Datasheet SP202ECN, SP202ECP, SP202ECT, SP202EEN, SP202EEP Datasheet (Sipex Corporation)

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Page 1

SP202E/232E/233E/310E/312E

■ Operates from Single +5V Power Supply

■ Meets All RS-232D and ITU V.28

Specifications

■ Operates with 0.1µF to 10µF Capacitors

■ High Data Rate – 120Kbps Under Load

■ Low Power Shutdown ≤1µA (Typical)

■ 3-State TTL/CMOS Receiver Outputs

■ Low Power CMOS – 3mA Operation

■ Improved ESD Specifications:

±15kV Human Body Model ±15kV IEC1000-4-2 Air Discharge ±8kV IEC1000-4-2 Contact Discharge

High-Performance RS-232

Line Drivers/Receivers

DESCRIPTION…

The SP202E/232E/233E/310E/312E devices are a family of line driver and receiver pairs that meet the specifications of RS-232 and V.28 serial protocols with enhanced ESD performance. The ESD tolerance has been improved on these devices to over ±15KV for both Human Body Model and IEC1000-4-2 Air Discharge Method. These devices are pin-to-pin compatible with Sipex's SP232A/233A/310A/312A devices as well as popular industry standards. As with the initial versions, the SP202E/232E/233E/310E/312E devices feature at least 120Kbps data rate under load, 0.1µF charge pump capacitors, and overall ruggedness for commercial applications. This family also features Sipex's BiCMOS design allowing low power operation without sacrificing performance. The series is available in plastic and ceramic DIP and SOIC packages operating over the commercial, industrial and military temperature ranges.

Model Drivers Receivers Active in Shutdown 0.1µF Capacitors Shutdown WakeUp TTL Tri–State

SP202E 22 0 4 NoNoNo SP232E 22 0 4 NoNoNo SP233E 22 0 0 NoNoNo SP310E 2 2 0 4 Yes No Yes SP312E 2 2 2 4 Yes Yes Yes

Number of RS232 No. of Receivers No. of External

Page 2

ABSOLUTE MAXIMUM RATINGS

This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.

.................................................................................................................................................................

cc +

....................................................................................................................

............................................................................................................................................................

Input Voltages

.........................................................................................................................

............................................................................................................................................................

Output Voltages

....................................................................................................

OUT

................................................................................................................

OUT

Short Circuit Duration

.........................................................................................................................................

OUT

Power Dissipation

CERDIP .............................................................................. 675mW

(derate 9.5mW/°C above +70°C)

Plastic DIP .......................................................................... 375mW

(derate 7mW/°C above +70°C)

Small Outline ...................................................................... 375mW

(derate 7mW/°C above +70°C)

(Vcc-0.3V) to +11.0V

-0.3 to (Vcc +0.3V)

(V+, +0.3V) to (V-, -0.3V)

-0.3V to (Vcc +0.3V)

+6V

-11.0V

±15V

Continuous

SPECIFICATIONS

VCC=+5V±10%; V+=+8.5V to +13.2V (SP231A only) 0.1µF charge pump capacitors; T

PARAMETERS MIN. TYP. MAX. UNITS CONDITIONS TTL INPUT

Logic Threshold

LOW 0.8 Volts TIN ; EN, SD HIGH 2.0 Volts TIN ; EN, SD

Logic Pull-Up Current 15 200 µATIN = 0V

TTL OUTPUT

TTL/CMOS Output

Voltage, Low 0.4 Volts I Voltage, High 3.5 Volts I

Leakage Current **; TA = +25° 0.05 ±10 µA EN = VCC, 0V≤V

RS-232 OUTPUT

Output Voltage Swing ±5 ±9 Volts All transmitter outputs loaded Output Resistance 300 Ohms VCC = 0V; V

Output Short Circuit Current ±18 mA Infinite duration Maximum Data Rate 120 240 Kbps CL = 2500pF, RL= 3kΩ

RS-232 INPUT

Voltage Range -15 +15 Volts Voltage Threshold

LOW 0.8 1.2 Volts VCC = 5V, TA = +25°C

HIGH 1.7 2.8 Volts VCC = 5V, TA = +25°C Hysteresis 0.2 0.5 1.0 Volts VCC = 5V, TA = +25°C Resistance 3 5 7 kΩ

to T

unless otherwise noted.

MIN

MAX

= 3.2mA; Vcc = +5V

OUT

= -1.0mA

OUT

with 3kΩ to Ground

= ±2V

OUT

TA = +25°C, -15V ≤ V

≤V

≤ +15V

DYNAMIC CHARACTERISTICS

Driver Propagation Delay 1.5 3.0 µs TTL to RS-232; CL = 50pF Receiver Propagation Delay 0.1 1.0 µs RS-232 to TTL Instantaneous Slew Rate 30 V/µsCL = 10pF, RL= 3-7kΩ;

TA =+25°C

Transition Region Slew Rate 10 V/µsCL = 2500pF, RL= 3kΩ;

measured from +3V to -3V

or -3V to +3V Output Enable Time ** 400 ns SP310E and SP312E only Output Disable Time ** 250 ns SP310E and SP312E only

POWER REQUIREMENTS

VCC Power Supply Current 3 5 mA No load, TA= +25°C; VCC = 5V

15 mA All transmitters RL = 3kΩ;

TA = +25°C Shutdown Supply Current ** 1 5 µAVCC = 5V, TA = +25°C

**SP310E and SP312E only

Page 3

= 25°C

Load current = 0mA

7.2

7.4

7.6

7.8

8.0

8.2

8.4

= 6V

-10

-11

VOH (Volts)

= 6V

= 5V

ICC (mA)

= 5V

= 4V

V+ (Volts)

= 4V

= 6V

= 5V

-5

-6

-7

-8

-9

V– Voltage (Volts)

= 4V

7.0

-4

= 3V

(Volts)

4.5 4.75 5.0 5.25 5.5

6.8

Temperature (°C)

-55 -40 0 25 70 85 125

25 30 35 40

Load Current (mA)

0 5 10 15 20

Load Current (mA)

02468101214

-3

PERFORMANCE CURVES

VCCGND

16151413121110

V+

VCCGND

16151413121110

V+

PINOUT…

OUT

SP232E

OUT

SP202E

OUT

SHDN

GND

T1OUT

R1IN

R1OUT

N.C.

T1IN

T2IN

N.C.

201918171615141312

OUT

SP310E_A/312E_A

C1+

V+

C1-

C2+

C2-

V-

N.C./EN

OUT

V-

OUT

R 201918171615141312

OUT

V-

V+

SP233ECP

OUT

V-

OUT

R2OUT

OUT

2IN

2OUT

V-

OUT

GND

2-C2+C1–C1+C2+C2–

201918171615141312

SP233ECT

T2OUT

8 +

R2IN

V-

GND

R2OUT

C 11

OUT

VCCGND

SHUTDOWN

20-PIN SSOP

181716151413121110

SP312E

V+

VCCGND

1OUT

ON/OFF

20-PIN PLASTIC DIP

181716151413121110

SP310E

V+

C1+

OUT

1INR1OUT

7 V-

1INT2IN

V-

OUT

2OUT

OUT

2OUT

* N.C. for SP310E_A, EN for SP312E_A

20-PIN SOIC

2INT1IN

1OUT

GND

1IN

V–

V+

GND

Page 4

FEATURES…

The SP202E/232E/233E/310E/312E devices are a family of line driver and receiver pairs that meet the specifications of RS-232 and V.28 serial protocols with enhanced ESD performance. The ESD tolerance has been improved on these devices to over ±15KV for both Human Body Model and IEC1000-4-2 Air Discharge Method. These devices are pin-to-pin compatible with Sipex's 232A/233A/310A/312A devices as well as popular industry standards. As with the initial versions, the SP202E/232E/ 233E/310E/312E devices feature10V/µs slew rate, 120Kbps data rate under load, 0.1µF charge pump capacitors, overall ruggedness for commercial applications, and increased drive current for longer and more flexible cable configurations. This family also features Sipex's BiCMOS design allowing low power operation without sacrificing performance.

The SP202E/232E/233E/310E/312E devices have internal charge pump voltage converters which allow them to operate from a single +5V supply. The charge pumps will operate with polarized or non-polarized capacitors ranging from 0.1 to 10 µF and will generate the ±10V needed to generate the RS-232 output levels. Both meet all EIA RS-232 and ITU V.28 specifications.

The SP310E provides identical features as the SP232E with a single control line which simultaneously shuts down the internal DC/DC converter and puts all transmitter and receiver outputs into a high impedance state. The SP312E is identical to the SP310E with separate tri-state and shutdown control lines.

THEORY OF OPERATION

The SP232E, SP233E, SP310E and SP312E devices are made up of three basic circuit blocks –

1) a driver/transmitter, 2) a receiver and 3) a charge pump. Each block is described below.

Driver/Transmitter

The drivers are inverting transmitters, which accept TTL or CMOS inputs and output the RS-232 signals with an inverted sense relative to the input logic levels. Typically the RS-232 output voltage swing is ±9V. Even under worst case loading conditions of 3kOhms and 2500pF, the output is guaranteed to be ±5V, which is consistent with the RS-232 standard specifications. The transmitter outputs are protected against infinite short-circuits to ground without degradation in reliability.

+5V INPUT

10 F 6.3V

C +

C -

C +

C -

SP202E SP232E

+5V to +10V

Voltage Doubler

+10V to -10V

Voltage Inverter

400k

Ω

400k

Ω

15GND

0.1 F 6.3V

V+

V-

Ω

0.1 F

16V

T OUT

RS-232 OUTPUTS

R INR OUT

RS-232 INPUTS

0.1 F

6.3V

3 4

0.1 F

16V

T IN

TTL/CMOS INPUTS

12 13

TTL/CMOS OUTPUTS

*The negative terminal of the V+ storage capacitor can be tied

or GND. Connecting the capacitor to VCC (+5V)

to either V

is recommended.

Figure 1. Typical Circuit using the SP202E or SP232E.

Page 5

+5V INPUT

400k

T IN

TTL/CMOS INPUTS

20 19

TTL/CMOS OUTPUTS

Do not make

connection to

these pins

Internal

-10V Power 17

Supply

Internal

+10V Power

Supply

Ω

400k

Ω

C +

C -

VV-

SP233ECP

V+

GND

Ω

GND

T OUT

RS-232 OUTPUTS

R INR OUT

RS-232 INPUTS

C +

C -

Figure 2. Typical Circuits using the SP233ECP and SP233ECT

The instantaneous slew rate of the transmitter output is internally limited to a maximum of 30V/ µs in order to meet the standards [EIA RS-232-D

2.1.7, Paragraph (5)]. However, the transition region slew rate of these enhanced products is typically 10V/µs. The smooth transition of the loaded output from VOL to VOH clearly meets the monotonicity requirements of the standard [EIA RS-232-D 2.1.7, Paragraphs (1) & (2)].

Receivers

The receivers convert RS-232 input signals to inverted TTL signals. Since the input is usually from a transmission line, where long cable lengths

400k

Ω

T IN

400k

Ω

T IN

TTL/CMOS INPUTS

TTL/CMOS OUTPUTS

Do not make

connection to

these pins

Internal

-10V Power Supply

Internal

+10V Power

Supply

20 19

C +

C -

V-

SP233ECT

V+

GND

T OUT

Ω

C + C + C C -

T OUT

RS-232 OUTPUTS

R INR OUT

RS-232 INPUTS

and system interference can degrade the signal, the inputs have a typical hysteresis margin of 500mV. This ensures that the receiver is virtually immune to noisy transmission lines.

The input thresholds are 0.8V minimum and 2.4V maximum, again well within the ±3V RS-232 requirements. The receiver inputs are also protected against voltages up to ±15V. Should an input be left unconnected, a 5KOhm pulldown resistor to ground will commit the output of the receiver to a high state.

+5V INPUT

10 F 6.3V

C +

C -

C +

C -

+5V to +10V

Voltage Doubler

+10V to -10V

Voltage Inverter

400k

Ω

400k

Ω

SP310E

16GND

V+

V-

Ω

0.1 F

6.3V

4 5

0.1 F

16V

T IN

TTL/CMOS INPUTS

13 14

10 9

TTL/CMOS OUTPUTS

*The negative terminal of the V+ storage capacitor can be tied to either VCC or GND. Connecting the capacitor to VCC (+5V) is recommended.

0.1 µF 16V

0.1 F

0.1 µF 16V

T OUT

RS-232 OUTPUTS

R INR OUT

RS-232 INPUTS

ON/OFF

6.3V

0.1 F

16V

T IN

TTL/CMOS INPUTS

TTL/CMOS OUTPUTS

*The negative terminal of the V+ storage capacitor can be tied to either V is recommended.

+5V INPUT

10 F 6.3V

C +

C -

C +

C -

+5V to +10V

Voltage Doubler

+10V to -10V

Voltage Inverter

400k

Ω

400k

Ω

SP312E

16GND

V+

V-

Ω

4 5

or GND. Connecting the capacitor to VCC (+5V)

0.1 F 16V

0.1 F

16V

T OUT

R INR OUT

SHUTDOWN

RS-232 OUTPUTS

RS-232 INPUTS

Figure 3. Typical Circuits using the SP310E and SP312E

Page 6

VCC = +5V

Figure 4. Charge Pump — Phase 1

–5V –5V

In actual system applications, it is quite possible for signals to be applied to the receiver inputs before power is applied to the receiver circuitry. This occurs, for example, when a PC user attempts to print, only to realize the printer wasn’t turned on. In this case an RS-232 signal from the PC will appear on the receiver input at the printer. When the printer power is turned on, the receiver will operate normally. All of these enhanced devices are fully protected.

Charge Pump

The charge pump is a Sipex–patented design (5,306,954) and uses a unique approach compared to older less–efficient designs. The charge pump still requires four external capacitors, but uses a four–phase voltage shifting technique to attain symmetrical 10V power supplies. There is a free–running oscillator that controls the four phases of the voltage shifting. A description of each phase follows.

Phase 1

— VSS charge storage —During this phase of the clock cycle, the positive side of capacitors C1 and C2 are initially charged to +5V. C then switched to ground and the charge in C transferred to C +5V, the voltage potential across capacitor C2 is

–

. Since C

is connected to

–

now 10V.

–

Storage Capacitor

–

Storage Capacitor

+5V

––

Phase 2

— VSS transfer — Phase two of the clock connects the negative terminal of C2 to the V storage capacitor and the positive terminal of C to ground, and transfers the generated –l0V to C3. Simultaneously, the positive side of capacitor C 1 is switched to +5V and the negative side is connected to ground.

Phase 3

— VDD charge storage — The third phase of the clock is identical to the first phase — the charge transferred in C1 produces –5V in the negative terminal of C1, which is applied to the negative side of capacitor C2. Since C voltage potential across C2 is l0V.

Phase 4

— VDD transfer — The fourth phase of the clock connects the negative terminal of C2 to ground, and transfers the generated l0V across C2 to C4, the VDD storage capacitor. Again, simultaneously with this, the positive side of capacitor C1 is switched to +5V and the negative side is connected to ground, and the cycle begins again.

Since both V+ and V– are separately generated from VCC; in a no–load condition V+ and V– will

is at +5V, the

VCC = +5V

–

Storage Capacitor

Figure 5. Charge Pump — Phase 2

––

–10V

–

Storage Capacitor

Page 7

+10V

a) C

GND GND

–

b) C

–10V

Figure 6. Charge Pump Waveforms

be symmetrical. Older charge pump approaches that generate V– from V+ will show a decrease in the magnitude of V– compared to V+ due to the inherent inefficiencies in the design.

The clock rate for the charge pump typically operates at 15kHz. The external capacitors can be as low as 0.1µF with a 16V breakdown voltage rating.

VCC = +5V

+5V

Figure 7. Charge Pump — Phase 3

VCC = +5V

–5V

––

–5V

+10V

––

Shutdown (SD) and Enable (EN) for the SP310E and SP312E

Both the SP310E and SP312E have a shutdown/ standby mode to conserve power in battery-powered systems. To activate the shutdown mode, which stops the operation of the charge pump, a logic “0” is applied to the appropriate control line. For the SP310E, this control line is ON/OFF (pin

18). Activating the shutdown mode also puts the

–

Storage Capacitor

–

Storage Capacitor

–

Storage Capacitor

–

Storage Capacitor

Figure 8. Charge Pump — Phase 4

Page 8

SP310E transmitter and receiver outputs in a high impedance condition (tri-stated). The shutdown mode is controlled on the SP312E by a logic “0” on the SHUTDOWN control line (pin 18); this also puts the transmitter outputs in a tri–state mode. The receiver outputs can be tri–stated separately during normal operation or shutdown by a logic “1” on the ENABLE line (pin 1).

Wake–Up Feature for the SP312E

The SP312E has a wake–up feature that keeps all the receivers in an enabled state when the device is in the shutdown mode. Table 1 defines the truth table for the wake–up function.

Pin Strapping for the SP233ECT

The SP233E packaged in the 20–pin SOIC package (SP233ECT) has a slightly different pinout than the SP233E in other package configurations. To operate properly, the following pairs of pins must be externally wired together:

the two V– pins (pins 10 and 17) the two C2+ pins (pins 12 and 15) the two C2– pins (pins 11 and 16)

All other connections, features, functions and performance are identical to the SP233E as specified elsewhere in this data sheet.

With only the receivers activated, the SP312E typically draws less than 5µA supply current. In the case of a modem interfaced to a computer in power down mode, the Ring Indicator (RI) signal from the modem would be used to "wake up" the computer, allowing it to accept data transmission.

After the ring indicator signal has propagated through the SP312E receiver, it can be used to trigger the power management circuitry of the computer to power up the microprocessor, and bring the SD pin of the SP312E to a logic high, taking it out of the shutdown mode. The receiver propagation delay is typically 1µs. The enable time for V+ and V– is typically 2ms. After V+ and V– have settled to their final values, a signal can be sent back to the modem on the data terminal ready (DTR) pin signifying that the computer is ready to accept and transmit data.

Power

SD EN

0 0 1 1

Table 1. Wake-up Function Truth Table.

0 1 0 1

Up/Down

Down Down

Up Up

Receiver

Outputs

Enable

Tri–state

Enable

Tri–state

ESD TOLERANCE

The SP202E/232E/233E/310E/312E devices incorporates ruggedized ESD cells on all driver output and receiver input pins. The ESD structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. The improved ESD tolerance is at least ±15KV without damage nor latch-up.

There are different methods of ESD testing applied:

a) MIL-STD-883, Method 3015.7 b) IEC1000-4-2 Air-Discharge c) IEC1000-4-2 Direct Contact

The Human Body Model has been the generally accepted ESD testing method for semiconductors. This method is also specified in MIL-STD-883, Method 3015.7 for ESD testing. The premise of this ESD test is to simulate the human body’s potential to store electro-static energy and discharge it to an integrated circuit. The simulation is performed by using a test model as shown in Figure 9. This method will test the IC’s capability to withstand an ESD transient during normal handling such as in manufacturing areas where the ICs tend to be handled frequently.

The IEC-1000-4-2, formerly IEC801-2, is generally used for testing ESD on equipment and systems. For system manufacturers, they must guarantee a certain amount of ESD protection since the system itself is exposed to the outside environment and human presence. The premise

Page 9

SW1

SW1SW1

DC Power Source

Figure 9. ESD Test Circuit for Human Body Model

with IEC1000-4-2 is that the system is required to withstand an amount of static electricity when ESD is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. The transceiver IC receives most of the ESD current when the ESD source is applied to the connector pins. The test circuit for IEC1000-4-2 is shown on Figure 10. There are two methods within IEC1000-4-2, the Air Discharge method and the Contact Discharge method.

SW2

SW2SW2

Device Under Test

With the Air Discharge Method, an ESD voltage is applied to the equipment under test (EUT) through air. This simulates an electrically charged person ready to connect a cable onto the rear of the system only to find an unpleasant zap just before the person touches the back panel. The high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. This energy, whether discharged directly or through air, is predominantly a function of the

Contact-Discharge Module

Contact-Discharge ModuleContact-Discharge Module

SW1

SW1SW1

DC Power Source

Figure 10. ESD Test Circuit for IEC1000-4-2

RS and RV add up to 330Ω for IEC1000-4-2.

andand RR

S S

SW2

SW2SW2

add up to 330add up to 330ΩΩ f for IEC1000-4-2.or IEC1000-4-2.

V V

Device Under Test

Page 10

30A

discharged to the equipment from a person already

i ➙

holding the equipment. The current is transferred on to the keypad or the serial port of the equipment directly and then travels through the PCB and finally to the IC.

15A

t=0ns t=30ns

t ➙

Figure 11. ESD Test Waveform for IEC1000-4-2

discharge current rather than the discharge voltage. Variables with an air discharge such as approach speed of the object carrying the ESD potential to the system and humidity will tend to change the discharge current. For example, the rise time of the discharge current varies with the approach speed.

The Contact Discharge Method applies the ESD current directly to the EUT. This method was devised to reduce the unpredictability of the ESD arc. The discharge current rise time is constant since the energy is directly transferred without the air-gap arc. In situations such as hand held systems, the ESD charge can be directly

The circuit models in Figures 9 and 10 represent the typical ESD testing circuit used for all three methods. The CS is initially charged with the DC power supply when the first switch (SW1) is on. Now that the capacitor is charged, the second switch (SW2) is on while SW1 switches off. The voltage stored in the capacitor is then applied through RS, the current limiting resistor, onto the device under test (DUT). In ESD tests, the SW2 switch is pulsed so that the device under test receives a duration of voltage.

For the Human Body Model, the current limiting resistor (RS) and the source capacitor (CS) are

1.5kΩ an 100pF, respectively. For IEC-1000-42, the current limiting resistor (RS) and the source capacitor (CS) are 330Ω an 150pF, respectively.

The higher CS value and lower RS value in the IEC1000-4-2 model are more stringent than the Human Body Model. The larger storage capacitor injects a higher voltage to the test point when SW2 is switched on. The lower current limiting resistor increases the current charge onto the test point.

SP202E HUMAN BODY IEC1000-4-2 Family MODEL Air Discharge Direct Contact Level

Driver Outputs ±15kV ±15kV ±8kV 4 Receiver Inputs ±15kV ±15kV ±8kV 4

Table 2. Transceiver ESD Tolerance Levels

Page 11

DIMENSIONS (Inches)

Minimum/Maximum

(mm) A

14–PIN

0.090/0.104

(2.29/2.649))

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.348/0.363 (8.83/9.22)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

PACKAGE: PLASTIC

16–PIN

0.090/0.104

(2.29/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.398/0.413

(10.10/10.49)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

18–PIN

0.090/0.104

(2.29/2.649))

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.447/0.463

(11.35/11.74)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

(0.102/0.300)

(0.330/0.508)

(12.60/13.00)

(7.402/7.600)

(1.270 BSC))

(10.00/10.64)

(0.406/1.270)

SMALL OUTLINE (SOIC)

20–PIN

0.090/0.104

(2.29/2.649)

0.004/0.012

0.013/0.020

0.496/0.512

0.291/0.299

0.050 BSC

0.394/0.419

0.016/0.050

0°/8°

(0°/8°)

24–PIN

0.090/0.104 (2.29/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.599/0.614

(15.20/15.59)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

28–PIN

0.090/0.104

(2.29/2.649)

0.004/0.012

(0.102/0.300)

0.013/0.020

(0.330/0.508)

0.697/0.713

(17.70/18.09)

0.291/0.299

(7.402/7.600)

0.050 BSC

(1.270 BSC)

0.394/0.419

(10.00/10.64)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

Page 12

DIMENSIONS (Inches)

Minimum/Maximum

(mm)

8–PIN

0.053/0.069

(1.346/1.748)

0.004/0.010

(0.102/0.249

0.014/0.019 (0.35/0.49)

0.189/0.197 (4.80/5.00)

0.150/0.157

(3.802/3.988)

0.050 BSC

(1.270 BSC)

0.228/0.244

(5.801/6.198)

0.010/0.020

(0.254/0.498)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

PACKAGE: PLASTIC

h x 45°

14–PIN

0.053/0.069

(1.346/1.748)

0.004/0.010

(0.102/0.249)

0.013/0.020

(0.330/0.508)

0.337/0.344

(8.552/8.748)

0.150/0.157

(3.802/3.988)

0.050 BSC

(1.270 BSC)

0.228/0.244

(5.801/6.198)

0.010/0.020

(0.254/0.498)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

16–PIN

0.053/0.069

(1.346/1.748)

0.004/0.010

(0.102/0.249)

0.013/0.020

(0.330/0.508)

0.386/0.394

(9.802/10.000)

0.150/0.157

(3.802/3.988)

0.050 BSC

(1.270 BSC)

0.228/0.244

(5.801/6.198)

0.010/0.020

(0.254/0.498)

0.016/0.050

(0.406/1.270)

0°/8°

(0°/8°)

SMALL OUTLINE (SOIC) (NARROW)

Page 13

PACKAGE: PLASTIC SHRINK

SMALL OUTLINE (SSOP)

DIMENSIONS (Inches)

Minimum/Maximum

(mm) A

20–PIN

0.068/0.078 (1.73/1.99)

0.002/0.008 (0.05/0.21)

0.010/0.015 (0.25/0.38)

0.278/0.289 (7.07/7.33)

0.205/0.212 (5.20/5.38)

0.0260 BSC (0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

24–PIN

0.068/0.078 (1.73/1.99)

0.002/0.008 (0.05/0.21)

0.010/0.015 (0.25/0.38)

0.317/0.328 (8.07/8.33)

0.205/0.212 (5.20/5.38)

0.0256 BSC (0.65 BSC)

0.301/0.311

(7.65/7.90)

0.022/0.037

(0.55/0.95)

0°/8°

(0°/8°)

28–PIN

0.068/0.078 (1.73/1.99)

0.002/0.008 (0.05/0.21)

0.010/0.015 (0.25/0.38)

0.397/0.407

(10.07/10.33)

0.205/0.212 (5.20/5.38)

0.0256 BSC (0.65 BSC)

0.301/0.311 (7.65/7.90)

0.022/0.037 (0.55/0.95)

0°/8°

(0°/8°)

Page 14

D1 = 0.005" min.

(0.127 min.)

e = 0.100 BSC

(2.540 BSC)

ALTERNATE

END PINS

(BOTH ENDS)

PACKAGE: PLASTIC

DUAL–IN–LINE (NARROW)

A1 = 0.015" min.

(0.381min.)

A = 0.210" max.

(5.334 max).

eA = 0.300 BSC

(7.620 BSC)

DIMENSIONS (Inches)

Minimum/Maximum

(mm) A2

16–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.780/0.800

(19.812/20.320)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

18–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.880/0.920

(22.352/23.368)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

20–PIN

0.115/0.195

(2.921/4.953)

0.014/0.022

(0.356/0.559)

0.045/0.070

(1.143/1.778)

0.008/0.014

(0.203/0.356)

0.980/1.060

(24.892/26.924)

0.300/0.325

(7.620/8.255)

0.240/0.280

(6.096/7.112)

0.115/0.150

(2.921/3.810)

0°/ 15°

(0°/15°)

Page 15

Model .......................................................................................Temperature Range................................................................................ Package

ORDERING INFORMATION

SP202ECN ..................................................................................... 0°C to +70°C ........................................................................... 16–pin N–SOIC

SP202ECP ..................................................................................... 0°C to +70°C ....................................................................... 16–pin Plastic DIP

SP202ECT ..................................................................................... 0°C to +70°C ................................................................................ 16–pin SOIC

SP202EEN ................................................................................... –40°C to +85°C .......................................................................... 16–pin N-SOIC

SP202EEP ................................................................................... –40°C to +85°C ..................................................................... 16–pin Plastic DIP

SP202EET ................................................................................... –40°C to +85°C .............................................................................. 16–pin SOIC

SP232ECN ..................................................................................... 0°C to +70°C ........................................................................... 16–pin N–SOIC

SP232ECP ..................................................................................... 0°C to +70°C ....................................................................... 16–pin Plastic DIP

SP232ECT ..................................................................................... 0°C to +70°C ................................................................................ 16–pin SOIC

SP232EEN ................................................................................... –40°C to +85°C .......................................................................... 16–pin N-SOIC

SP232EEP ................................................................................... –40°C to +85°C ..................................................................... 16–pin Plastic DIP

SP232EET ................................................................................... –40°C to +85°C .............................................................................. 16–pin SOIC

SP233ECP ..................................................................................... 0°C to +70°C ....................................................................... 20–pin Plastic DIP

SP233ECT ..................................................................................... 0°C to +70°C ................................................................................ 20–pin SOIC

SP233EEP ................................................................................... –40°C to +85°C ..................................................................... 20–pin Plastic DIP

SP233EET ................................................................................... –40°C to +85°C .............................................................................. 20–pin SOIC

SP310ECP ..................................................................................... 0°C to +70°C ....................................................................... 18–pin Plastic DIP

SP310ECT ..................................................................................... 0°C to +70°C ................................................................................ 18–pin SOIC

SP310ECA ..................................................................................... 0°C to +70°C ............................................................................... 20–pin SSOP

SP310EEP ................................................................................... –40°C to +85°C ..................................................................... 18–pin Plastic DIP

SP310EET ................................................................................... –40°C to +85°C .............................................................................. 18–pin SOIC

SP310EEA ................................................................................... –40°C to +85°C ............................................................................. 20–pin SSOP

SP312ECP ..................................................................................... 0°C to +70°C ....................................................................... 18–pin Plastic DIP

SP312ECT ..................................................................................... 0°C to +70°C ................................................................................ 18–pin SOIC

SP312ECA ..................................................................................... 0°C to +70°C ............................................................................... 20–pin SSOP

SP312EEP ................................................................................... –40°C to +85°C ..................................................................... 18–pin Plastic DIP

SP312EET ................................................................................... –40°C to +85°C .............................................................................. 18–pin SOIC

SP312EEA ................................................................................... –40°C to +85°C ............................................................................. 20–pin SSOP

Please consult the factory for pricing and availability on a Tape-On-Reel option.

Corporation

SIGNAL PROCESSING EXCELLENCE

Sipex Corporation Headquarters and

Sales Office

22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com

Sales Office

233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600

Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.

Datasheet SP202ECN, SP202ECP, SP202ECT, SP202EEN, SP202EEP Datasheet (Sipex Corporation)

Specifications and Main Features

Frequently Asked Questions

User Manual