Datasheet SP3304N Datasheet (Littelfuse)

TVS Diode Arrays (SPA

GND

13

97

5

13 5

79

GND

J1

J8

RJ-45 Connector

*Package is shown as transparent Ethernet PHY

Tx+

Tx-

Rx-

Rx+

SP3304N

PHY

RoHS

GREEN

®

Diodes)

Lightning Surge Protection - SP3304N Series

SP3304N Series 3.3V 20A Diode Array

Pinout

Pb

Description

The SP3304N integrates 4 channels of low capacitance
diodes with an additional zener diode to protect sensitive
I/O pins against lightning induced surge events and
ESD. This robust device can safely absorb up to 20A per
IEC61000-4-5 (t
and a minimum ±30kV ESD per IEC61000-4-2 international
standard. The low loading capacitance makes the SP3304N
ideal for protecting high-speed signal pins.

Features

• ESD, IEC61000-4-2,
±30kV contact, ±30kV air

• EFT, IEC61000-4-4, 40A
(t

p

=5/50ns)

• Lightning, IEC61000-4-5,
20A (t

p

=8/20μs) without performance degradation

P

• Low capacitance of 3.5pF
(TYP) per I/O

• Low leakage current of
1µA (MAX) at 3.3V

=8/20µs)

Functional Block Diagram

Additional Information

Datasheet

Resources

Samples

Applications

• 10/100/1000 Ethernet
Interfaces

• Customer Premise
Equipment (CPE)

Application Example

• VoIP Phones

• Set Top Boxes

• PBX Systems

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13

TVS Diode Arrays (SPA

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

110%

0.0 5.0 10.0 15.0 20.0 25.0 30.0

Time (μs)

Percent of I

PP

0 5 10 15 20

Peak Pulse Current-I

PP

(A)

0.0

2.0

4.0

6.0

10.0

12.0

Clamp Voltage (V

C

)

8.0

®

Diodes)

Lightning Surge Protection - SP3304N Series

Absolute Maximum Ratings

Symbol Parameter Value Units

I

PP

P

PK

T

OP

T

STOR

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.

Electrical Characteristics (T

Reverse Standoff Voltage V

Punch Through Voltage V

Snap Back Voltage V

Reverse Leakage Current I

Clamp Voltage

Dynamic Resistance R

ESD Withstand Voltage

Diode Capacitance

Diode Capacitance

Note: 1. Parameter is guaranteed by design and/or device characterization.

Peak Current (tp=8/20μs) 20.0 A

Peak Pulse Power (tp=8/20µs) 300 W

Operating Temperature –40 to 125 ºC

Storage Temperature –55 to 150 °C

=25ºC)

OP

Parameter Symbol Test Conditions Min Typ Max Units

RWM

PT

SB

LEAK

IPT=5µA 3.5 V

ISB=50mA 2.8 V

VR=2.5V, I/O to GND 0.5 1. 0 µA

IPP=1A, tp=8/20µs, Fwd 6.0 V

I

=5A, tp=8/20µs, Fwd 7. 0 V

1

1

1

1

V

C

I/O-GND

C

V

C

DYN

ESD

I/O-I/O

PP

I

=10A, tp=8/20µs, Fwd 8.0 V

PP

I

=20A, tp=8/20µs, Fwd 11. 5 V

PP

(VC2-VC1)/(I

PP2-IPP1

IEC61000-4-2 (Contact) ±30 kV

IEC61000-4-2 (Air) ±30 kV

Reverse Bias=0V 3.5 5.0 pF

Reverse Bias=0V 2.0 pF

Thermal Information

Parameter Rating Units

Storage Temperature Range –55 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature
(Soldering 20-40s)

3.3 V

) 0.25

260 °C

W

Pulse Waveform

Clamping Voltage vs. I

PP

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 04/24/13

TVS Diode Arrays (SPA

Bias Voltage (V)

Capacitance (pF)

0.0

1.0

2.0

3.0

4.0

5.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

t

R

R

o

C

e

T

L

T

P

SP

3304N

U

T

G

Series

Package
U= µDFN-10

T= Tape & Reel

G= Green

TVS Diode Arrays
(SPA

®

Diodes)

U*4

Product Series
U = SP3304N

Assembly Site

Number o

f

Channels

®

Diodes)

Lightning Surge Protection - SP3304N Series

Capacitance vs. Bias

Soldering Parameters

Reflow Condition Pb – Free assembly

- Temperature Min (T

Pre Heat

- Temperature Max (T

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus) Temp
(T

) to peak

L

to TL - Ramp-up Rate 3°C/second max

T

S(max)

Reflow

- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260

Time within 5°C of actual peak
Temperature (t

)

p

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

Do not exceed 260°C

) 150°C

s(min)

) 200°C

s(max)

3°C/second max

+0/-5

°C

20 – 40 seconds

) 8 minutes Max.

P

Ordering Information

Part Number Package Marking Min. Order Qty.

SP3304NUTG µDFN-10 UH4 3000

t

T

P

Ramp-up

t

amp-up

PreheatPrehea

S

T

L

T

S(max)

Temperature

T

S(min)

25

time to peak temperature

P

t

L

Critical Zone

ritical Zon

L to TP

to

T

Ramp-down

amp-d

Time

Part Numbering System

Product Characteristics

Lead Plating Pre-Plated Frame

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13

Part Marking System

Package Dimensions — µDFN-10

D

E

B

Top View

A

A

Bottom View

0.10 C

b

A3

C

Seating

Plane

Side View

0.10

C

B

M

A

0.05 C

e

D2

E2

2X

C

T

B0

K0

P2

D0

E

F

P0

P1

D1

W

5º MAX

A0

5º MAX

User Feeding Direction

Pin 1 Location

Recommended Solder Pads µDFN-10L 2.6x2.6mm

B

CF

X

P

GZ

Y

TVS Diode Arrays (SPA

®

Diodes)

Lightning Surge Protection - SP3304N Series

Package µDFN-10 (2.6x2.6mm)

JEDEC MO-229

Symbol

A 0.45 0.50 0.55 0.018 0.020 0.022

A3 0.130 Ref 0.005 Ref

b 0.17 0.22 0.27 0.006 0.008 0.010
D 2.50 2.60 2.70 0.097 0. 101 0.105

D2 2.10 2.15 2.20 0.081 0.083 0.085

E 2.50 2.60 2.70 0.097 0 .101 0.105

E2 1.21 1.26 1.31 0.046 0.049 0.051

e 0.50 BSC 0.020 BSC
L 0.35 0.40 0.45 0.014 0.016 0.018

Millimeters Inches

Min Nom Max Min Nom Max

Embossed Carrier Tape & Reel Specification — µDFN-10 (2.6x2.6mm)

Dimension

Symbol Millimeters Inches

B 2.30 0.091
C 2.20 0.087
F 1.41 0.056
G 1.65 0.065
P 0.50 0.020
X 0.37 0.015
Y 0.55 0.022
Z 2.75 0.108

Symbol Millimeters

A0 2.82 ± 0.05
B0 2.82 ± 0.05
D0 Ø1.50 + 0.10
D1 Ø 0.50 + 0.05

E 1.75 ± 0.10

F 3.50 ± 0.05
K0 0.76 ± 0.05
P0 4.00 ± 0.10
P1 4.00 ± 0.10
P2 2.00 ± 0.05

T 0.25 ± 0.02
W 8.00 + 0.30 /- 0.10

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 04/24/13