damage may occur)1 25 °C
DD
Output
Digital Outputs ......................................................10 mA
Temperature
Operating Temperature ............................. –40 to +85 °C
Junction Temperature ........................................+175 °C
Lead Temperature (soldering 10 seconds) ........ +300 °C
Storage Temperature ..............................–65 to +150 °C
Supply Voltages
AVDD........................................................................+6 V
DVDD........................................................................+6 V
OVDD........................................................................+6 V
Input Voltages
Analog Input................................... –0.5 V to VDD +0.5 V
CLK Input..................................................................V
AV
– DVDD.....................................................±100 mV
DD
Delta between AGND, DGND, and OGND .......±100 mV
Note 1: Operation at any Absolute Maximum Rating is not implied. See Electrical Specifications for proper nominal applied conditions
in typical applications.
ELECTRICAL SPECIFICATIONS
TA=T
PARAMETERS CONDITIONS LEVEL MIN TYP MAX UNITS
Resolution 16 Bits
DC Accuracy
MIN
to T
, AVDD=DVDD=+5.0 V, OVDD= 3.3 V, ƒS=5 MSPS, 2.5 VPP input span, R
MAX
=1.43 k, unless otherwise specified.
EXT
TEST TEST SPT8100
Integral Nonlinearity V ±1.25 LSB Differential Nonlinearity V ±0.5 LSB Gain Error Offset Error
1
2
VI –7.5 +7.5 %FSR
V –5 +5 %FSR
Analog Input (into PGA)
Differential Input Voltage Range
+, VIN–V5V
V
IN
PP
Input Capacitance IV 15 pF Input Resistance Input Bandwidth
3
4
PGA Gain = 0 dB IV 5.5 k
V 11 MHz
Input Common Mode Voltage Range V 1.1 2.35 3.6 V
Programmable Gain Amp
Composite Input-Referred PGA Gain = 0 dB V 45.0 nV/√Hz
Noise Floor PGA Gain = 20 dB V 8.0 nV/√Hz
> 300 kHz
ƒ
IN
PGA Range V 20 dB PGA Gain Steps
3
VI 3,6,12,15,18,20 dB
PGA Gain Accuracy VI ±0.3 dB
Conversion Characteristics
Maximum Conversion Rate VI 5 MHz Pipeline Delay (Latency) IV 6
Clock Cycles
Reset Pulse Time (RS) IV 3 Clock Cycles Reset Calibration Time FS = 5 MSPS V 150 ms
References and External Bias
– VRB (Internal Ref) VI 2.375 2.5 2.625 V
V
RT
Bias Resistor Range (External) IV 800 1430 2500
Output Voltage IV 2.23 2.35 2.47 V
V
CM
Output Current IV 50 µA
V
CM
V
RT
V
RB
1
Total gain error of PGA and ADC using internal references.
2
Total offset error of PGA and ADC relative to mid-scale.
3
See table I for input resistance as a function of PGA gain.
4
Input bandwidth is a frequency to which the fundamental energy drops by 3 dB
IV 3.45 3.65 3.85 V IV 0.95 1.15 1.35 V
SPT
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ELECTRICAL SPECIFICATIONS
TA=T
PARAMETERS CONDITIONS LEVEL MIN TYP MAX UNITS Dynamic Performance
MIN
to T
, AVDD=DVDD=+5.0 V, OVDD= 3.3 V, ƒS=5 MSPS, 2.5 VPP input span, R
MAX
=1.43 k, unless otherwise specified.
EXT
TEST TEST SPT8100
1
Effective Number of Bits ADC Input = –1 dBFS
ƒ
= 60 kHz VI 12.2 13.0 Bits
IN
= 900 kHz V 12.7 Bits
ƒ
IN
2
Signal-to-Noise Ratio (without Harmonics) ADC Input = –1 dBFS
ƒ
= 75 kHz VI 78 81 dB
IN
ƒ
= 900 kHz V 80 dB
IN
2
Harmonic Distortion ADC Input = –0.5 dBFS
= 60 kHz V –92 –84 dB
ƒ
IN
ƒ
= 900 kHz VI –82 dB
IN
Signal-to-Noise and Distortion (SINAD) ADC Input = –1 dBFS
= 60 kHz V 75 80 dB
ƒ
IN
= 900 kHz VI 78 dB
ƒ
IN
Spurious Free Dynamic Range
ƒ
= 60 kHz ADC Input = –0.5 dB VI 85 94 dBc
IN
= 900 kHz VI 94 dBc
ƒ
IN
= 2 MHz R
ƒ
IN
ƒIN = 3 MHz R
3
= 1 kΩ @ 10 MSPS V 83 dBc
EXT
= 1 kΩ @ 10 MSPS V 78 dBc
EXT
Two-Tone Intermodulation
3rd Order Distortion ƒ
=400 kHz, ƒ2=410 kHz
1
ƒ1=890 kHz, ƒ2=900 kHz
4
V –94 dB
5
VI –89 dB
Inputs
GS0–GS2 Logic 1 Voltage VI 2.4 V GS0–GS2 Logic 0 Voltage VI 0.8 V CLK, RS Logic 1 Voltage VI 2.0 V CLK, RS Logic 0 Voltage VI 0.8 V Maximum Input Current Low VI –10 +10 µA Maximum Input Current High VI –10 +10 µA Input Capacitance V 5 pF
Digital Outputs
Logic 1 Voltage I
= –2 mA VI ODVDD – 0.5 V
OH
Logic 0 Voltage IOL = 2 mA VI 0.4 V CLK to Output Delay Time (t
)C
D
= 20 pF IV 30 ns
LOAD
Power Supply Requirements
Voltages ODV
AV
DD
DV
Currents I
DD
DD
DD
IV 3.0 3.3 5.25 V IV 4.75 5.0 5.25 V IV 4.75 5.0 5.25 V VI 93 103 mA
Power Dissipation VI 465 515 mW
1
Dynamic performance tested at ƒs=4.4 MSPS
2
0 dBFS is 5.0 V peak-to-peak differential
3
ADC Input = –8.1 dBFS, unless otherwise noted
TEST LEVEL CODES
TEST LEVEL TEST PROCEDURE
All electrical characteristics are subject to the following conditions:
All parameters having min/max specifi­cations are guaranteed. The Test Level column indicates the specific device testing actually performed during pro­duction and Quality Assurance inspec­tion. Any blank section in the data column indicates that the specification is not tested at the specified condition.
4
Test Conditions: PGA setting of 6 dB; Analog Input at ADC = –0.7 dB
5
Test Conditions: PGA setting of 0 dB; Analog Input at ADC = –1.9 dB
I 100% production tested at the specified temperature.
II 100% production tested at T
= +25 °C, and sample tested at the specified
A
temperatures. III QA sample tested only at the specified temperatures. IV Parameter is guaranteed (but not tested) by design and characterization
data.
V Parameter is a typical value for information purposes only.
VI 100% production tested at T
= +25 °C. Parameter is guaranteed over
A
specified temperature range.
SPT
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3 5/12/00
Page 4
DEVICE OVERVIEW
The SPT8100 combines a high-resolution 5 MSPS 16-bit ADC, a built-in reference, and a programmable gain amp­lifier (PGA) with resistive input impedance in a 44-pin package.
The device includes a digitally calibrated pipeline ADC, which is calibrated on assertion of a simple reset signal. The combination of low noise, high linearity , a high-input imped­ance buffer (with programmable gain), wideband S/H, on­board voltage references, and simple digital interface (16-bit parallel output word synchronous with the master sampling clock) makes the SPT8100 extremely easy to use in a wide variety of systems.
For optimum performance, the analog inputs should be driven differentially , and may be AC-coupled or DC-coupled to a source. Typical applications include high-performance data acquisition systems, automatic test equipment, and wideband digital communications receivers such as wire­less basestations.
OPERATIONAL DESCRIPTION
The following sections describe in greater detail individual blocks and functions of the SPT8100.
The incoming analog differential signal (maximum level 5 V peak-to-peak differential) enters the device at the pins VIN+/VIN–. The analog signal path is partitioned into a pro­grammable gain amplifier (PGA) and an ADC. The PGA has maximum gain of +20 dB; the gain is set by the digital con­trol signals GS0 to GS2.
The output of the PGA is fed directly to the ADC, which samples at a rate equal to the CLK frequency and outputs a 16-bit wide parallel word. The ADC uses a pipeline multi­stage architecture. Latency is 6 clock cycles.
ADC CLOCK
The chip requires a single low-jitter clock to be applied at the CLK pin, with nominal 40–60% duty cycle. All clock genera­tion is performed internally and all converter and S/H clocks in the ADC path are directly derived from CLK.
If the sample rate is changed by more than a factor of 2, the device must be recalibrated using the RS (reset) pin.
DEVICE STARTUP/INITIALIZATION SEQUENCE Note: This initialization sequence is
required
. Without
it, the device will not work.
Allow sufficient time for the analog blocks on the SPT8100 to power on and come up to their quiescent DC states. Allowance may also be needed for thermal time constants associated with the package/board.
On powerup, the SPT8100’s RS (reset) should be held low for at least three clock cycles. The power supply voltages applied to the device must be stable during this time. The clock signal (CLK) must be running for at least three clock cycles prior to the rising edge of RS, and must continue running.
When the RS signal goes from low to high, calibration is initiated. RDY is driven low two clock cycles after the rising edge of RS, and will stay low for 150 ms with a 5 MHz clock. When the initialization is complete, RDY returns high and the device is ready for normal operation. Note that the cali­bration of the ADC can be interrupted (before completion) by changing the RS signal from high to low, which will cause another reset to occur. When RS goes from low back to high, another calibration cycle will begin.
RDY cannot be tri-stated: it is always driven either high or low. The CLK clock must be constantly running throughout the initialization phase until RDY is deasserted. Note that
Figure 1 – Device Initialization Timing
PWR ON
A
IN
CLK
RS
RDY
D
OUT
Requires external reset on powerup
SPT
3 clock cycles min
N+8
N+4
N+5
2 clock cycles
Initialization period: 150 ms with 5 MHz clock
INVALID DATA
N+7
N+6
5 ns typ
24 ns typ
N N+1 N+2
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although typically the device is initialized when power is first applied, the initialization is only started when the RS is asserted; there is no “power-on-reset” circuitry on chip. may be held low for an indefinite period of time. While RS is low, RDY will remain high. After RS is returned to high, RDY will go low for the duration of the calibration.
RS
PROGRAMMABLE GAIN AMPLIFIER
The programmable gain amplifier (PGA) precedes the ADC inputs. The differential inputs, which are resistive, are at pins VIN+ and VIN–.The maximum input range is 5 V peak­to-peak differential (2.5 V single-ended). To achieve maxi­mum overall system noise performance, the source driving these inputs needs to be as low-noise and as low-jitter as possible, while maintaining the required distortion perfor­mance. In addition, the driving source must be low imped­ance to maintain the accuracy of the PGA gain.
The internal 0 dB analog signal level and ADC full-scale out­put level is 5 V peak-to-peak differential (2.5 V single­ended). The PGA may be used to provide gain for an input less than 5 V peak-to-peak differential.
The gain of the PGA can be programmed using a three-bit control, available at pins GS0 to GS2. See table I. Note that the input resistance is a function of the gain setting.
Table I – PGA Gain Control
Input
GS2 GS1 GS0 PGA Gain Resistance V/V Gain
(dB) (kΩ)
0 0 0 0 5.57 1 0 0 1 2.9 4.65 1.41 0 1 0 5.8 3.97 2.0 0 1 1 11.8 2.23 3.98
TYPICAL INTERFACE CIRCUIT
ANALOG INPUT DRIVER
The differential analog inputs (VIN+, VIN–) have a resistive input impedance of 1 k minimum. For best performance, the input source should be a differential input, as shown in figure 2, typical interface circuit. The SPT8100 provides its own common-mode voltage on the pin marked VCM. Output drive capability of VCM is a maximum of 47 µA (50 k to ground).
The SPT8100 application note (AN8100) shows an ex­ample of two modes of driving the SPT8100. One mode is through a transformer and the other is through a single-to­differential converter. In all cases, both inputs VIN+ and VIN– must be kept within the input common-mode range (1.15 V to 3.65 V).
BIASC CONNECTION
An external capacitor, C for noise filtering of an internal voltage associated with the references. Its value is not critical: 1 µF in parallel with
0.01 µF are recommended.
BIASR CONNECTION
As shown in the typical interface circuit, R connect between BIASR to ground. This resistor ranges from 800 to 2.5 k. The proper selection of R function of the sample rate and input frequency. Nominally, at 5 MSPS, R large signal levels at an analog bandwidth of 2 MHz is criti­cal, the value should be decreased to R for even higher-frequency analog inputs, R be used. At lower sample rates (for example 2 MSPS), and lower analog input frequencies, the value may be increased to R figure 2b.)
=2 k. (Refer to the typical interface circuit table in
EXT
=1.43 k is recommended. If linearity for
EXT
on the BIASC pin, is used only
EXT
is needed to
EXT
=1.24 k; and
EXT
=1.0 k can
EXT
EXT
is a
1 0 0 14.8 1.66 5.62 1 0 1 17.5 1.25 7.94 1 1 0 19.5 1.00 10 1 1 1 X Forbidden
SPT
POWER SUPPLIES AND GROUNDING
The SPT8100 requires three power supplies: analog AVDD, digital DVDD and output supply ODVDD. This device works best if all three supplies are coming from the analog supply side of the system as shown in the typical interface circuit (figure 2a).
Note, in figure 2a, that the supplies to the logic interface circuit and the ODVDD are separate from each other. In a case where the +A3.3/5 V supply is not available, try to implement the design as close as possible to that shown in figure 2b. Place the ferrite bead (FB1) as close to the device as possible. To avoid latch-up, the delta between all three grounds must stay with 100 mV; this includes transients. (Refer to the absolute maximum ratings specifications.)
SPT8100
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Page 6
Figure 2a – Typical Interface Circuit
A
IN
Transformer
Mini-Circuit
T1-6T
0.1
+
4.7
R
T
(50)
+
10 0.1 1nF
Figure 2b – Typical Interface Circuit
1.43K
R
EXT
VIN+
V
C
Reset
RS
Gain Control
GS1
GS2
1.0
+
.01
BIAS
BIAS
R
V
CM
SPT8100
IN
V
RT
V
1.0
RB
AV
DD
+
AGND DGND OGND OV
DV
DD
0.1
10
+
+A5V +A3.3/5V
Gain Control
Reset
GS0
Output Enable
(active Hi)
OE
0.1
10
+
FB1
Output Enable
(active Hi)
Clock
Input
CLK
RDY
D0–15
OVR
DD
Clock
Input
16
Logic
Interfacing
Circuit
+D3.3/5V
.01
A
IN
ƒs (MSPS) R
Transformer
Mini-Circuit
T1-6T
EXT
0.1
(kΩ)ƒ
5 1.43 <2 MHz
+
4.7
R
T
(50)
+
10 0.1 1nF
IN
1.43K R
EXT
VIN+
V
IN
BIAS
RS
GS2
C
BIAS
R
V
CM
SPT8100
V
RT
V
RB
AV
DD
AGND DGND OGND OV
DV
DD
0.1
10
+
GS1
GS0
FB1
OE
0.1 10
CLK
RDY
D0–15
OVR
DD
+
FB2
FB3
16
Logic
Interfacing
Circuit
2 2.00 <2 MHz5 1.24 2 MHz
+A5V +D3.3/5V
2 1.00 2 MHz
800 Ω ≤ R
2.5 k
EXT
Notes:
1. To avoid device latch-up, closely follow either figure 2a or 2b, depending on what is available in the system. The difference between figure 2a and 2b is in the grounding.
2. FB = ferrite bead. FB1 must be placed as close to the device as possible.
= 1.43 k, optimized for ƒs = 5 MSPS. Refer to the above table for recommended value of R
3. R
EXT
is AIN source termination resistor.
4. R
T
with respect to ƒs and ƒIN.
EXT
5. Power supplies and references pins must have adequate decoupling. Surface-mount capacitors are highly recommended. The smallest value of capacitors are to be placed as close to the pin as possible.
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Page 7
Figure 3 – Timing Diagram 1
n
Analog In
CLK
t
D
n+1
n+2
n+3
n+4
n+5
n+6 n+7
n+8
D0–D15
OVR
INPUT/OUTPUT TIMING
The SPT8100 implements a simple interface: the 16 ADC outputs appear on the pins D15–D0 as a parallel word syn­chronous with the ADC sampling clock. D0 is the LSB and D15 is the MSB. The timing diagram for the ADC digital out­puts is shown in figure 3. The data is sampled at the rising edge of the clock. The ADC sampling clock is at the same frequency as CLK.
The output data is updated on the rising edge of CLK with a clock latency of 6 clock cycles.
OUTPUT LOGIC LEVEL
The voltage levels on the D15–D0 lines and OVR are CMOS levels: the HIGH level is determined by the power supply voltage on the ODVDD pin, which can be set independently of the other supply pins on the device over the range from
3.0 V to 5.25 V (3.3 V typical). The RDY pin level is deter-
mined by DVDD (+5 V).The external digital output buffers should be placed as close as possible to the SPT8100 digi­tal outputs to minimize any line reflections that would cause performance degradation.
ADC REFERENCES
The ADC full-scale range is set by reference voltages gen­erated on chip. These two reference voltages appear on pins VRT and VRB; nominally their difference is 2.5 V. The references are not designed to be overdriven. The VRT and VRB pins should be very carefully decoupled on the board using as short a trace as possible. Some optimization of the decoupling may be required, as shown in the typical inter­face circuit diagram. The smallest capacitor should be the closest one to the chip. (Refer to the typical interface circuit diagram.)
n
n+1
n+2
OUTPUT ENABLE
The ADC digital outputs are enabled by the active high out­put enable pin (OE).
OE = 1: ADC digital outputs are enabled OE = 0: ADC digital outputs are high-impedance
(tri-stated)
DIGITAL CODE RANGE AND OUT-OF-RANGE DETECTION
The output format of the ADC digital data is offset binary. Due to the calibration algorithm used, there is a slight loss in digital code range from the ADC. Instead of FFFFH and 0000H at the extremes of the range, the actual maximum and minimum codes are less than that by 1.6% at both ends of the scale, and vary from chip to chip. Effectively, this is a loss in dynamic range of a few tenths of a dB, and is negli­gible in many applications. The out-of-range function is de­fined accordingly , and sets the state of the active high digital output OVR, as follows:
OVR is HIGH if the ADC digital code is greater than
or equal to FC00H or less than or equal to 03FFH.
(See figure 4.)
If the output code exceeds FC00(max) or 03FF(min), this implies that output is clipping. Therefore, once these limits are crossed, the second harmonic becomes significant and degrades performance.
Figure 4 – ADC Digital Code Range and Overrange Bit
Function
FFFFH FC00H
ADC
Digital Code
Range
OVR = 1
OVR = Ø
65535 64512
1.6% FSR
SPT
03FFH
OVR = 1
0000H
1023 0
1.6% FSR
SPT8100
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Page 8
Figure 5 – Timing Diagram 2
Table II – Timing Parameters
CLK
Digital
Outputs
OE
t
D1
FFT Plot
Parameter Symbol Min Typ Max Units
CLK high to Data Valid t OE inactive to HiZ t OE active to Data Valid t
1
t
D2
t
D3
Conditions: load capacitance = 20 pF, VOH = 3.3 V
D1
D2
D3
18 24 40 10 16 30 ns 10 16 30 ns
1
ns
Typical Differential Non-Linearity (DNL)
Test Conditions:
ƒIN = 2 MHz ƒ
= 4.4 MHz
CLK
PGA Gain = 18 dB
Test Conditions:
ƒ1 = 890 kHz
= 900 kHz
ƒ
2
= 4.4 MHz
ƒ
CLK
PGA Gain = 6 dB
R
= 1.08 k
EXT
ADC Input (Post PGA) = –5.4 dBFS
= +25 °C
T
A
Two-Tone Intermodulation FFT
R
= 1.43 k
EXT
ADC Input (Post PGA) = –8.0 dBFS
= +25 °C
T
A
Test Conditions:
= 75 kHz
ƒ
IN
ƒ
= 4.4 MHz
CLK
100
0.9 MHz, low
95
0.9 MHz, med
0.9 MHz, high
90
85
80
75
70
SFDR (dBc)
65
60
55
50
45
–10
PGA Gain = 0 dB Near Full-Scale Input
Spurious Free Dynamic Range
2 MHz, high
2 MHz, med
2 MHz, low
3 MHz, high
3 MHz, med
3 MHz, low
–4
–3
–5
–6
–7
–8
–9
Composite Level at ADC Input (dBFS)
–2
–1
5 V
0
P-P
SPT
Test Conditions:
10 MSPS, 5 V, 25 °C Low: R
=1.43 k @96 mA
EXT
Med: R High: R
=1.24 k @109 mA
EXT
=1 k @129 mA
EXT
SPT8100
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Page 9
PACKAGE OUTLINE
44-Lead LQFP
A
B
SYMBOL MIN MAX MIN MAX
INCHES MILLIMETERS
A 0.465 0.480 11.80 12.20 B 0.390 0.398 9.90 10.10
Pin 1
Index
C 0.390 0.398 9.90 10.10 D 0.465 0.480 11.80 12.20 E 0.031 0.08 F 0.012 0.018 0.30 0.45
G 0.053 0.057 1.35 1.45
C
D
H 0.002 0.006 0.05 0.15
I 0.018 0.030 0.45 0.75
J 0.039 typ 1.0 typ
K 0–7° 0–7°
E F
G
H
I
K
J
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Page 10
PIN ASSIGNMENTS PIN FUNCTIONS
AGND
DGND
DV
DV
OGND
ODV
CLK
OE
D0 (LSB)
AV
DD
44
1 2
DD
3 4
DD
5 6
DD
7 8 9
D1
10
D2
11
12
D3
GS0
43
13
D4
V
V
IN
IN
+
42
41
14
15
D5
D6
GS1
40
16
D7
AGND
V
CM
RT
38
39
17
18
D8
D9
V
37
19
D10
RB
V
36
20
D11
BIASRBIAS
C
35
34
21
22
D12
D13
Pin Name Description
AGND Analog ground
RDY
33
N/C
32 31
N/C RS
30
AGND
29
28
AV
DD
GS2
27
N/C
26
OVR
25 24
D15 (MSB)
23
D14
DGND Digital ground DV
DD
Digital +5.0 V supply OGND Ground for digital I/O ODV
DD
Digital outputs supply (+3.3/5 V) CLK Master reference clock OE Output enable (active high) D0–D15 Data output bits; D0 is LSB; D15 is MSB OVR Overrange indicator bit (active high) N/C No connect GS[2:0] 3-bit PGA gain setting control inputs AV
DD
Analog +5.0 V supply RS Resets internal state of chip (active low) RDY Initialization in progress indicator; RDY goes
low during reset initialization. Chip is ready for
normal operation when RDY is high. BIAS BIAS VRT, V V
CM
C R
External bias capacitor connection
External bias resistor connection
ADC reference voltage outputs
RB
Common mode reference voltage output VIN+, VIN– Analog inputs to the PGA
ORDERING INFORMATION
PART NUMBER TEMPERATURE RANGE PACKAGE
SPT8100SIT –40 to +85 °C 44L LQFP
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING – LIFE SUPPORT APPLICATIONS POLICY – SPT products should not be used within Life Support Systems without the specific written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
SPT
SPT8100
10 5/12/00
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