Page 1
TVS Diode Arrays (SPA
1
2
RoHS
GREEN
1
2
(AEC-Q101 qualified)
USB Port
USB Controller
Signal Ground
IC
*Packages are shown as transparent
SP1003
D+
D-
SSTX+
SSTX-
SSRX+
SSRX-
V
BUS
HDMI
Port
HDMI
Chipset
-
*Packages are shown as transparent
IC
SP3030 (x8)
SP3002
-
-
-
®
Diodes)
Low Capacitance ESD Protection - SP3030 Series
SP3030 Series 0.5pF 20kV Unidirectional Discrete TVS
Description
The SP3030 includes low capacitance rail to rail diodes
with an additional Zener diode to provide protection for
electronic equipment that may experience destructive
electrostatic discharges (ESD). These robust diodes
can safely absorb repetitive ESD strikes above the
maximum level specified in the IEC61000-4-2 international
standard (±20kV contact discharge) without performance
degradation. The low loading capacitance makes it ideal
for protecting high speed data lines such as HDMI, DVI,
USB2.0, USB3.0 and eSATA.
Features
Pinout
• ESD protection of ±20kV
contact discharge,
±30kV air discharge,
(IEC61000-4-2)
• EFT protection,
IEC61000-4-4, 40A
(t
=5/50ns)
p
• Lightning Protection,
IEC61000-4-5, 3A
(t
=8/20µs)
p
Pb
• Low capacitance of 0.5pF
@ V
=0V
R
• Low leakage current of
0.1μA at 5V
• Small SOD882 packaging
helps save board space
• AEC-Q101 qualied
(SOD882 package)
Applications
Functional Block Diagram
• Tablets
• Ultrabook
• eReader
• Smart Phones
• Digital Cameras
• MP3/ PMP
• Set Top Boxes
• Portable Medical
USB3.0 Application Example
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
HDMI Application Example
Additional Information
Datasheet
Resources
Samples
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/22/13
Page 2
TVS Diode Arrays (SPA
Bias Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Normalized Capacitance (pF)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
®
Diodes)
Low Capacitance ESD Protection - SP3030 Series
Absolute Maximum Ratings
Symbol Parameter Value Units
I
PP
T
OP
T
STOR
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (T
Peak Current (tp=8/20μs) 3.0 A
Operating Temperature -40 to 125 °C
Storage Temperature -55 to 150 °C
=25ºC)
OP
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage V
Reverse Leakage Current I
Clamp Voltage
ESD Withstand Voltage
1
1
Dynamic Resistance R
Diode Capacitance
Note: 1. Parameter is guaranteed by design and/or device characterization.
1
C
RWM
LEAK
V
V
I/O-I/O
ESD
DYN
VR=5V with 1pin at GND 0.1 0.5 µA
IPP=1A, tp=8/20µs, Fwd 9.2 V
C
=2A, tp=8/20µs, Fwd 10.0 V
I
PP
IEC61000-4-2 (Contact) ±20 kV
IEC61000-4-2 (Air) ±30 kV
(VC2-VC1)/(I
Reverse Bias=0V, f=1 MHz 0.5 pF
Insertion Loss (S21) I/O to GND
Thermal Information
Parameter Rating Units
Storage Temperature Range -55 to 150 °C
Maximum Junction Temperature 150 °C
Maximum Lead Temperature
(Soldering 20-40s)
5 V
) 0.8 Ω
PP2-IPP1
Normalized Capacitance vs. Reverse Voltage
260 °C
SP3030
0
-1
-2
-3
-4
-5
-6
Attenuation (dB)
-7
-8
-9
-10
10 1001000
Frequency (MHz)
HDMI 1.4 Eye Diagram
USB3.0 Eye Diagram
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 11/22/13
Page 3
TVS Diode Arrays (SPA
t
R
R
o
C
e
T
L
T
P
SP
3030
01
E T
G
T= Tape & Reel
TVS Diode Arrays
(SPA Diodes)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.0 15.0 20.0 25.0 30.0
Time (μs)
Percent of I
PP
TLP Vo ltage (V)
TLP Current (A)
0
2
4
6
8
10
12
14
16
18
20
0510 15 20 25
X
Product IDPin 1
“T” or “W”
®
Diodes)
Low Capacitance ESD Protection - SP3030 Series
Pulse Waveform
Soldering Parameters
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (T
- Temperature Max (T
) 150°C
s(min)
) 200°C
s(max)
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp
(T
) to peak
L
to TL - Ramp-up Rate 3°C/second max
T
S(max)
Reflow
- Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260
Time within 5°C of actual peak
Temperature (t
)
p
3°C/second max
+0/-5
°C
20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (T
) 8 minutes Max.
P
Do not exceed 260°C
Part Numbering System
–
®
G= Green
Series
Number of
Channels
Package
E: SOD882
Ordering Information
Part Number Package Marking Min. Order Qty.
SP3030-01ETG SOD882 “T” or “W” 10,000
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/22/13
Transmission Line Pulsing(TLP) Plot
t
T
P
Ramp-up
t
amp-up
PreheatPrehea
S
T
L
T
S(max)
Temperature
T
S(min)
25
time to peak temperature
P
t
L
Ramp-down
amp-d
Time
Product Characteristics
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Lead Coplanarity 0.0004 inches (0.102mm)
Substitute Material Silicon
Body Material Molded Epoxy
Flammability UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Marking System
Critical Zone
ritical Zon
T
L to TP
to
Page 4
Package Dimensions — SOD882
Recommended Soldering Pad Layout
TVS Diode Arrays (SPA
®
Diodes)
Low Capacitance ESD Protection - SP3030 Series
Package SOD882
Symbol
JEDEC MO-236
Millimeters Inches
Min Typ Max Min Ty p Max
A 0.90 1.0 0 1. 1 0 0.037 0.039 0.041
B 0.50 0.60 0.70 0.022 0.024 0.026
C 0.40 0.50 0.60 0.016 0.020 0.024
D 0.45 0.018
E 0.20 0.25 0.35 0.008 0.010 0.012
F 0.45 0.50 0.55 0.018 0.020 0.022
Embossed Carrier Tape & Reel Specification — SOD882
Symbol Millimeters
A0 0.70±0.045
B0 1.10±0.045
K0 0.65±0.045
F 3.50±0.05
P1 2.00±0.10
W 8.00 + 0.30 -0.10
Specifications are subject to change without notice.
© 2013 Littelfuse, Inc.
Revised: 11/22/13
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