Datasheet SP208EHCA, SP208EHCP, SP207EHCA, SP207EHCP, SP207EHCT Datasheet (Sipex Corporation)

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Page 1

High Speed +5V High Performance

■ Single +5V Supply Operation

■ 0.1µF External Charge Pump Capacitors

■ 500Kbps Data Rate Under Load

■ Standard SOIC and SSOP Packages

■ Lower Supply Current Than Competition

(typical 3mA)

■ 1µA Shutdown Mode

■ WakeUp Feature in Shutdown Mode

■ Tri–State Receiver Outputs

■ Ideal for High Speed RS-232 Applications

■ Improved ESD Specifications:

+15kV Human Body Model +15kV IEC1000-4-2 Air Discharge +8kV IEC1000-4-2 Contact Discharge

SP207EH–SP213EH

RS232 T ransceivers

DESCRIPTION

The SP207EH/208EH/211EH/213EH devices are high speed enhanced multi-channel RS-232 line transceivers with improved electrical performance. The SP207EH/208EH/ 211EH/213EH series is a superior drop-in replacement to our previous versions as well as popular industry standards. All devices feature low-power CMOS construction and the Sipex-patented (5,306,954) on-board charge pump circuitry that generates the +10V RS-232 voltage levels using 0.1µF charge pump capacitors. The SP211E and SP213E devices feature a low-power shutdown mode, which reduces power supply drain to 1µA. Enhancements to this series include a higher transmission rate of 500Kbps, a lower power supply current at 3mA typical (no load), and superior ESD performance. The ESD tolerance has been improved for this series to over +15kV for both Human Body Model and IEC1000-4-2 Air Discharge test methods.

Model Drivers Receivers Active in Shutdown 0.1µF Capacitors Shutdown WakeUp TTL Tri–State SP207EH 53 0 4 NoNoNo SP208EH 44 0 4 NoNoNo SP211EH 4 5 0 4 Yes No Yes SP213EH 4 5 2 4 Yes Yes Yes

Table 1. Model Selection Table

Nu RS232 No. of Receivers No. of External

Page 2

ABSOLUTE MAXIMUM RATINGS

These are stress ratings only and functional operation of the device at these or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.

VCC............................................................................................ +6V

V+................................................................. (VCC – 0.3V) to +13.2V

V–........................................................................................... 13.2V

Input Voltages

TIN................................................................... –0.3V to (VCC +0.3V)

RIN........................................................................................... ±20V

Output Voltages T

.......................................................... (V+, +0.3V) to (V–, –0.3V)

OUT

................................................................. –0.3V to (VCC +0.3V)

OUT

Short Circuit Duration on T Power Dissipation

Plastic DIP .......................................................................... 375mW

(derate 7mW/°C above +70°C)

Small Outline ...................................................................... 375mW

(derate 7mW/°C above +70°C)

....................................... Continuous

OUT

Power Dissipation Per Package

24-pin SSOP (derate 11.2mW/oC above +70oC)....900mW

24-pin PDIP (derate 15.9mW/oC above +70oC)....1300mW

24-pin SOIC (derate 12.5mW/oC above +70oC)...1000mW

28-pin SSOP (derate 11.2mW/oC above +70oC)....900mW

28-pin SOIC (derate 12.7mW/oC above +70oC)...1000mW

SPECIFICATIONS

VCC at nominal ratings; 0.1µF charge pump capacitors; T

PARAMETER MIN. TYP. MAX. UNIT CONDITIONS TTL INPUTS TIN, EN, SD

Logic Threshold V

Logic Pullup Current 15 200 µAT Maximum Transmission Rate 480 Kbps CL = 1000pF, RL = 3KΩ

TTL OUTPUTS

Compatibility TTL/CMOS V

Leakage Current 0.05 +10 µA 0V ≤ R

RS232 OUTPUT

Output Voltage Swing +5 +7 Volts All transmitter outputs loaded Output Resistance 300 Ω VCC = 0V; V

Output Short Circuit Current +25 mA Infinite duration, V

RS232 INPUT

Voltage Range –15 +15 Volts Voltage Threshold Low 0.8 1.2 Volts VCC = 5V, TA = +25°C High 1.7 2.8 Volts VCC = 5V, TA = +25°C Hysteresis 0.2 0.5 1.0 Volts VCC = +5V Resistance 3 5 7 kΩ VIN =+15V; TA = +25°C

DYNAMIC CHARACTERISTICS

Driver Propagation Delay 250 ns TTL–to–RS-232 Receiver Propagation Delay 200 500 ns RS-232–to–TTL Instantaneous Slew Rate TBD V/µsC

Transition Time TBD µsC

Output Enable Time 400 ns Output Disable Time 250 ns

to T

, unless otherwise noted.

MIN

MAX

0.8 Volts

2.0 Volts

0.4 Volts I

3.5 Volts I

= 0V

= 3.2mA; VCC = +5V

OUT

= –1.0mA

OUT

≤ VCC ; SP211 EN = 0V;

OUT

SP213 EN = V TA = +25°C

with 3KΩ to ground

= +2V

OUT

= 50pF, RL = 3–7KΩ;

TA = +25°C; from +3V

= 2,500pF, RL = 3KΩ;

measured from +3V to –3V or –3V to +3V

= 0V

Page 3

SPECIFICATIONS

VCC at nominal ratings; 0.1µF charge pump capacitors; T

PARAMETER MIN. TYP. MAX. UNIT CONDITIONS POWER REQUIREMENTS

SP207EH 4.75 5.00 5.25 Volts All other parts 4.50 5.00 5.50 Volts I

Shutdown Current 1 10 µAT

ENVIRONMENTAL AND MECHANICAL

Operating Temperature Commercial, –C 0 +70 °C Extended, –E –40 +85 °C Storage Temperature –65 +125 °C Package –A Shrink (SSOP) small outline –T Wide (SOIC) small outline –P Narrow (PDIP) Plastic Dual-In-Line

to T

, unless otherwise noted.

MIN

MAX

TA = +25°C

3 6 mA No load; VCC = ±10%

15 mA All transmitters RL = 3KΩ

= +25°C

Transmitter Output @ 240Kbps RL = 3KΩ, CL = 1,000pF Transmitter Output @ 500Kbps RL = 3KΩ, CL = 1,000pF

Page 4

PINOUT

OUT

T1OUT T2OUT

R1IN

R1OUT

GND

OUT

T1OUT T2OUT

R2OUT

R1OUT

T2IN T1IN

V C

R2IN

T2IN T1IN

R1IN GND

V C

OUT

1 2 3 4 5

SP207EH

6 7 8 9

–

1 2 3 4 5 6

SP211EH

7 8

9 10 11

–

R2IN

R2OUT

T5IN

T5OUT

T4IN

T3IN

R3OUT

R3IN

–

R3IN

R3OUT

SHUTDOWN (SD)

R4IN

R4OUT

T4IN

T3IN

R5OUT

R5IN

– +

OUT

–

OUT

T1OUT

R2IN

R2OUT

T1IN

R1OUT

R1IN

GND

V C

OUT

T1OUT T2OUT

R2IN

R2OUT

T2IN T1IN

R1OUT

R1IN GND

V C

OUT

1 2 3 4 5

SP208EH

6 7 8 9

–

1 2 3 4 5 6

SP213EH

7 8

9 10 11

–

R3IN

R3OUT

T4IN

T4OUT

T3IN

T2IN

R4OUT

R4IN

–

R3IN

R3OUT

SHUTDOWN (SD)

R4IN

R4OUT

T4IN

T3IN

R5OUT

R5IN

–

– +

OUT

– +

Page 5

FEATURES

VCC = +5V

–5V –5V

+5V

Storage Capacitor

–

––

As in the original RS-232 multi-channel products, the SP207EH Series high speed multi-channel RS-232 line transceivers provide a variety of configurations to fit most designs, especially high speed applications where +12V is not available. The SP207EH Series is a superior high speed drop-in replacement to our previous versions as well as popular industry standards.

All devices in this series feature low-power CMOS construction and Sipex's proprietary on-board charge pump circuitry to generate the +10V RS-232 voltage levels. The ability to use 0.1µF charge pump capacitors saves board space and reduces production costs. The devices in this series provide different driver/receiver combinations to match any application requirement.

The SP211EH and SP213EH models feature a low–power shutdown mode, which reduces power supply drain to 1µA. The SP213EH includes a Wake-Up function which keeps two receivers active in the shutdown mode, unless disabled by the EN pin.

The family is available in 28–pin SO (wide) and SSOP (shrink) small outline packages. Devices can be specified for commercial (0°C to +70°C) and industrial/extended (–40°C to +85°C) operating temperatures.

THEORY OF OPERATION

The SP207EH Series devices are made up of three basic circuit blocks — 1) transmitter/ driver, 2) receiver and 3) the SIPEX–proprietary charge pump. Each model within the Series incorporates variations of these circuits to achieve the desired configuration and performance.

Charge–Pump

The charge pump is a Sipex–patented design (5,306,954) and uses a unique approach compared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 10V power supplies. Figure 3a shows the waveform found on the positive side of capacitor C2, and Figure 3b shows the negative side of capacitor C2. There is a free–running oscillator that controls the four phases of the voltage shifting. A description of each phase follows.

Phase 1

— VSS charge storage —During this phase of the clock cycle, the positive side of capacitors C and C2 are initially charged to +5V. C switched to ground and the charge in C transferred to C +5V, the voltage potential across capacitor C2 is

–

. Since C

is connected to

is then

–

now 10V.

Phase 2

— VSS transfer — Phase two of the clock connects the negative terminal of C2 to the V storage capacitor and the positive terminal of C to ground, and transfers the generated –l0V to C3. Simultaneously, the positive side of capacitor C 1 is switched to +5V and the negative side is connected to ground.

Phase 3

— VDD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –5V in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C voltage potential across C2 is l0V.

is at +5V, the

Figure 1. Charge Pump — Phase 1

Page 6

Figure 2. Charge Pump — Phase 2

VCC = +5V

––

–10V

–

Storage Capacitor

–

Storage Capacitor

Phase 4

— VDD transfer — The fourth phase of the clock connects the negative terminal of C2 to ground, and transfers the generated l0V across C2 to C4, the VDD storage capacitor. Again, simultaneously with this, the positive side of capacitor C1 is switched to +5V and the negative side is connected to ground, and the cycle begins again.

Since both V+ and V– are separately generated from VCC; in a no–load condition V+ and V– will be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design.

The clock rate for the charge pump typically operates at 15kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating.

Transmitter/Driver

The drivers of the SP207EH Series can maintain a typical data rate of 500Kbps. This superior RS-232 data transmission rate makes the SP207EH Series an ideal match for many

designs in personal computer peripherals and LAN applications that demand high speed performance.

The drivers are inverting transmitters, which accept either TTL or CMOS inputs and output the RS-232 signals with an inverted sense relative to the input logic levels. Typically, the RS-232 output voltage swing is +9V with no load, and +5V minimum with full load. The transmitter outputs are protected against infinite short–circuits to ground without degradation in reliability. The drivers of the SP211EH, and SP213EH can be tri–stated by using the SHUTDOWN function.

In the “power-off” state, the output impedance will remain greater than 300 ohms, again satisfying the RS-232 specifications. Should the input of the driver be left open, an internal 400Kohm pullup resistor to VCC forces the input high, thus committing the output to a low state. The slew rate of the transmitter output is internally limited to a maximum of 30V/µs in order to meet the EIA standards (EIA RS-232D 2.1.7, Paragraph 5). The transition of the loaded output from high to low also meets the monotonicity requirements of the standard.

+10V

a) C

GND GND

–

b) C

–10V

Figure 3. Charge Pump Waveforms

Page 7

VCC = +5V

+5V

Figure 4. Charge Pump — Phase 3

VCC = +5V

Figure 5. Charge Pump — Phase 4

–5V

––

–5V

+10V

––

Receivers

The high performance receivers of the SP207EH Series can accept input signals at a typical data

rate of 500Kbps. The receivers convert RS-232 input signals to inverted TTL signals. The receivers convert RS-232 input signals to inverted TTL signals. Since the input is usually from a transmission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 500mV. This ensures that the receiver is virtually immune to noisy transmission lines. Should an input be left unconnected, a 5kΩ pulldown resistor to ground will commit the output of the receiver to a high state.

SHUTDOWN MODE

The SP211EH, and SP213EH all feature a control input which will disable the device and reduce the power supply current to less than 10µA, making the parts ideal for battery– powered systems. In the “shutdown” mode the receivers and transmitters will both be tri–stated. The V+ output of the charge pump will discharge to VCC, and the V– output will discharge to ground. Products with the Wake-Up function can enable or disable the receivers during shutdown.

–

Storage Capacitor

–

Storage Capacitor

–

Storage Capacitor

–

Storage Capacitor

For complete shutdown to occur and the 10µA power drain to be realized, the following conditions must be met:

SP211EH:

• +5V must be applied to the SD pin

• ENABLE must be either 0V, +5.0V or not connected

• the transmitter inputs must be either +5.0V or not connected

• VCC must be +5V

• Receiver inputs must be >0V and <+5V

SP213EH:

• 0V must be applied to the SD pin

• ENABLE must be either 0V, +5.0V or not connected

• the transmitter inputs must be either +5.0V or not connected

• VCC must be +5V

• Receiver inputs must be >0V and <+5V

Page 8

ENABLE

The SP211EH and SP213EH all feature an enable input, which allows the receiver outputs to be either tri–stated or enabled. This can be especially useful when the receiver is tied directly to a microprocessor data bus. For the SP211EH, enable is active low; that is, 0V applied to the ENABLE pin will enable the receiver outputs. For the SP213EH, enable is active high; that is, +5V applied to the ENABLE pin will enable the receiver outputs.

SP213EH Only Power Receiver

SD EN SD EN Up/Down Outputs

0 0 1 1 Up Enable 0 1 1 0 Up Tri–state 1 0 0 1 Down Enable 1 1 0 0 Down Tri–state

Table 2. Wake–Up Truth Table

POWER UP WITH SD ACTIVE (Charge pump in shutdown mode)

0 (POWERUP)

+5V

OUT

DATA VALID

WAIT

ENABLE

SD DISABLE

POWER UP WITH SD DISABLED (Charge pump in active mode)

0 (POWERUP)

+5V

OUT

DATA VALID

ENABLE

SD DISABLE

EXERCISING WAKE–UP FEATURE

0 (POWERUP)

+5V

OUT

DATA VALID DATA VALID DATA VALID

ENABLE

= +5V ±10%; TA = 25°C

WAIT

ENABLE

Figure 6. Wake–Up Timing

DISABLE DISABLEENABLE

WAIT

= 2ms typical, 3ms maximum

= 1ms typical, 2ms maximum

Page 9

WAKEUP FUNCTION

The SP213EH has a wake–up feature that keeps two receivers (R4 and R5) in an enabled state when the device is in the shutdown mode. With only the receivers active during shutdown, the devices draw 5–10µA of supply current.

A typical application of this function would be where a modem is interfaced to a computer in a power–down mode. The ring indicator signal from the modem could be passed through an active receiver in the SP213EH that is itself in the shutdown mode. The ring indicator signal would propagate through the SP213EH to the power management circuitry of the computer to power up the microprocessor and the SP213EH drivers. After the supply voltage to the SP213EH reaches +5.0V, the SHUTDOWN pin can be disabled, taking the SP213EH out of the shutdown mode.

All receivers that are active during shutdown maintain 500mV (typical) of hysteresis.

ESD TOLERANCE

The SP207EH Family incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least +15kV without damage nor latch-up.

There are different methods of ESD testing applied:

a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge

c) IEC1000-4-2 Direct Contact

The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 7. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently.

The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 8. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method.

SW1

SW1SW1

DC Power Source

Figure 7. ESD Test Circuit for Human Body Model

SW2

SW2SW2

Device Under Test

Page 10

Contact-Discharge Module

Contact-Discharge ModuleContact-Discharge Module

SW1

SW1SW1

DC Power Source

Figure 8. ESD Test Circuit for IEC1000-4-2

With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.

RS and RV add up to 330Ω for IEC1000-4-2.

andand RR

S S

i ➙

30A

15A

Figure 9. ESD Test Waveform for IEC1000-4-2

SW2

SW2SW2

add up to 330add up to 330ΩΩ f for IEC1000-4-2.or IEC1000-4-2.

V V

t=0ns t=30ns

t ➙

Device Under Test

The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly discharged to the equipment from a person already holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.

The circuit model in Figures 7 and 8 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage.

Page 11

For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are

1.5kΩ an 100pF, respectively. For IEC-1000-4-2, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively.

EIA STANDARDS

The Electronic Industry Association (EIA) developed several standards of data transmission which are revised and updated in order to meet the requirements of the industry. In data

processing, there are two basic means of The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2

communicating between systems and components.

The RS-232 standard was first introduced in

1962 and, since that time, has become an

industry standard. is switched on. The lower current limiting resistor increases the current charge onto the test point.

The RS-232 is a relatively slow data exchange

protocol, with a maximum baud rate of only

20kbps, which can be transmitted over a

maximum copper wire cable length of 50 feet.

The SP207EH through SP213EH Series of data

communications interface products have been

designed to meet both the EIA protocol

standards, and the needs of the industry.

DEVICE PIN HUMAN BODY IEC1000-4-2 TESTED MODEL Air Discharge Direct Contact Level

Driver Outputs +15kV +15kV +8kV 4 Receiver Inputs

Table 3. Transceiver ESD Tolerance Levels

Specification RS–232D RS–423A RS–422 RS–485 RS–562

Mode of Operation Single–Ended Single–Ended Differential Differential Single–Ended No. of Drivers and Receivers 1 Driver 1 Driver 1 Driver 32 Drivers 1 Driver

Allowed on One Line 1 Receiver 10 Receivers 10 Receivers 32 Receivers 1 Receiver Maximum Cable Length 50 feet 4,000 feet 4,000 feet 4,000 feet C ≤ 2,500pF @ <20Kbps;

Maximum Data Rate 20Kb/s 100Kb/s 10Mb/s 10Mb/s 64Kb/s Driver output Maximum Voltage ±25V ±6V –0.25V to +6V –7V to +12V –3.7V to +13.2V Driver Output Signal Level

Loaded ±5V ±3.6V ±2V ±1.5V ±3.7V

Unloaded ±15V ±6V ±5V ±5V ±13.2V Driver Load Impedance 3 – 7Kohm 450 ohm 100 ohm 54 ohm 3–7Kohm Max. Driver Output Current

(High Impedance State)

Power On ±100µA

Power Off V Slew Rate 30V/µs max. Controls Provided 30V/µs max. Receiver Input Voltage Range ±15V ±12V –7V to +7V –7V to +12V ±15V Receiver Input Sensitivity ±3V ±200mV ±200mV ±200mV ±3V Receiver Input Resistance 3–7Kohm 4Kohm min. 4Kohm min. 12Kohm min. 3–7Kohm

Table 4. EIA Standard Definitions

+15kV +15kV +8kV 4

C ≤1,000pF @ >20Kbps

/300 100µA ±100µA ±100µA

MAX

Page 12

TYPICAL APPLICATION CIRCUITS...SP207EH TO SP213EH

+5V INPUT

0.1µF

6.3V

TTL/CMOS INPUTS

TTL/CMOS OUTPUTS

+5V INPUT

0.1µF

6.3V

TTL/CMOS INPUTS

TTL/CMOS OUTPUTS

–

SP207EH

400KOHM

5KOHM

0.1µF

6.3V

12 13

0.1µF 16V

T1 IN

T2 IN

T3 IN

T4 IN

T5 IN

OUT R1 IN

R2 OUT R2 IN

R3 OUT R3 IN

0.1µF 16V

–

GND

–

SP211EH

400KOHM

5KOHM

0.1µF

6.3V

14 15

0.1µF 16V

T1 IN

T2 IN

T3 IN

T4 IN

OUT R1 IN

R2 OUT R2 IN

26 27

OUT R3 IN

22 23

R4 OUT R4IN

19 18

R5 OUT R5 IN

–

GND

0.1µF

6.3V

OUT

RS-232 INPUTS

0.1µF

6.3V

0.1µF 16V +

OUT

RS-232 OUTPUTS

RS-232 INPUTS

+5V INPUT

0.1µF

6.3V

0.1µF 16V

T1 IN

T2 IN

T3 IN

TTL/CMOS INPUTS

T4 IN

OUT R1 IN

R2 OUT R2 IN

OUT R3 IN

OUT R4 IN

TTL/CMOS OUTPUTS

+5V INPUT

0.1µF

6.3V

0.1µF 16V

TTL/CMOS INPUTS

R2 OUT R2 IN

R4 OUT* R4IN*

TTL/CMOS OUTPUTS

R5 OUT* R5 IN*

*Receivers active during shutdown

–

SP208EH

400KOHM

5KOHM

12 13

22 23

17 16

0.1µF

6.3V

0.1µF 16V

–

OUT

RS-232 INPUTS

5KOHM

GND

14 15

T1 IN

T2 IN

T3 IN

T4 IN

OUT R1 IN

26 27

OUT R3 IN

22 23

19 18 24

–

SP213EH

–

400KOHM

5KOHM

0.1µF

6.3V

0.1µF 16V

–

OUT

GND

RS-232 OUTPUTS

RS-232 INPUTS

Page 13

PACKAGE: PLASTIC SHRINK

SMALL OUTLINE (SSOP)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

24–PIN

0.068/0.078 (1.73/1.99)

0.002/0.008 (0.05/0.21)

0.010/0.015 (0.25/0.38)

0.317/0.328 (8.07/8.33)

0.205/0.212 (5.20/5.38)

0.0256 BSC (0.65 BSC)

0.301/0.311 (7.65/7.90)

0.022/0.037 (0.55/0.95)

0°/8°

(0°/8°)

28–PIN

0.068/0.078 (1.73/1.99)

0.002/0.008 (0.05/0.21)

0.010/0.015 (0.25/0.38)

0.397/0.407

(10.07/10.33)

0.205/0.212 (5.20/5.38)

0.0256 BSC

(0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

Page 14

PACKAGE: PLASTIC

SMALL OUTLINE (SOIC) (WIDE)

DIMENSIONS (Inches)

Minimum/Maximum

(mm) A

24–PIN

0.093/0.104

(2.352/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.599/0.614

(15.20/15.59)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

28–PIN

0.093/0.104

(2.352/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.697/0.713

(17.70/18.09)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

Page 15

D1 = 0.005" min.

(0.127 min.)

e = 0.100 BSC

(2.540 BSC)

ALTERNATE

END PINS

(BOTH ENDS)

PACKAGE: PLASTIC

DUAL–IN–LINE (NARROW)

A1 = 0.015" min.

(0.381min.)

A = 0.210" max.

(5.334 max).

eA = 0.300 BSC

(7.620 BSC)

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

24–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

1.230/1.280

(31.24/32.51)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

Page 16

ORDERING INFORMATION

RS232 Transceivers:

Model .................... Drivers .......................... Receivers..................................... Temperature Range .................................Package Type

SP207EHCA .............. 5 ....................................... 3................................................... 0°C to +70°C ............................................... 24–pin SSOP

SP207EHCP .............. 5 ....................................... 3 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP

SP207EHCT............... 5 ....................................... 3................................................... 0°C to +70°C ................................................ 24–pin SOIC

SP207EHEA .............. 5 ....................................... 3 ............................................... –40°C to +85°C ............................................... 24–pin SSOP

SP207EHEP............... 5 ....................................... 3............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP

SP207EHET ............... 5 ....................................... 3 ............................................... –40°C to +85°C ................................................ 24–pin SOIC

SP208EHCA .............. 4 ....................................... 4................................................... 0°C to +70°C ............................................... 24–pin SSOP

SP208EHCP .............. 4 ....................................... 4 ................................................... 0°C to +70°C ....................................... 24–pin Plastic DIP

SP208EHCT............... 4 ....................................... 4................................................... 0°C to +70°C ................................................ 24–pin SOIC

SP208EHEA .............. 4 ....................................... 4 ............................................... –40°C to +85°C ............................................... 24–pin SSOP

SP208EHEP............... 4 ....................................... 4............................................... –40°C to +85°C ....................................... 24–pin Plastic DIP

SP208EHET ............... 4 ....................................... 4 ............................................... –40°C to +85°C ................................................ 24–pin SOIC

RS232 Transceivers with Low–Power Shutdown and Tri–state Enable:

Model .................... Drivers .......................... Receivers..................................... Temperature Range .................................Package Type

SP211EHCA .............. 4 ....................................... 5................................................... 0°C to +70°C ............................................... 28–pin SSOP

SP211EHCT............... 4 ....................................... 5................................................... 0°C to +70°C ................................................ 28–pin SOIC

SP211EHEA .............. 4 ....................................... 5 ............................................... –40°C to +85°C ............................................... 28–pin SSOP

SP211EHET ............... 4 ....................................... 5 ............................................... –40°C to +85°C ................................................ 28–pin SOIC

RS232 Transceivers with Low–Power Shutdown, Tri–state Enable, and Wake–Up Function:

Model .................... Drivers .......................... Receivers..................................... Temperature Range .................................Package Type

SP213EHCA .............. 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ............................................... 28–pin SSOP

SP213EHCT............... 4 ................. 5, with 2 active in Shutdown ............................ 0°C to +70°C ................................................ 28–pin SOIC

SP213EHEA .............. 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ............................................... 28–pin SSOP

SP213EHET ............... 4 ................. 5, with 2 active in Shutdown ........................ –40°C to +85°C ................................................ 28–pin SOIC

Please consult the factory for pricing and availability on a Tape-On-Reel option.

Corporation

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation Headquarters and

Sales Office

22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com

Sales Office

233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.

Datasheet SP208EHCA, SP208EHCP, SP207EHCA, SP207EHCP, SP207EHCT Datasheet (Sipex Corporation)

Specifications and Main Features

Frequently Asked Questions

User Manual