Datasheet SP1005 Datasheet (Littelfuse)

TVS Diode Arrays (SPA

RoHS

GREEN

®

Diodes)

General Purpose ESD Protection - SP1005 Series

SP1005 Series 30pF 30kV Bidirectional Discrete TVS

Description

The SP1005 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level speciﬁed in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back conﬁguration provides symmetrical ESD protection for data lines when AC signals are present.

Pinout

0201 Flipchip

12

SOD882

Features

• ESD, IEC61000-4-2,

±30kV contact, ±30kV air

• EFT, IEC61000-4-4, 40A

(5/50ns)

• Lightning, IEC61000-4-5,

10A (t

=8/20μs)

P

• Low capacitance of 30pF

(@ V

=0V)

R

Pb

• Low leakage current of

0.1μA at 5V

• Space efcient 0201 and

0402 footprint

• AEC-Q101 qualied

(SOD882 package)

1

(AEC-Q101 qualiﬁed)

Functional Block Diagram

1

Additional Information

Datasheet

Resources

Applications

2

• Mobile Phones

• Smart Phones

• Camcorders

• Portable Medical

• Digital Cameras

• MP3/PMP

• Portable Navigation

Devices

• Tablets

• Point of Sale Terminals

Application Example

I/O Controller

ICP3

2

Samples

Outside

World

Keypads

P1 P2

P4

SP1005 (x4)

GND

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

TVS Diode Arrays (SPA

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

40.0

0.0 0.5 1.01.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Bias Voltage (V)

Capacitance (pF)

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

110%

0.0 5.0 10.0 15.0 20.0 25.0 30.0

Time (μs)

Percent of I

PP

®

Diodes)

General Purpose ESD Protection - SP1005 Series

Absolute Maximum Ratings

Symbol Parameter Value Units

1

I

PP

T

OP

T

STOR

Notes:

1. “1 “ indicates SP1005-01WTG , while “2” indicates SP1005-01ETG

2. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

Peak Current (tp=8/20μs)

Operating Temperature –40 to 125 °C

Storage Temperature –55 to 150 °C

Thermal Information

Parameter Rating Units

Storage Temperature Range –55 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature (Soldering 20-40s) 260 °C

10.0

8.0

2

A

Electrical Characteristics (T

OP

=25ºC)

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Standoff Voltage V

Breakdown Voltage V

Leakage Current I

Clamp Voltage

1

Dynamic Resistance R

ESD Withstand Voltage

Diode Capacitance

Note:

1

Parameter is guaranteed by design and/or device characterization.

1

V

RWM

BR

LEAK

V

DYN

ESD

C

IEC61000-4-2 (Contact Discharge) ±30 kV

IEC61000-4-2 (Air Discharge) ±30 kV

D

6.0 V

IR=1mA 8.5 9.5 V

VR=5V with 1 pin at GND 0.1 0.5 μA

IPP=1A, tp=8/20µs, Fwd 9.3 V

I

=2A, tp=8/20µs, Fwd 10.0 V

PP

I

=10A, tP=8/20μs, Fwd 15.6 V

PP

(VC2 - VC1) / (I

- I

) 0.7 Ω

PP2

PP1

Reverse Bias=0V 30 pF

Reverse Bias=2.5V 23 pF

Pulse WaveformCapacitance vs. Reverse Bias

Speciﬁcations are subject to change without notice.

Revised: 11/22/13

TVS Diode Arrays (SPA

0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

1.0 2.0 3.0 4.0 5.0 6.0 7. 0 8.0 9.0 10.0

Peak Pulse Current-I

PP

(A)

Clamp Voltage (V

C

)

-35

-30

-25

-20

-15

-10

-5

0

5

110100 1000 10000

Frequency (MHz)

Attenuation (dB)

t

R

o

C

e

T

®

Diodes)

General Purpose ESD Protection - SP1005 Series

Clamping Voltage vs. I

PP

Soldering Parameters

Reﬂow Condition Pb – Free assembly

- Temperature Min (T

Pre Heat

- Temperature Max (T

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus) Temp (T

) to peak

L

to TL - Ramp-up Rate 3°C/second max

T

S(max)

Reﬂow

- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260

Time within 5°C of actual peak Temperature (t

)

p

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

Do not exceed 260°C

) 150°C

s(min)

) 200°C

s(max)

3°C/second max

+0/-5

°C

20 – 40 seconds

) 8 minutes Max.

P

Insertion Loss (S21) I/O to GND

T

P

Ramp-up

t

amp-up

PreheatPrehea

S

T

L

T

S(max)

Temperature

T

S(min)

25

time to peak temperature

t

P

t

L

Critical Zone

ritical Zon

T

L to TP

to

Ramp-down

amp-d

Time

Product Characteristics of SOD-882 Package

Lead Plating Pre-Plated Frame

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ﬁnish VDI 11-13.

TVS Diode Arrays (SPA

A

B

D

E

D

F

C

G

Recommended Soldering Pad Layout

®

Diodes)

General Purpose ESD Protection - SP1005 Series

Part Marking System

SP1005-01WTG

SP1005-01ETG

Package Dimensions — 0201 Flipchip

Part Numbering System

1005 01

SP

TVS Diode Arrays

®

(SPA

Diodes)

a

Series Number of

Channels

T

G

G= Green

T= Tape & Reel

Package

W: 0201 Flipchip E: SOD882

x

–

Ordering Information

Part Number Package Marking Min. Order Qty.

SP1005-01WTG 0201 Flipchip • 10,000

SP1005-01ETG SOD882 •a 10,000

0201 Flipchip

Symbol

A 0.595 0.620 0.645 0.0234 0.0244 0.0254

B 0.295 0.320 0.345 0.0116 0.0126 0.0136

C 0.245 0.275 0.305 0.0096 0.0108 0.0120

D 0.145 0.150 0.155 0.0057 0.0059 0.0061

E 0.245 0.250 0.255 0.0096 0.0098 0.010 0

F 0.245 0.250 0.255 0.0096 0.0098 0 . 0100

G 0.005 0. 010 0.015 0.0002 0.0004 0.0006

Millimeters Inches

Min Typ Max Min Typ Max

Package Dimensions — SOD882

Package SOD882

Symbol

JEDEC MO-236

Millimeters Inches

Min Typ Max Min Typ Max

A 0.90 1. 0 0 1. 1 0 0.035 0.039 0.043

B 0.50 0.60 0.70 0.020 0.024 0.028

C 0.40 0.50 0.60 0.016 0.020 0.024

D 0.45 0.018

E 0.20 0.25 0.35 0.008 0.010 0.012

F 0.45 0.50 0.55 0.018 0.020 0.022

Speciﬁcations are subject to change without notice.

Revised: 11/22/13

TVS Diode Arrays (SPA

0.28

0.30

0.75

0.19

Recommended Solder Pad Footprint

A0

K0

B0

T

P0

P1

P2

D

D1

E

F

W

*Sizes in mm

®

Diodes)

General Purpose ESD Protection - SP1005 Series

Embossed Carrier Tape & Reel Speciﬁcation — 0201 Flipchip

Symbol Millimeters

A0 0.41±0.03

B0 0.70±0.03

D ø 1.50 + 0.10

D1 ø 0.20 ± 0.05

E 1.75±0.10

F 3.50±0.05

K0 0.38±0.03

P0 2.00±0.05

P1 2.00±0.05

P2 4.00±0.10

W 8.00 + 0.30 -0.10

T 0.23±0.02

Embossed Carrier Tape & Reel Speciﬁcation — SOD882

Symbol Millimeters

A0 0.70±0.045

B0 1.10±0.045

K0 0.65±0.045

F 3.50±0.05

P1 2.00±0.10

W 8.00 + 0.30 -0.10

TVS Diode Arrays (SPA

®

Diodes)

General Purpose ESD Protection - SP1005 Series

Speciﬁcations are subject to change without notice.

Revised: 11/22/13