Datasheet SPI20N60CFD Datasheet (INFINEON)

Page 1
SPI20N60CFD
S
DS(on)
)
AR
j
stg
Cool MOS™ Power Transistor
Feature
New revolutionary high voltage technology
Worldwide best R
Ultra low gate charge
Periodic avalanche rated
Extreme dv/dt rated
High peak current capability
Intrinsic fast-recovery body diode
Extreme low reverse recovery charge
Type Package Pb-free
SPI20N60CFD PG-TO262 Yes
DS(on
in TO 220
V
D
Marking
20N60CFD
@ T
R
650 V
x
0.22
I
D
20.7 A
PG-TO262
Maximum Ratings
Parameter
Continuous drain current
= 25 °C
T
C
= 100 °C
T
C
Pulsed drain current, tp limited by T
max
Avalanche energy, single pulse
= 10 A, VDD = 50 V
I
D
Avalanche energy, repetitive tAR limited by T
jmax
1)
ID = 20 A, VDD = 50 V
Avalanche current, repetitive tAR limited by T
max
Reverse diode dv/dt
IS=20.7A, VDS=480V, Tj=125°C
Gate source voltage V
Gate source voltage AC (f >1Hz) V
Power dissipation, T
= 25°C P
C
Operating and storage temperature T
Symbol Value Unit
I
D
A
20.7
13.1
I
D puls
E
AS
E
AR
I
52
690 mJ
1
20 A
dv/dt 40 V/ns
GS
GS
tot
, T
±20
±30
208 W
-55... +150
V
°C
2007-02-01Rev. 2.5 Page 1
Page 2
Maximum Ratings
(BR)
)
S
SPI20N60CFD
Parameter
Drain Source voltage slope
VDS = 480 V, ID = 20.7 A, Tj = 125 °C
Maximum diode commutation speed
VDS = 480 V, ID = 20.7 A, Tj = 125 °C
Symbol Value Unit
dv/dt 80 V/ns
diF/dt 900
Thermal Characteristics
Parameter
Thermal resistance, junction - case R
Thermal resistance, junction - ambient, leaded R
Soldering temperature, wavesoldering
Symbol Values Unit
thJC
thJA
T
sold
1.6 mm (0.063 in.) from case for 10s
Electrical Characteristics, at Tj=25°C unless otherwise specified
Parameter
Symbol Conditions Values Unit
A/µs
min. typ. max.
- - 0.6 K/W
- - 62
- - 260 °C
min. typ. max.
Drain-source breakdown voltage V
Drain-Source avalanche
V
breakdown voltage
Gate threshold voltage V
Zero gate voltage drain current I
Gate-source leakage current I
Drain-source on-state resistance R
Gate input resistance R
(BR)DS
GS(th
DSS
GSS
DS(on)
G
VGS=0V, ID=0.25mA 600 - - V
DSS
VGS=0V, ID=20A - 700 -
ID=1000µΑ, VGS=V
VDS=600V, VGS=0V,
=25°C,
T
j
=150°C
T
j
VGS=20V, VDS=0V - - 100 nA
VGS=10V, ID=13.1A,
=25°C
T
j
=150°C
T
j
f=1MHz, open Drain - 0.54 -
3 4 5
D
-
-
-
-
2.1
1700
0.19
0.51
µA
-
-
0.22
-
2007-02-01Rev. 2.5 Page 2
Page 3
Electrical Characteristics , at Tj = 25 °C, unless otherwise specified
r
)
f
g
gd
(p
)
SPI20N60CFD
Parameter
Symbol Conditions Values Unit
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Effective output capacitance,
2)
C
energy related
Effective output capacitance,
3)
C
time related
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
fs
iss
rss
o(er)
o(tr)
d(on
d(off
VDS≥2*ID*R
=13.1A
I
D
VGS=0V, VDS=25V,
f=1MHz
VGS=0V,
=0V to 480V
V
DS
VDD=380V, VGS=0/10V,
=20.7A, RG=3.6
I
D
DS(on)max
,
min. typ. max.
- 17.5 - S
- 2400 - pF
- 780 -
- 50 -
- 83 - pF
- 160 -
- 12 - ns
- 15 -
- 59 -
- 6.4 -
Gate Charge Characteristics
Gate to source charge
Q
s
VDD=480V, ID=20.7A - 15 - nC
Gate to drain charge Q
Gate charge total Q
Gate plateau voltage V
1
Repetitve avalanche causes additional power losses that can be calculated as P
2
is a fixed capacitance that gives the same stored energy as C
C
o(er)
3
is a fixed capacitance that gives the same charging time as C
C
o(tr)
g
lateau
VDD=480V, ID=20.7A,
=0 to 10V
V
GS
VDD=480V, ID=20.7A - 7 - V
while VDS is rising from 0 to 80% V
oss
while VDS is rising from 0 to 80% V
oss
- 54 -
- 95 124
AV=EAR
*f.
DSS
DSS
.
.
2007-02-01Rev. 2. Page 3
Page 4
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
D
r
r
SPI20N60CFD
Parameter
Inverse diode continuous
Symbol Conditions Values Unit
I
S
forward current
Inverse diode direct current,
I
SM
pulsed
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
Peak reverse recovery current I
Peak rate of fall of reverse
S
r
r
rrm
dirr/dt
recovery current
Typical Transient Thermal Characteristics
Symbol
Value Unit Symbol Value Unit
min. typ. max.
TC=25°C - - 20.7 A
- - 52
VGS=0V, IF=I
VR=480V, IF=IS ,
/dt=100A/µs
di
F
S
- 1 1.2 V
- 150 - ns
- 1 - µC
- 13 - A
- 1400 - A/µs
Thermal resistance
R
th1
R
th2
R
h
R
th4
R
th5
R
th6
P
tot
typ. typ.
Thermal capacitance
0.007686 K/W
0.015
0.029
0.114
0.136
0.059
T
R
j T
th1
(t)
C
th1
C
th2
C
th1
C
th2
C
h
C
th4
C
th5
C
th6
R
th,n
C
th,n
T
case
amb
External Heatsink
0.0003764
0.001412
0.001932
0.005299
0.012
0.091
Ws/K
2007-02-01Rev. 2.5 Page 4
Page 5
SPI20N60CFD
1 Power dissipation
= f (TC)
P
tot
SPP20N60CFD
240
W
200
180
160
tot
P
140
120
100
80
60
40
20
0
0 20 40 60 80 100 120
°C
2 Safe operating area
= f ( VDS )
I
D
10
=25°C
C
1
10
2
V
3
10
V
DS
parameter : D = 0 , T
2
10
A
1
10
D
I
0
10
-1
10
-2
10
160
T
C
10
tp=0.001 ms tp=0.01 ms tp=0.1 ms tp=1 ms DC
0
3 Transient thermal impedance
= f (tp)
Z
thJC
parameter: D = t
0
10
K/W
-1
10
thJC
Z
-2
10
-3
10
-4
10
10-710-610-510-410-310
/T
p
D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 single pulse
4 Typ. output characteristic
= f (VDS); Tj=25°C
I
D
parameter: t
70
A
50
D
I
40
30
20
10
-2
s
0
10
t
p
0
0 4 8 12 16 20 V 28
= 10 µs, V
p
Vgs = 10V Vgs = 8V Vgs = 7.5V Vgs = 7V Vgs = 6.5V Vgs = 6V Vgs = 5.5V Vgs = 5V
GS
V
DS
2007-02-01Rev. 2.5 Page 5
Page 6
SPI20N60CFD
5 Typ. output characteristic
= f (VDS); Tj=150°C
I
D
parameter: t
40
A
30
D
I
25
20
15
10
5
0
0 4 8 12 16 20 V 28
= 10 µs, V
p
Vgs = 20V Vgs = 7.5V Vgs = 7V Vgs = 6.5V Vgs = 6V Vgs = 5.5V Vgs = 5V Vgs = 4.5V
GS
6 Typ. drain-source on resistance
R
parameter: T
V
DS
=f(ID)
DS(on)
=150°C, V
j
1.5
GS
DS(on)
R
0.9
0.6
0.3
0 5 10 15 20 25 30 A 40
Vgs = 4.5V Vgs = 5V Vgs = 5.5V Vgs = 6V Vgs = 6.5V Vgs = 7V Vgs = 7.5V Vgs = 20V
I
D
7 Drain-source on-state resistance
R
parameter : I
= f (Tj)
DS(on)
= 13.1 A, VGS = 10 V
D
SPP20N60CFD
1.3
1.1
1
0.9
DS(on)
0.8
R
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-60 -20 20 60 100
98%
typ
°C
8 Typ. transfer characteristics
= f ( VGS ); VDS≥ 2 x ID x R
I
D
DS(on)max
parameter: tp = 10 µs
70
A
Tj = 25°C
50
D
I
40
30
20
10
180
T
j
0
0 4 8 12 V 20
Tj = 150°C
V
GS
2007-02-01Rev. 2.5 Page 6
Page 7
SPI20N60CFD
9 Typ. gate charge
= f (Q
V
GS
parameter: I
SPP20N60CFD
16
V
0.2 V
12
0.8 V
GS
10
V
8
6
4
2
0
0 20 40 60 80 100 120
)
Gate
= 20.7 A pulsed
D
DS max
DS max
nC
Q
150
Gate
10 Forward characteristics of body diode
= f (VSD)
I
F
parameter: Tj , t
2
SPP20N60CFD
10
A
1
10
F
I
0
10
-1
10
0 0.4 0.8 1.2 1.6 2 2.4
p = 10 µs
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
V
3
V
SD
11 Avalanche SOA
= f (tAR)
I
AR
par.: T
150 °C
j
20
A
AR
I
10
5
0
10-310-210-110010110
Tj(Start)=125°C
Tj(Start)=25°C
2
µs
t
AR
10
12 Avalanche energy
= f (Tj)
E
AS
par.: I
4
= 10 A, VDD = 50 V
D
750
mJ
600
550
500
AS
E
450
400
350
300
250
200
150
100
50
0
20 40 60 80 100 120
°C
160
T
j
2007-02-01Rev. 2.5 Page 7
Page 8
SPI20N60CFD
13 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (Tj)
SPP20N60CFD
720
V
680
660
640
620
600
580
560
540
-60 -20 20 60 100
°C
14 Avalanche power losses
= f (f )
P
AR
parameter: E
500
W
AR
P
300
200
100
0
180
T
j
10
4
AR
=1mJ
10
5
Hz
10
6
f
15 Typ. capacitances
C = f (V
parameter: V
10
pF
10
C
10
10
10
)
DS
=0V, f=1 MHz
5
4
3
2
1
0 100 200 300 400 V 600
GS
Crss
Ciss
Coss
16 Typ. C
=f(VDS)
E
oss
14
stored energy
oss
µJ
10
oss
E
8
6
4
2
0
0 100 200 300 400 V 600
V
DS
V
DS
2005-02-01Rev. 2.5 Page 8
Page 9
SPI20N60CFD
17 Typ. reverse recovery charge
Qrr = f(TJ)
parameter: ID = 20.7A
1800
1700
1600
rr
Q [nC]
1500
1400
1300
1200
1100
1000
25 50 75 °C 125
18 Typ. reverse recovery charge
Qrr = f(ID)
parameter: di/dt = 100 A/µs
1800
1700
1600
1500
1400
rr
1300
Q [nC]
1200
1100
1000
900
800
700
600
500
400
T
j
Tj = 125°C
Tj = 25°C
2 4 6 8 10 12 14 16 A 20
I
D
19 Typ. reverse recovery charge
Qrr = f(di/dt)
parameter: ID = 20.7 A
3400
3200
3000
2800
2600
rr
Q [nC]
2400
2200
2000
1800
1600
1400
1200
1000
100 200 300 400 500 600 700 A/µs 900
Tj = 125°C
Tj = 25°C
di/dt
2007-02-01Rev. 2.5 Page 9
Page 10
Definition of diodes switching characteristics
SPI20N60CFD
2007-02-01Rev. 2.5 Page 10
Page 11
PG-TO-262-3-1
SPI20N60CFD
Rev. 2.5 Page 11
2007-02-01
Page 12
SPI20N60CFD
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
2007-02-01Rev. 2.5 Page 12
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