Datasheet SPT7870SCU, SPT7870SIQ Datasheet (SPT)

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SPT7870
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10-BIT, 100 MSPS ECL A/D CONVERTER
FEATURES
• 10-Bit, 100 MSPS Analog-to-Digital Converter
• Monolithic Bipolar
• Single-Ended Bipolar Analog Input
• -1.0 V to +1.0 V Analog Input Range
• Internal Sample-and-Hold
• Internal Voltage Reference
• Programmable Data Output Formats
• Single Ended ECL/PECL Outputs
• TTL Version Available as the SPT7871
GENERAL DESCRIPTION
The SPT7870 is a 10-bit, 100 MSPS analog-to-digital con­verter, with a two stage sub-ranging flash/folder architecture. The bipolar, single-ended analog input provides an easy interface for most applications. Programmable data output formats provide additional ease of implementation and flex­ibility. The device supports high-speed ECL- and PECL-level outputs.
BLOCK DIAGRAM
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
IN
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
T/H
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
3-Bit
Flash
(MSB)
3-Bit DAC
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
V
*
T
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
V
*
M
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Internal
AAAAA
+1.0 V Reference
Reference
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
V
*
B
AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA AAAAAAAAAAAAAAAAAAAAAAAAAAAAAA
Internal
AAAAA
-1.0 V Reference
Ladder
*
Provided for reference decoupling purposes only.
4755 Forge Road, Colorado Springs, Colorado 80907, USA
Analog Input
V
Signal Processing Technologies, Inc.
Phone: (719) 528-2300 FAX: (719) 528-2370 E-Mail: www.spt.com
APPLICATIONS
• Professional Video
• HDTV
• Communications
• Imaging
• Digital Oscilloscopes
The resolution and performance of this device makes it well suited for professional video and HDTV applications. The on­chip track-and-hold provides for excellent AC performance enabling this device to be a converter of choice for RF communications and digital sampling oscilloscopes. The SPT7870 is available in a 44L cerquad package in the industrial temperature range and in die form.
V
EE
T/H
Σ
Error Correction Logic
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Timing and Control
AAAAAAAAAAAAA
V
8-Bit Folder
ADC
(LSB)
AGND DGND
CC
Output
Latch And
Buffers
D10 (Overrange) D9 (MSB) D8 D7 D6 D5 D4 D3 D2 D1 D0
MINV LINV CLK NCLK
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ABSOLUTE MAXIMUM RATING (Beyond which damage may occur)
1
Supply Voltages
V
...........................................................................
CC
V
.............................................................................
EE
0 to +6.5 V
0 to -6.5 V
Output
Digital Outputs ......................................... +30 to -30 mA
Temperature
Input Voltages
Analog Input............................................. VEE≤VIN≤V
LINV/MINV Inputs ......................... -0.5 V to VCC + 0.5 V
CLK/NCLK Inputs........................................... VEE to 0 V
CC
Operating Temperature .............................-40 to + 85 °C
Junction Temperature ........................................ + 175 °C
Lead, Soldering (10 seconds)............................ + 300 °C
Storage ....................................................-60 to + 150 °C
Note: 1. Operation at any Absolute Maximum Ratings is not implied. See Electrical Specifications for proper nominal applied
conditions in typical applications.
ELECTRICAL SPECIFICATIONS
TA=+25 °C, VCC=+5.0 V, VEE=-5.2 V, VIN=±1.0 V, f
TEST TEST
PARAMETERS CONDITIONS LEVEL MIN TYP MAX UNITS
DC Performance
Resolution 10 Bits Differential Linearity f Integral Linearity, Best Fit f
No Missing Codes f
Analog Input
Input Voltage Range V ±1.0 V Input Bias Current I -100 25 100 µA Input Resistance I 50 150 k
Input Capacitance V 5 pF Input Bandwidth Full Power IV 150 180 MHz ±FS Offset Error I ±20 ±100 mV
Timing Characteristics
Maximum Conversion Rate IV 100 MSPS Minimum Conversion Rate V 2 MSPS Pipeline Delay (Latency) IV 2 Clock Transient Response V 10 ns Overvoltage Recovery Time V 10 ns Output Delay (t Aperture Delay Time V 1 ns Aperture Jitter Time V 5 ps (rms)
Dynamic Performance
Effective Number of Bits
=10 MHz I 8.1 8.5 Bits
f
IN
= 25 MHz I 8.1 8.5 Bits
f
IN
fIN = 25 MHz f
= 50 MHz I 7.4 7.8 Bits
f
IN
fIN = 50 MHz f
Signal-To-Noise Ratio
=10 MHz I 52 55 dB
f
IN
= 25 MHz I 52 54 dB
f
IN
fIN = 25 MHz f
= 50 MHz I 52 54 dB
f
IN
fIN = 50 MHz f
Total Harmonic Distortion
fIN = 10 MHz I -56 -63 dBc
= 25 MHz I -55 -60 dBc
f
IN
fIN = 25 MHz f
= 50 MHz I -47 -51 dBc
f
IN
fIN = 50 MHz f
)V3ns
d
1
Clock Clock
Full Temperature V ±2.5 LSB
Clock
Full Temperature V 100 k
Clock
Clock
Clock
Clock
Clock
Clock
=80 MHz, 50% clock duty cycle, unless otherwise specified.
Clock
= 6.4 MHz I -1.0 ±0.5 +1.25 LSB = 6.4 MHz I ±1.0 ±2.0 LSB
= 6.4 MHz I Guaranteed
= 100 MHz V 8.0 Bits
= 100 MHz V 7.5 Bits
= 100 MHz V 51 dB
= 100 MHz V 50 dB
= 100 MHz V -56 dBc
= 100 MHz V -50 dBc
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ELECTRICAL SPECIFICATIONS
TA=+25 °C, VCC=+5.0 V, VEE=-5.2 V, VIN=±1.0 V, f
TEST TEST
PARAMETERS CONDITIONS LEVEL MIN TYP MAX UNITS
Dynamic Performance
Signal-to-Noise & Distortion (SINAD)
fIN = 10 MHz I 51 54 dB fIN = 25 MHz I 51 53 dB fIN = 25 MHz f fIN = 50 MHz I 46.5 48 dB fIN = 50 MHz f
Spurious Free Dynamic Range
fIN = 10 MHz V 65 dB FS fIN = 25 MHz V 62 dB FS fIN = 50 MHz V 52 dB FS
Two-Tone Intermodulation
Dist. Rejection Differential Phase V 0.5 Degree Differential Gain V 1 %
Power Supply Requirements
+VCC Supply Voltage IV 4.75 5.0 5.25 V
- VEE Supply Voltage IV -4.95 -5.2 -5.45 V +VCC Supply Current VI 127 151 mA
- VEE Supply Current VI 202 240 mA Power Dissipation VI 1.7 2.0 W Power Supply Rejection Ratio IV 30 dB
Digital Inputs
LINV, MINV V CMOS/TTL Logic
Clock Inputs
Logic 1 Voltage VI -1.1 V Logic 0 Voltage VI -1.5 V Maximum Input Current Low VI -100 +100 µA Maximum Input Current HIgh VI -100 +100 µA Pulse Width Low (t Pulse Width High (t Rise/Fall Time 20% to 80% IV 1.5 ns
Digital Outputs
Logic 1 Voltage (ECL) 50 to -2 V, DGND=0.0 V VI -1.1 -0.9 V Logic 0 Voltage (ECL) 50 to -2 V, DGND=0.0 V VI -1.7 -1.5 V Logic 1 Voltage (PECL) 50 Ω to +3 V, DGND=+5.0 V IV 3.9 4.1 V Logic 0 Voltage (PECL) 50 Ω to +3 V, DGND=+5.0 V IV 3.3 3.5 V t
rise
t
fall
1
2048 pt FFT using distortion harmonics 2 through 10.
2
Measured as a second order (f1-f2) intermodulation product from a two-tone test, with each input tone at 0 dBm.
2
) IV 4.0 250 ns
pwl
) IV 4.0 250 ns
pwh
Clock
Clock
10% to 90% V 2.0 ns 10% to 90% V 2.0 ns
=80 MHz, 50% clock duty cycle, unless otherwise specified.
Clock
= 100 MHz V 50 dB = 100 MHz V 47 dB
V -65 dBc
TEST LEVEL CODES
All electrical characteristics are subject to the following conditions:
All parameters having min/max specifications are guaranteed. The Test Level column indi­cates the specific device testing actually per­formed during production and Quality Assur­ance inspection. Any blank section in the data column indicates that the specification is not tested at the specified condition.
SPT
TEST LEVEL
I
II
III IV
V
VI
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TEST PROCEDURE
100% production tested at the specified temperature. 100% production tested at TA=25 °C, and sample
tested at the specified temperatures. QA sample tested only at the specified temperatures. Parameter is guaranteed (but not tested) by design
and characterization data. Parameter is a typical value for information purposes
only. 100% production tested at TA = 25 °C. Parameter is
guaranteed over specified temperature range.
SPT7870
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Figure 1 - Timing Diagram
t
pwl
N+1
N+2
d
t
DATA VALID
N-1
DATA VALID
N
CLK
OUTPUT DATA
N
t
clk
t
pwh
N-3 N-2
THEORY OF OPERATION
The SPT7870 uses a two stage subranging architecture incorporating a 3-bit flash MSB conversion stage followed by an 8-bit interpolating folder conversion stage. Digital error correction logic combines the results of both stages to produce a 10-bit data conversion digital output.
The analog signal is input directly to the 3-bit flash converter which performs a 3-bit conversion and in turn drives an internal DAC used to set the second stage voltage reference level. The 3-bit result from the flash conversion is input to the digital error correction logic and used in calculation of the upper most significant bits of the data output.
Table I - Data Output Timing Parameters
Timing Parameter Min Typ Max
f
clock
Clock Pulse Width High (t Clock Pulse Width Low (t
2 MHz 100 MHz
) 4.0 ns 250 ns
pwh
) 4.0 ns 250 ns
pwl
Switching Delay (td) 3 ns Clock Latency 2 clock cycles
should both be connected to the analog ground plane. All other
-5.2 V requirements of the external digital logic circuit should be connected to the digital ground plane. Each power supply pin should be bypassed as closely as possible to the device with .01 µF and 2.2 µF capacitors as shown in figure 2.
The two grounds available on the SPT7870 are AGND and DGND. DGND is used only for ECL outputs and is to be referenced to the output pulldown voltage. These grounds are not tied together internal to the device. The use of ground planes is recommended to achieve the best performance of the SPT7870. The AGND and the DGND ground planes should be separated from each other and only connected together at the device through an inductance or ferrite bead. Doing this will minimize the ground noise pickup.
The analog input is also input directly to an internal track-and­hold amplifier. The signal is held and amplified for use in the second stage conversion. The output of this track-and-hold is input into a summing junction that takes the difference between the track-and-hold amplifier and the 3-bit DAC output. The residual is captured by a second track-and-hold which holds and amplifies this residual voltage.
The residual held by the track-and-hold amplifier is input to an 8-bit interpolating folder stage for data conversion. The 8-bit converted data from the folder stage is input into the digital error correction logic and used in calculation of the lower significant bits.
The error correction logic incorporates a proprietary scheme for compensation of any internal offset and gain errors that might exist to determine the 10-bit conversion result. The resultant 10 bit data conversion is internally latched and presented on the data output pins via buffered output drivers.
TYPICAL INTERFACE CIRCUIT
The SPT7870 requires few external components to achieve the stated operation and performance. Figure 2 shows the typical interface requirements when using the SPT7870 in normal circuit operation. The following section provides a description of the pin functions and outlines critical performance criteria to consider for achieving the optimal device performance.
POWER SUPPLIES AND GROUNDING
The SPT7870 requires the use of two supply voltages, VEE and VCC. Both supplies should be treated as analog supply sources. This means the VEE and VCC ground returns of the device
ANALOG INPUT
The SPT7870 has a single-ended analog input with a bipolar input range from -1 V to +1 V. The bipolar input allows for easier interface by external op amps when compared to unipolar input devices. Because the input common mode is 0 V, the external op amp can operate without a voltage offset on the output, thereby maximizing op amp head room and minimizing distortion.
In addition, the 0 V common mode allows for a very simple DC coupled analog input connection if desired. The current drive requirements for the analog input are minimal when com­pared to conventional flash converters due to the SPT7870’s low input capacitance of only 5 pF and very high input impedance of 150 k.
CLOCK INPUTS
The clock inputs are designed to be driven differentially with ECL levels. For optimal noise performance, the clock input rise time should be a maximum of 1.5 ns. Because of this, the use of
fast
logic is recommended. The analog input signal is
latched on the rising edge of the CLK. The clock may be driven single-ended since the NCLK pin is
internally biased to -1.3 V. NCLK may be left open but a .01 µF bypass capacitor from NCLK to AGND is recommended. NOTE: System performance may be degraded due to in­creased clock noise or jitter.
The performance of the SPT7870 is specified and tested with a 50% clock duty cycle. However, at sample rates greater
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than 80 MSPS, additional gains in dynamic performance of the device may be obtained by adjusting the clock duty cycle. Typically, operation between 55 to 60% duty cycle will yield improved results.
INTERNAL VOLTAGE REFERENCE
DIGITAL OUTPUT DATA TIMING
The data is presented on the output pins two clock cycles after the input is sampled with an additional output delay of typically 3 ns. The data is held valid for one clock cycle. Refer to the timing diagram shown in figure 1.
The SPT7870 incorporates an on-chip voltage reference. The top and bottom reference voltages are each internally tied to their respective top and bottom of the internal refer­ence ladder. The pins for the voltage references and the ladder (including the center of the ladder) are brought out to pins on the device for decoupling purposes only (pins VT, V and VB). A .01 µF capacitor should be used on each pin and tied to AGND. See the typical interface circuit (figure 2).
The internal voltage reference and the internal error correc­tion logic eliminate the need for driving externally the voltage reference ladder. In fact,
not be driven
internal error correction circuitry already compensates for the internal voltage and no improvement will result.
with an external voltage reference source as the
the voltage reference ladder should
M,
DIGITAL OUTPUTS
DIGITAL OUTPUT DATA FORMAT - D0 - D9
Table II - Output Coding Data Format
V
IN
>+1.0 V 1 11 1111 1111 01 1111 1111 (+FS) 0 11 1111 1111 01 1111 1111
+1.0 V -1 LSB 0 11 1111 1110 01 1111 1110
0.0 V 0 10 0000 0000 00 0000 0000
-1.0 V +1 LSB 0 00 0000 0001 10 0000 0001 (-FS) 0 00 0000 0000 10 0000 0000 <-1.0 V 0 00 0000 0000 10 0000 0000
*Refer to table III for possible output formats.
OVERRANGE BIT - D10
D10 D9…D0 (Binary*) D9…D0 (2's Comp*)
0 01 1111 1111 11 1111 1111
DIGITAL OUTPUT CONTROL PINS - MINV, LINV
Two digital output control pins control the digital output format. See table III. The MINV pin is a CMOS/TTL-compatible input. It inverts the most-significant bit (D9) when tied to +5 V. The MSB (D9) is noninverted when MINV is tied to ground or floated. The MINV pin is internally pulled down to ground.
The LINV pin is a CMOS/TTL-compatible input. It inverts the least-significant bits (D8 through D0) when tied to +5 V. The least-significant bits (D8 through D0) are noninverted when LINV is tied to ground or floated. The LINV pin is internally pulled down to ground.
Table III - Data Output Bits
MINV LINV Description of Data
0 V 0 V Binary (Noninverted)
0 V +5 V Two's Complement (Inverted) +5 V 0 V Two's Complement (Noninverted) +5 V +5 V Binary (Inverted)
ECL AND PECL DIGITAL OUTPUT LEVELS
THERMAL MANAGEMENT
SPT recommends that a heat sink be used for this device to ensure rated performance. A heat sink in still air provides adequate thermal performance under laboratory tests. Air flow may be required for operation at elevated ambient temperature. SPT recommends that the junction tempera­ture be maintained under +150 °C.
The thermal impedance values for the cerquad package are
θJC = 3.3 °C/W and θ
air with no heat sink).
70 °C/W (junction to ambient in still
JA =
All other output signals will also stay at their maximum encoded output throughout this condition. D10 is not as­serted for an underscale condition when the input exceeds the negative full scale.
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TYPICAL PERFORMANCE CHARACTERISTICS
0
Dynamic Performance vs. Input Frequency
70
65
60
55
dB
50
45
40
0 20406080100
Dynamic Performance vs. Input Frequency
Sample Rate=100 MSPS, 50% Clock Duty Cycle
60
55
THD
50
dB
45
Sample Rate = 80 MSPS
THD
SNR
SINAD
Input Frequency (MHz)
SNR
SINAD
Single Tone at 14.9 MHz
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
Power Relative to ADC Full Scale (dB)
0
Dynamic Performance vs. Input Frequency
Sample Rate=100 MSPS, 60% Clock Duty Cycle
60
55
50
dB
45
Sample Rate = 80 MSPS
10 20 30 40
Frequency (MHz)
THD
SINAD
SNR
40
35
0 20 40 60 80 100
Input Frequency (MHz)
Dynamic Performance vs. Sample Rate
65
60
55
dB
50
45
40
60 70 80 90 100 110
Input Frequency = 25MHz
THD
SNR
SINAD
Sample Rate (MSPS)
40
35
0 20 40 60 80 100
Input Frequency (MHz)
Dynamic Performance vs. Temperature
65
60
dB
55
50
-25 0 25 50 75 10
Sample Rate = 80 MSPS
Input Frequency = 25 MHz
THD
SNR
SINAD
Temperature (°C)
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Figure 2 - Typical Interface Circuit Figure 3 - SPT7870 Clock Input Equivalent
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX
A 0.550 typ 13.97 typ B 0.685 0.709 17.40 18.00 C 0.037 0.041 0.94 1.04 D 0.016 typ 0.41 typ E 0.008 typ 0.20 typ F 0.027 0.051 0.69 1.30 G 0.006 typ 0.15 typ H 0.080 0.150 2.03 3.81
*
*
AGND
SPT7870
MINV
LINV
-A5.2
V
EE
DGND
D10
D9
D8 D7 D6 D5 D4 D3 D2 D1 D0
Interfacing Logic
Circuit
AV
CC
AGND
(ESD)
26 k
CLK
(ESD)
V
EE
26 k
6 k
-1.3 V
52 k
Figure 4 - SPT7870 Digital Outputs
Equivalent Circuit
AGND DGND
(ESD)
(ESD)
Analog Input
ECL Differential Clock Input
.01
.01
.01
V
V
V
V
V
CLK CLK
+A5
CC
IN
T
M
B
NCLK
+A5 -A5.2
10 µF +
+5 V -5.2 VAGND
10 µF
+
Notes:
1) = Line termination.
2) *= 0.01 µF chip capacitor in parallel with 2.2 µF Tantalum capacitor.
3) Immediate output buffer is highly recommended to optimize the performance due to reflection.
44
C
1
FB1
+A5
50
-D2 -D5.2 10 µF
+
-2 V -5.2 VDGND
-D2 V
10 µF
+
-D5.2
PACKAGE OUTLINE
44L Cerquad
(ESD)
ECL/PECL
OUT
(ESD)
V
EE
D
A B
SPT
A B
0 - 5°
H
E
G
F
SPT7870
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PIN ASSIGNMENTS
PIN FUNCTIONS
D1Ø
EE
EE
DGND
DGND
43
44
1 2
D1 D2
3
D3
4 5
D4 D5
6
D6
7 8
D7 D8
9
D9
10 11
V
LINV
N/C
N/C
40
41
42
39
44L Cerquad
V
37
38
AGND
AGND
36
CC
CC
V
V
34
35
V
33
B
N/C
32
N/C
31
V
30
M
29
N/C
V
28
IN
N/C
27 26
N/C V
25
T
V
24
CC
V
23
CC
NAME I/O DESCRIPTION V
IN
D0-D D
10
I Analog Input
O Digital Output Data (D0 = LSB)
9
O Overflow CLK I Clock (Internal Pull-Down to Ground) NCLK I Inverted Clock
(Internal Pull-Down to -1.3 V)
LINV I Invert Least Significant Bits (D0-D8);
CMOS/TTL Level; Invert=+5 V; Internal Pull-Down to Ground
MINV I Invert MSB (D9);
13
16
19
12
DGND
14
DGND
MINV
15
N/C
CLK
17
NCLK
18
N/C
22
21
20
EE
EE
V
V
AGND
AGND
V
T
N/A Internal Top Reference Decoupling
CMOS/TTL Level; Invert=+5 V; Internal Pull-Down to Ground
(+1 V typical)
V
M
N/A Internal Mid-Point Reference Decoupling
(0 V typical)
V
B
N/A Internal Bottom Reference Decoupling
(-1 V typical)
V
CC
V
EE
I +5 V Analog Supply
I -5.2 V Supply N/C - Not Connected AGND I Analog Ground DGND I Digital Ground
ORDERING INFORMATION
PART NUMBER TEMPERATURE RANGE PACKAGE
SPT7870SIQ -40 to +85 °C 44L Cerquad SPT7870SCU +25 °C Die*
*Please see the die specification for guaranteed electrical performance.
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
SPT7870
SPT
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