Datasheet SPT7814ACN, SPT7814AIJ, SPT7814BCN, SPT7814BCU, SPT7814BIJ Datasheet (SPT)

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SPT7814
10-BIT, 40 MSPS, ECL OUTPUT A/D CONVERTER
FEATURES
Monolithic 40 MSPS Converter
• On-Chip Track/Hold
• Bipolar ±2.0 V Analog Input
• 57 dB SNR @ 3.58 MHz Input
• 50 dB SNR @ 10.3 MHz Input
• Low Power (1.3 W Typical)
5 pF Input Capacitance
• ECL Outputs
GENERAL DESCRIPTION
The SPT7814 A/D converter is a 10-bit monolithic converter capable of word rates of a minimum of 40 MSPS. On board track/hold function assures excellent dynamic performance without the need for external components. Drive require­ment problems are minimized with an input capacitance of only 5 pF.
Inputs and outputs are ECL to provide a higher level of noise immunity in high speed system applications. An overrange output signal is provided to indicate overflow conditions.
APPLICATIONS
• Medical Imaging
• Professional Video
• Radar Receivers
• Instrumentation
• Electronic Warfare
• Digital Communications
Output data format is straight binary. Power dissipation is very low at only 1.3 watts with power supply voltages of +5.0 and -5.2 volts. The SPT7814 also provides a wide input voltage swing of ±2.0 volts.
The SPT7814 is available in a 28-lead ceramic sidebrazed DIP, PDIP, and die form. Commercial and industrial tempera­ture ranges are currently offered. Contact the factory for availability of military temperature ranges and /833 pro­cessed units.
BLOCK DIAGRAM
Analog
Input
Coarse
A/D
Analog
Prescaler
T/H Amplifier
Bank
Successive Interpolation
Stage i
Successive Interpolation
Stage i+1
Successive Interpolation
Stage N
4
Output
10
Decoding Network
Signal Processing Technologies, Inc.
4755 Forge Road, Colorado Springs, Colorado 80907, USA
Phone: (719) 528-2300 FAX: (719) 528-2370
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ABSOLUTE MAXIMUM RATINGS (Beyond which damage may occur)1 25 °C
Supply Voltages
VCC............................................................... -0.3 to +6 V
Output
Digital Outputs .......................................... +30 to -30 mA
VEE............................................................... +0.3 to -6 V
Temperature
Input Voltages
Analog Input............................................... VFB≤VIN≤V
VFT, V
..............................................................
FB
+3.0 V, -3.0 V
Reference Ladder Current .....................................12 mA
FT
Operating Temperature ..............................-25 to +85 °C
(1)
Junction Temperature
...........................................
+175 °C
Lead Temperature, (soldering 10 seconds)........ +300 °C
Storage Temperature................................ -65 to +150 °C
Note: 1. Operation at any Absolute Maximum Rating is not implied. See Electrical Specifications for proper nominal
applied conditions in typical applications.
ELECTRICAL SPECIFICATIONS
TA=T
PARAMETERS CONDITIONS LEVEL MIN TYP MAX MIN TYP MAX UNITS
Resolution 10 10 Bits DC Accuracy (+25 °C) ± Full Scale
- T
min
Integral Nonlinearity 250 kHz Sample Rate V ±1.0 ±1.5 LSB Differential Nonlinearity V ±0.5 ±0.75 LSB No Missing Codes VI Guaranteed Guaranteed
, VCC=+5.0 V, VEE=-5.2 V, VIN=±2.0 V, VSB=-2.0 V, VST=+2.0 V, f
max
TEST TEST SPT7814A SPT7814B
=40 MHz, 50% clock duty cycle, unless otherwise specified.
clock
Analog Input
Input Voltage Range VI ±2.0 ±2.0 Input Bias Current V Input Resistance VI 100 300 100 300 k Input Capacitance V 5 5 pF Input Bandwidth 3 dB Small Signal V 120 120 MHz +FS Error V ±2.0 ±2.0 LSB
-FS Error V ±2.0 ±2.0 LSB
Reference Input
Reference Ladder Resistance VI 500 800 500 800 Reference Ladder Tempco V 0.8 0.8 /°C
Timing Characteristics
Maximum Conversion Rate VI 40 40 MHz Overvoltage Recovery Time V 20 20 ns Pipeline Delay (Latency) IV 1 1 Output Delay TA=+25 °CV5 5ns Aperture Delay Time T Aperture Jitter Time TA=+25 °C V 5 5 ps-RMS
Dynamic Performance
Effective Number of Bits f
=1 MHz 8.7 8.2 Bits
IN
=3.58 MHz 8.7 8.2 Bits
f
IN
fIN=10.3 MHz 7.3 6.9 Bits
=0 V VI 3060 3060µA
IN
Clock Cycle
=+25 °CV1 1ns
A
Typical thermal impedances: 28L sidebrazed DIP: θja = 50 °C/W,
28L plastic DIP: θ
= 50 °C/W.
ja
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ELECTRICAL SPECIFICATIONS
TA=T
PARAMETERS CONDITIONS LEVEL MIN TYP MAX MIN TYP MAX UNITS
Dynamic Performance
- T
min
, VCC=+5.0 V, VEE=-5.2 V, VIN=±2.0 V, VSB=-2.0 V, VST=+2.0 V, f
max
=40 MHz, 50% clock duty cycle, unless otherwise specified.
clock
TEST TEST SPT7814A SPT7814B
Signal-To-Noise Ratio (without Harmonics)
f
=1 MHz +25 °C I 55 57 52 54 dB
IN
=3.58 MHz +25 °C I 55 57 52 54 dB
f
IN
=10.3 MHz +25 °C I 48 50 46 48 dB
f
IN
TA=T
TA=T
TA=T
min
min
min
- T
- T
- T
max
max
max
IV 53 55 50 52 dB IV 53 55 50 52 dB IV 45 47 43 45 dB
Harmonic Distortion
=1 MHz +25 °C I 54 56 52 54 dB
f
IN
=3.58 MHz +25 °C I 54 56 52 54 dB
f
IN
f
=10.3 MHz +25 °C I 46 48 43 45 dB
IN
TA=T
TA=T
TA=T
min
min
min
- T
- T
- T
max
max
max
IV 51 53 49 51 dB IV 51 53 49 51 dB IV 45 47 41 43 dB
Signal-to-Noise and Distortion
=1 MHz +25 °C I 52 54 49 51 dB
f
IN
f
=3.58 MHz +25 °C I 52 54 49 51 dB
IN
f
=10.3 MHz +25 °C I 44 46 41 43 dB
IN
Spurious Free Dynamic Range +25 °C, Differential Phase +25 °C, f
TA=T
TA=T
TA=T
- T
min
max
- T
min
max
- T
min
max
fIN=1 MHz V 67 67 dB
=3.58 & 4.35 MHz V 0.2 0.2 Degree
IN
IV 49 46 dB IV 49 46 dB IV 43 40 dB
Differential Gain +25 °C, fIN=3.58 & 4.35 MHz V 0.5 0.7 %
Digital Inputs
Logic 1 Voltage VI -1.1 -1.1 V Logic 0 Voltage VI -1.5 -1.5 V Maximum Input Current Low VI -500 ±200 +750 -500 ±200 +750 µA Maximum Input Current High VI -500 ±300 +750 -500 +300 +750 µA Pulse Width Low (CLK) IV 10 10 ns Pulse Width High (CLK) IV 10 300 10 300 ns
Digital Outputs
Logic 1 Voltage 50 to -2 V VI -1.1 -0.8 -1.1 -0.8 V Logic 0 Voltage 50 to -2 V VI -1.8 -1.5 -1.8 -1.5 V
Power Supply Requirements
VoltagesV CurrentsI
-V
-I
CC
EE
CC
EE
IV +4.75 -5.0 +5.25 +4.75 +5.0 +5.25 V IV -4.95 -5.2 -5.45 -4.95 -5.2 -5.45 V VI 140 170 140 190 mA
VI 115 140 115 160 mA Power Dissipation Outputs Open VI 1.3 1.6 1.3 1.8 W Power Supply Rejection Ratio (5 V ±0.25 V, -5.2 V ±2.0 V) V 1.0 1.0 LSB
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TEST LEVEL CODES
TEST LEVEL
TEST PROCEDURE
All electrical characteristics are subject to the following conditions:
All parameters having min/max specifications are guaranteed. The Test Level column indi­cates the specific device testing actually per­formed during production and Quality Assur­ance inspection. Any blank section in the data column indicates that the specification is not tested at the specified condition.
Figure 1A: Timing Diagram
N
t
pwH
CLK
t
pwL
II
III IV
V
VI
I
100% production tested at the specified temperature. 100% production tested at TA=25 °C, and sample
tested at the specified temperatures. QA sample tested only at the specified temperatures. Parameter is guaranteed (but not tested) by design
and characterization data. Parameter is a typical value for information purposes
only. 100% production tested at TA = 25 °C. Parameter is
guaranteed over specified temperature range.
N+1
N+2
CLK
Output
Data
t
d
Data Valid
N
Data Valid
N+1
Figure 1B: Single Event Clock
CLK
CLK
t
d
Output
Data
Data Valid
Table I - Timing Parameters
PARAMETERS DESCRIPTION MIN TYP MAX UNITS
t
d
t
pwH
CLK to Data Valid Prop Delay - 5 ns CLK High Pulse Width 10 - 300 ns
t
pwL
SPT
CLK Low Pulse Width 10 - - ns
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SPECIFICATION DEFINITIONS
APERTURE DELAY
Aperture delay represents the point in time, relative to the rising edge of the CLOCK input, that the analog input is sampled.
APERTURE JITTER
The variations in aperture delay for successive samples.
DIFFERENTIAL GAIN (DG)
A signal consisting of a sine wave superimposed on various DC levels is applied to the input. Differential gain is the maximum variation in the sampled sine wave amplitudes at these DC levels.
DIFFERENTIAL PHASE (DP)
A signal consisting of a sine wave superimposed on various DC levels that is applied to the input. Differential phase is the variation in the sampled sine wave phases at these DC levels.
EFFECTIVE NUMBER OF BITS (ENOB)
SINAD = 6.02N + 1.76, where N is equal to the effective number of bits.
DIFFERENTIAL NONLINEARITY (DNL)
Error in the width of each code from its theoretical value. (Theoretical = VFS/2N)
INTEGRAL NONLINEARITY (INL)
Linearity error refers to the deviation of each individual code (normalized) from a straight line drawn from -Fs through +Fs. The deviation is measured from the edge of each particular code to the true straight line.
OUTPUT DELAY
Time between the clock's triggering edge and output data valid.
OVERVOLTAGE RECOVERY TIME
The time required for the ADC to recover to full accuracy after an analog input signal 125% of full scale is reduced to 50% of the full-scale value.
SIGNAL-TO-NOISE RATIO (SNR)
The ratio of the fundamental sinusoid power to the total noise power. Harmonics are excluded.
SINAD - 1.76
N =
6.02
± FULL-SCALE ERROR (GAIN ERROR)
Difference between measured full scale response [(+Fs) - (-Fs)] and the theoretical response (+4 V -2 LSBs) where the +FS (full scale) input voltage is defined as the output transition between 1-10 and 1-11 and the -FS input voltage is defined as the output transition between 0-00 and 0-01.
INPUT BANDWIDTH
Small signal (50 mV) bandwidth (3 dB) of analog input stage.
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
The ratio of the fundamental sinusoid power to the total noise and distortion power.
TOTAL HARMONIC DISTORTION (THD)
The ratio of the total power of the first 64 harmonics to the power of the measured sinusoidal signal.
SPURIOUS FREE DYNAMIC RANGE (SFDR)
The ratio of the fundamental sinusoidal amplitude to the single largest harmonic or spurious signal.
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TYPICAL PERFORMANCE CHARACTERISTICS
80
70
60
50
40
Total Harmonic Distortion (dB)
30
20
0
10
80
70
60
THD vs Input Frequency
1
10
Input Frequency (MHz)
SINAD vs Input Frequency
fs =40 MSPS
fs = 40 MSPS
SNR vs Input Frequency
80
70
fs = 40 MSPS
60
50
40
Signal-to-Noise Ratio (dB)
30
2
10
20
0
10
Input Frequency (MHz)
1
10
2
10
SNR, THD, SINAD vs Sample Rate
80
70
SNR
60
50
40
30
Signal-to-Noise and Distortion (dB)
20
0
10
Spectral Response
0
-30
-60
Amplitude (dB)
-90
1
10
Input Frequency
(MHz)
fs = 40 MSPS fin = 1 MHz
50
SINAD
THD
f
40
in = 1 MHz
SNR, THD, SINAD (dB)
30
2
10
20
0
10
Sample Rate (MSPS)
1
10
2
10
SNR, THD, SINAD vs Temperature
65
60
55
SINAD
50
SNR, THD, SINAD (dB)
45
fs = 40 MSPS fin = 1 M H z
SNR
THD
-120 0 123456 78910
Input Frequency (MHz)
SPT
40
-25 0 +25 +50 +75
Temperature (°C)
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TYPICAL INTERFACE CIRCUIT
The SPT7814 requires few external components to achieve the stated operation and performance. Figure 2 shows the typical interface requirements when using the SPT7814 in normal circuit operation.
are not tied together internal to the device. The use of ground planes is recommended to achieve the best performance of the SPT7814. The AGND and the DGND ground planes should be separated from each other and only connected together at the device through an inductance. Doing this will minimize the ground noise pickup.
The following section provides a description of the pin func­tions and outlines critical performance criteria to consider for achieving the optimal device performance.
POWER SUPPLIES AND GROUNDING
The SPT7814 requires the use of two supply voltages, V
EE
and VCC. Both supplies should be treated as analog supply sources. This means the VEE and VCC ground returns of the device should both be connected to the analog ground plane. All other -5.2 V requirements of the external digital logic circuit should be connected to the digital ground plane. Each power supply pin should be bypassed as closely as possible to the device with .01 µF and 10 µF capacitors as shown in figure 2.
The two grounds available on the SPT7814 are AGND and DGND. DGND is used only for ECL outputs and is to be referenced to the output pulldown voltage. These grounds
Figure 2 - Typical Interface Circuit
10 µF
+
+5 V
CLK-IN
CLK-IN Analog
Input
Analog
Input
IC1
(REF-03)
2
VIN
GND
.01 µF
*R2 and R3 matched to 0.1%
VOUT
Tri m
4
+5 V
R4
10 k
+
6
5
7
10 µF
-
(OP-07)
6
2
R2
30 k
4
+2.5 V
*
-5.2 V
.01 µF
10 µF
R1
10 k
3
+
IC2
1
8
R3
30 k
-2.5 V
CLK
CLK
VIN1
VIN2
.01 µF
VFT
VST
.01 µF
VRM
.01 µF
*
VSB
.01 µF
VFB
.01 µF
+
VEE
2
R
2R
2R
2R
2R
R
VCC
VEE
VOLTAGE REFERENCE
The SPT7814 requires the use of two voltage references: V and VFB. VFT is the force for the top of the voltage reference ladder (+2.5 V typ), VFB (-2.5 V typ) is the force for the bottom of the voltage reference ladder. Both voltages are applied across an internal reference ladder resistance of 800 ohms. In addition, there are 3 reference ladder taps (VST,VRM and VSB). VST is the sense for the top of the reference ladder (+2.0 V), VRM is the midpoint of the ladder (0.0 V typ) and V is the sense for the bottom of the reference ladder (-2.0 V). The voltages seen at VST and VSB are the true full scale input voltages of the device when VFT and VFB are driven to the recommended voltages (+2.5 V and -2.5 V typical respec­tively). These points should be used to monitor the actual full scale input voltage of the device and should not be driven to the expected ideal values as is commonly done with standard flash converters. When not being used, a decoupling capaci­tor of .01 uF connected to AGND from each tap is recom­mended to minimize high frequency noise injection.
Coarse
A/D
ANALOG
PRESCALER
T/H AMPLIFIER
BANK
SUCCESSIVE
INTERPOLATION
STAGE # i
SUCCESSIVE
INTERPOLATION
STAGE # N
VCC
4
Decoding Network
DG
AG
AG
D10 (OVERRANGE)
D9 (MSB)
D8
D7
D6
D5
D4
D3
D2
D1
D0 (LSB)
DG
Digital Outputs
11 x 50
FT
SB
SPT
10 µF
+
.01 µF
-5.2 V +5 V
D1
NOTE: D1=D2=1N5817 or equivalent. (Used to prevent damage caused by power sequencing.)
D2
+
10 µF
.01 µF
AGND
( 5 V RTN &
-5.2 V RTN )
10 µH
L
DGND
( -2 V RTN )
10 µF
+
.01 µF
-2 V-5.2 V +5 V
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SPT7814
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30 35 40 45 50 55 60 65 70 75
Duty Cycle
Duty Cycle of Positive Clock Pulse (%)
Signal-to-Noise Ratio (dB)
43
45
47
49
51
53
55
57
59
tpwLtpwH
=
t
pwH
t
pwL
SNR vs Clock Duty Cycle
An example of a reference driver circuit recommended is shown in figure 2. IC1 is REF-03, the +2.5 V reference with a tolerance of 0.6% or ± 0.015 V. The potentiometer R1 is 10 k and supports a minimum adjustable range of up to 150 mV. IC2 is recommended to be an OP-07 or equivalent device. R2 and R3 must be matched to within 0.1% with good TC tracking to maintain a 0.3 LSB matching between VFT and VFB. If 0.1% matching is not met, then potentiometer R4 can be used to adjust the VFB voltage to the desired level. R1 and R4 should be adjusted such that VST and VSB are exactly +2.0 V and -2.0 V respectively.
The analog input range will scale proportionally with respect to the reference voltage if a different input range is required. The maximum scaling factor for device operation is ± 20% of the recommended reference voltages of VFT and VFB. How­ever, because the device is laser trimmed to optimize perfor­mance with ± 2.5 V references, the accuracy of the device will degrade if operated beyond a ± 2% range.
The following errors are defined: +FS error = top of ladder offset voltage = (+FS -VST+1 LSB)
-FS error=bottom of ladder offset voltage=(-FS -V
SB
-1 LSB)
where the +FS (full scale) input voltage is defined as the output transition between 1-10 and 1-11 and the -FS input voltage is defined as the output transition between 0-00 and 0-01.
ANALOG INPUT
V
IN1
and V
are the analog inputs. Both inputs are tied to
IN2
the same point internally. Either one may be used as an analog input sense and the other for an input force. The inputs can also be tied together and driven from the same source. The full scale input range will be 80% of the reference voltage or ±2 volts with VFB=-2.5 V and VFT=+2.5 V.
The drive requirements for the analog inputs are minimal when compared to conventional Flash converters due the SPT7814’s extremely low input capacitance of only 5 pF and very high input resistance of 300 k. For example, for an input signal of ± 2 V p-p with an input frequency of 10 MHz, the peak output current required for the driving circuit is only 628 µA.
The CLK pulse width (tpwH) must be kept between 10 ns and 300 ns to ensure proper operation of the internal track-and­hold amplifier. (See timing diagram.) When operating the SPT7814 at sampling rates above 3 MSPS, it is recom­mended that the clock input duty cycle be kept at 50% to optimize performance. (See graph.) The analog input signal is latched on the rising edge of the CLK.
DIGITAL OUTPUTS
The format of the output data (D0-D9) is straight binary. These outputs are ECL with the output circuit shown in figure 4. The outputs are latched on the rising edge of CLK with a propagation delay of 4 ns. There is a one clock cycle latency between CLK and the valid output data (see timing diagram). These digital outputs can drive 50 ohms to ECL levels when pulled down to -2 V. The total specified power dissipation of the device does not include the power used by these loads. The additional power used by these loads can vary between 10 and 300 mW typically (including the overrange load) depending on the output codes. If lower power levels are desired, the output loads can be reduced, but careful consideration to the capacitive loads in relation to the oper­ating frequency must be considered.
CLOCK INPUT
The clock inputs (CLK,
) are designed to be driven differ-
CLK
entially with ECL levels. The clock may be driven single ended since left open, but a .01 µF bypass capacitor to AGND is recom-
is internally biased to -1.3 V.
CLK
mended. As with all high speed circuits, proper terminations are required to avoid signal reflections and possible ringing that can cause the device to trigger at an unwanted time.
SPT
CLK
Table II - Output Data Information
ANALOG INPUT OVERRANGE OUTPUT CODE
D1O D9-DO
>+2.0 V + 1/2 LSB 1 11 1111 1111
may be
+2.0 V -1 LSB O 11 1111 111Ø
0.0 V O Ø Ø ØØØØ ØØØØ
-2.0 V +1 LSB O OO OOOO OOOØ <-2.0 V O OO OOOO OOOO
(Ø indicates the flickering bit between logic 0 and 1).
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Figure 3 - Output Circuit
EVALUATION BOARD
AGND
OVERRANGE OUTPUT
The OVERRANGE OUTPUT (D10) is an indication that the analog input signal has exceeded the positive full scale input voltage by 1 LSB. When this condition occurs, D10 will switch to logic 1. All other data outputs (D0 to D9) will remain at logic 1 as long as D10 remains at logic 1. This feature makes it possible to include the SPT7814 into higher resolution systems.
DGND
Data Out
The EB7814 evaluation board is available to aid designers in demonstrating the full performance of the SPT7814. This board includes a reference circuit, clock driver circuit, output data latches and an on-board reconstruction of the digital data. An application note describing the operation of this board as well as information on the testing of the SPT7814 is also available. Contact the factory for price and availability.
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PACKAGE OUTLINES
28-Lead Sidebrazed
28
H
SYMBOL MIN MAX MIN MAX
I
1
J
G
A
INCHES MILLIMETERS
A 0.077 0.093 1.96 2.36
B 0.016 0.020 0.41 0.51 C 0.095 0.105 2.41 2.67 D .050 typ 0.00 1.27 E 0.040 0.060 1.02 1.52 F 0.215 0.235 5.46 5.97 G 1.388 1.412 35.26 35.86 H 0.585 0.605 14.86 15.37
I 0.009 0.012 0.23 0.30
J 0.600 0.620 15.24 15.75
E
F
C
B
D
28-Lead Plastic DIP
28
1
A
B
SPT
K
SYMBOL MIN MAX MIN MAX
I
J
F
C
D
E
H
G
INCHES MILLIMETERS
A 0.200 5.08
B 0.120 0.135 3.05 3.43
C 0.020 0.51
D 0.100 2.54
E 0.067 1.70
F 0.013 0.33
G 0.170 0.180 4.32 4.57
H 0.622 15.80
I 0.555 14.10 J 1.460 37.08 K 0.085 2.16
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PIN ASSIGNMENTS PIN FUNCTIONS
Name Function
28
VDGND
EE
27
AGND
26
V
CC
25
V
FB
24
V
SB
23
V
RM
22
V
IN1
21
V
IN2
20
V
ST
19
V
FT
18
V
CC
17
AGND
16
V
EE
15
CLK
DGND Digital Ground D0-D9 ECL Outputs (D0=LSB) D10 ECL Output Overrange CLK Clock Input
CLK
V
EE
Inverted Clock Input
-5.2 V Supply AGND Analog Ground V
CC
V
, V
IN1
IN2
V
FT
V
ST
V
FB
V
SB
V
RM
+5.0 V supply Inputs (tied together at the die) Force for Top of Reference Ladder Sense for Top of Reference Ladder Force for Bottom of Reference Ladder Sense for Bottom of Reference Ladder Middle of Reference Ladder
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
DGND
CLK
1
2
3
4
5
6
7
Sidebrazed
PDIP
8
9
10
11
12
13
14
ORDERING INFORMATION
PART NUMBER TEMPERATURE RANGE PACKAGE TYPE
SPT7814AIJ -25 to +85 °C 28L Sidebrazed DIP SPT7814BIJ -25 to +85 °C 28L Sidebrazed DIP SPT7814ACN 0 to 70 °C 28L Plastic DIP SPT7814BCN 0 to 70 °C 28L Plastic DIP SPT7814BCU +25 °C Die*
*Please see the die specification for guaranteed electrical performance.
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
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