Page 1
TVS Diode Arrays (SPA
Pb
VCC
10/100
Ethernet
PHY
TX +
TX -
RX +
RX -
VCC
GND
SP3050-04HTG
TX +
TX -
RX +
RX -
Unused
Unused
Unused
RJ45
Unused
To Twisted-Pair Network
75
75
75
75
1
2
3
6
5
4
10/100 Ethernet Differential Protection
™
Family of Products)
Lightning Surge Protection - SP3050 Series
SP3050 Series 6V 10A Rail Clamp Array
Pinout
I/O 1
GND
I/O 2
Functional Block Diagram
I/O 4
V
CC
I/O 3
RoHS
GREEN
Description
The SP3050 integrates low capacitance rail-to-rail diodes
with an additional zener diode to protect each I/O pin
against ESD and high surge events. This robust device can
safely absorb surge current per IEC61000-4-5 (t
=8/20µs)
P
without performance degradation and a minimum ±20kV
ESD per IEC61000-4-2. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins.
Features
•ESD,IEC61000-4-2,
±20kV contact, ±30kV air
•EFT,IEC61000-4-4,40A
(5/50ns)
•Lightning,IEC61000-4-5,
•Lowcapacitanceof2pF
(TYP) per I/O
•Lowleakagecurrentof
0.5μA (MAX) at 5V
•SmallSOT23-6packaging
10A (8/20μs)
Applications
•LCD/PDPTVs
•Monitors
•Notebooks
•10/100/1000Ethernet
•Firewire
•SetTo pBoxes
•FlatPanelDisplays
•PortableMedical
SP3050
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
6
1
4
5
3
2
Application Examples
USB Dual Port Protection
USB
Controller
10/100/1000
Ethernet
PHY
TX +
RX +
RX -
VCC
GND
TX -
C
T
C
T
10/100/1000 Ethernet Protection
1
2
3
SP3050-04HTG
VCC
V
BUS
R
T
R
T
V
BUS
C
T
R
T
R
T
C
T
6
5
4
SP3050-04HTG
75
V
BUS
D +
USB
D -
Port
GND
V
BUS
V
BUS
D +
USB
Port
D -
GND
RJ45
Unused
Unused
TX +
TX -
RX +
RX -
To Twisted-Pair Network
Unused
Unused
75
75
75
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
129
Revision: June 27, 2011
SP3050 Series
Page 2
TVS Diode Arrays (SPA
™
Family of Products)
Lightning Surge Protection - SP3050 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
OP
V
C
C
LEAK
I/O-GND
1
=25ºC)
RWM
R
V
C
DYN
ESD
I/O-I/O
10 A
IR ≤ 1µA 6.0 V
IR = 1mA 8.0 V
VR=5V 0.1 0.5 µA
IPP=1A, tp=8/20µs, I/O to GND
I
=5A, tp=8/20µs, I/O to GND
PP
I
=8A, tp=8/20µs, I/O to GND
PP
(VC2 - VC1) / (I
IEC61000-4-2 (Contact) ±20 kV
IEC61000-4-2 (Air) ±30 kV
Reverse Bias=0V 2.4 3.0 pF
Reverse Bias=1.65V 2.0 pF
Reverse Bias=0V 1. 2 pF
I
PP
P
PK
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
1
Non-repetitive pulse per waveform on page 3
Peak Current (tp=8/20μs)
Peak Pulse Power (tp=8/20μs) 150 W
Operating Temperature -40 to 85 °C
Storage Temperature -50 to 150 °C
Electrical Characteristics (T
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage V
Reverse Voltage Drop V
Reverse Leakage Current I
Clamp Voltage
Dynamic Resistance R
ESD Withstand Voltage
Diode Capacitance
Diode Capacitance
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2
Repetitive pulse per waveform on page 3.
1
1
1
1
Thermal Information
Parameter Rating Units
Storage Temperature Range -65 to 150 °C
Maximum J unction Temperature 150 °C
Maximum L ead Temperature
(Soldering 20-40s)
2
2
2
- I
) 0.7 Ω
PP2
PP1
8.8 10.0 V
11. 5 13.0 V
13.2 15.0 V
260 °C
Clamping Voltage vs. I
20.0
18.0
16.0
)
14.0
C
12.0
10.0
8.0
6.0
Clamp Voltage (V
4.0
2.0
0.0
1 2 3 4 5 6 7 8 9 10
SP3050 Series
PP
Peak Pulse Current-IPP (A)
Product Characteristics
Lead Plating Matte Tin
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Subsitute Material Silicon
Body Material Molded Epoxy
Flammability UL94-V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
130
Revision: June 27, 2011
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
©2011 Littelfuse, Inc.
Page 3
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
T
™
Family of Products)
Lightning Surge Protection - SP3050 Series
Pulse WaveformCapacitance vs. Reverse Bias
3.0
2.5
VCC=Float
2.0
1.5
1.0
Capacitance (pF)
0.5
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
=3.3V
V
CC
DC Bias (V)
=5V
V
CC
Soldering Parameters
Reflow Condition Pb – Free assembly
- Temperature Min (T
Pre Heat
- Temperature Max (T
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
Do not exceed 260°C
) 150°C
s(min)
) 200°C
s(max)
3°C/second max
+0/-5
°C
20 – 40 seconds
) 8 minutes Max.
P
110%
100%
90%
80%
70%
PP
60%
50%
40%
Percent of I
30%
20%
10%
0%
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
t
T
P
T
L
T
S(max)
Temperature
T
S(min)
25
Ramp-up
amp-up
PreheatPrehea
t
S
time to peak temperature
P
t
L
Critical Zone
ritical Zon
L to TP
to
T
Ramp-down
amp-d
Time
SP3050
Part Numbering System
3050
SP
Silicon Protection
Array (SPA
Family of
TVS Diode Arrays
Series
TM
)
Number of
Channels
–
04
H T
G
G= Green
T= Tape & Reel
Package
H: SOT23-6
Part Marking System
L*4
Product Series
L = SP3050
L = SP3050
Ordering Information
L * 4
Assembly Site
(Varies)
(Varies)
Number of Channels
Part Number Package Marking Min. Order Qty.
SP3050-04HTG SOT23-6 L*4 3000
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
131
Revision: June 27, 2011
SP3050 Series
Page 4
Package Dimensions — SOT23-6
Recommended Solder Pad Layout
P
R
TVS Diode Arrays (SPA
™
Family of Products)
Lightning Surge Protection - SP3050 Series
Package SOT23-6
Pins 6
JEDEC MO-203 Issue A
Min Max Min Max
A 0.900 1.450 0.035 0.057 -
A1 0.000 0.150 0.000 0.006 -
A2 0.900 1.300 0.035 0.051 -
b 0.350 0.500 0.0138 0.0196 -
C 0.080 0.220 0.0031 0.009 -
D 2.800 3.000 0.11 0.118 3
E 2.600 3.000 0.102 0.118 -
E1 1.500 1.750 0.06 0.069 3
e 0.95 Ref 0.0374 ref -
e1 1.9 Ref 0.0748 Ref -
L 0.100 0.600 0.004 0.023 4,5
N 6 6 6
a 0º 10 º 0º 10 º -
M 2.590 0.102 -
O 0.690 .027 TYP -
P 0.990 .039 TYP -
M
R 0.950 0.038 -
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
Millimeters Inches
Notes
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND REEL
ACCESS HOLE
180mm
14.4mm
13mm
60mm
8.4mm
DIA. HOLE
8mm
1.5mm
USER DIRECTION OF FEED
4.0mm
4.0mm
SOT-23 (8mm POCKET PITCH)
2.0mm
1.75mm
C
L
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
PIN 1
SP3050 Series
132
Revision: June 27, 2011
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
©2011 Littelfuse, Inc.
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