Page 1
SPPH1
1.5mm-travel Vertical Type
Vertical push switch with two types of knob available
Detector Slide Push Rotary Power
■ Typical Specifications
Items Specifications
Rating （max.）/（min.）
（Resistive load）
Contact resistance
（Initial/After operating life）
0.1A 30V DC / 50μA 3V DC
20mΩ max. / 40mΩ max.
Package Type
Dual-in-line
Horizontal
Type
Vertical
Type
Product Line
Changeover
timing
Non shorting
Travel
（mm）
1. 5
Total travel
（mm）
2.5
Mounting
method
PC
board
Poles
2
Operating force
Operating life
knob
style
Standard
Short
Standard
Short
Standard
Short
Operating
force
＋1
2 N
− 0.7
＋1
3 N
− 0.7
Operation
Latching
Momentar y
Latching
Momentar y
Latching
Momentar y
Latching
Momentar y
Latching
Without load
With load
Terminal
type
Straight
Snap- in
Straight
Snap- in
Refer to the products line
10,000 cycles
10,000 cycles （0.1A 30V DC）
Minimum order unit （pcs.）
Japan Export
SPPH110800
SPPH110300
SPPH120400
SPPH120100
SPPH130400
800
4,000
SPPH130100
SPPH140300
SPPH140100
SPPH110900
SPPH130500
SPPH140400
Product No.
Drawing
No.
1
2
1
2
1
2
122
Packing Specifications
Bulk
Number of packages （pcs.）
1 case / Japan
800 4,000 400×2 70×2 9 0
1 case / export packing
Export package measurements
（mm）
Refer to P.130 for soldering conditions.
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SPPH1／1.5mm-travel Vertical Type
Detector Slide Push Rotary Power
Dimensions
No.
2-R0.5
1
2
0.35
Unit:mm
Style
PC board mounting hole dimensions
（Viewed from the direction A）
Straight terminal Snap-in terminal
2-R0.5
2.5
A
10
7
Travel
3.3
Total travel
2.5
2.5
1.5
0.6
2.5
ø0.9 hole
5
2.5
2.5
)
5
(
ø0.9 hole
2.5
Thickness of PC board t=1.6mm
4.1
2.5
10
4
3.3
2.5
(
)
1.8
)
0.2
(
2
1
1
9
5
17.5
8.5
0.35
5
3.5
Terminal No.4
Straight terminal Snap-in terminal
A
10
4
(
)
1.5
)
0.2
(
5
13.5
8.5
Terminal No.4
5
3.5
10
7
2.2
0.6
2.5 2.5
2
0.4
Travel
Total travel
2.5
1.5
ø0.9 hole
5
2.5
2.5
)
5
(
ø0.9 hole
2.5
Thickness of PC board t=1.6mm
4.1
2.5
Package Type
Dual-in-line
Horizontal
Type
Circuit Diagram
（Viewed from Direction A）
123
456
Terminal Configuration
Straight terminal Snap-in terminal
(3.5)
0.35
5
R1
3.9
0.35
5
0.8
1.9
Unit:mm
2.8
(3.5)
Vertical
Type
123
Page 3
Series
Photo
Vertical
SPEH SPEJ SPPH4 SPPH1
Detector Slide Push Rotary Power
Dimensions
（mm）
Travel （mm）
Total travel （mm）
Number of poles
Operating
temperature range
Automotive use
Life cycle
Rating （max.）
（Resistive load）
Rating （min.）
（Resistive load）
Operating life
Durability
Operating life with load
（at max. rated load）
Initial contact
Electrical
performance
Voltage proof
W
D
H
without load
resistance
Insulation
resistance
6 7 6.5 10
6 7 8.5 10
5 5.95 8.5
— — 2.2 1. 5
1. 6 1.7 3 2.5
1 2
−40℃ to ＋90℃ −40℃ t o ＋85 ℃ −10℃ to ＋60℃
● ● — ●
5 0 m A 16 V D C 0.2A 14V DC 0.1A 30V DC
10μ A 1V DC — 50μ A 3V DC
100,000cycles
40 0mΩ max.
100,000cycles
40 0mΩ max.
20 0mΩ max . 15 0 m Ω m a x . 10 0 mΩ ma x. 2 0mΩ max.
10 0 M Ω mi n . 10 0 V D C 100MΩ min. 500V DC
250V AC for 1minute 5 0 0 V AC f o r 1m i n u t e
10,000cycles 150mΩ max.
10,000cycles 150mΩ max.
10,000cycles
10 0 mΩ ma x.
10,000cycles
10 0 mΩ ma x.
10,000cycles
40 mΩ ma x.
10,000cycles
40 mΩ ma x.
Package Type
Dual-in-line
Horizontal
Type
Vertical
Type
Mechanical
performance
Actuator
strength
Environmental
performance
Page
Terminal
strength
Operating
direction
Pulling
direction
Cold
Dry heat
Damp heat
90 to 95%RH 1000h
— — 5 N f o r 1m i n u t e
50N 49N 30N 50N
— — 10 N —
–40℃ 1000h –40℃ 500h –20℃ 96h
90℃ 1000h 85℃ 500h 85℃ 96h
60℃,
119 120 121 12 2
60℃,
90 to 95%RH 500h
40℃, 90 to 95%RH 96h
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 130
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・131
Note
● Indicates applicability to all products in the series.
109
Page 4
Push Switches / Soldering Conditions
Detector Slide Push Rotary Power
Package Type
Dual-in-line
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
A max.
B
200
D
E
Temperature (˚C )
100
Room
temperature
Time (s)
Pre-heating
C
Series（Reflow type）
SPEJ
A（℃）
3s max.
F max.
B（℃） C（s） D（℃） E（℃） F（s）
Horizontal
Type
Vertical
Type
SPEF
260
230 40 18 0 150 120
SPEH
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Reference for Hand Soldering
Series
SPPJ3, SPPJ2, SPUN, SPUJ, SPPH4, SPPH1
SPED2, SPED4
SPEJ
SPEF
SPEH
Reference for Dip Soldering
(For PC board terminal types)
Series
SPPJ3
SPUN
SPUJ, SPPH4
SPPJ2, SPPH1, SPED2, SPED4, SPEF
Soldering temperature
3 5 0 ±10 ℃ 3 +1/ 0 s
3 5 0 ±10 ℃ 3±0.5s
3 5 0 ±10 ℃ 4s max.
350±5℃ 3s max.
350℃ max.
For PC board 端子タイプに適用
Items Dip soldering
Preheating temperature
10 0 ℃ m a x . 60s max. 2 60±5℃
10 0 ℃ m a x . 60s max. 2 60±5℃
Preheating time
— 260±5℃
— 260±5℃
Soldering temperature Duration of immersion
Soldering time
3s max.
5 ±1s
10 ±1s
5 ±1s
10 ±1s
130
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