Datasheet SP03-3.3 Datasheet (Littelfuse)

TVS Diode Arrays (SPA

SOIC-8 (Top View)

)

®

Diodes)

Lightning Surge Protection - SP03-3.3 Series

SP03-3.3 Series 3.3V 150A Diode Array

Agency Approvals - Pending

Agency Agency File Number

E128662

Pinout

1

2

3

Functional Block Diagram

8

7

6

54

RoHS

Pb

GREEN

Description

This new broadband protection device from Littelfuse
provides overvoltage protection for applications such
as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces,
ADSL2+, and VDSL2+. This new protector combines the
TVS diode element with a diode rectifier bridge to provide
both longitudinal and differential protection in one package.
This design innovation results in a capacitive loading
characteristic that is log-linear with respect to the signal
voltage across the device. This reduces intermodulation
(IM) distortion caused by a typical solid-state protection
solution. The application schematic provides the
connection information.

Features

• RoHS compliant

• SOIC-8 surface mount
package (JEDEC MS-012)

• Low insertion loss, log­linear capacitance

• Combined longitudinal

• Clamping speed of
nanoseconds

• UL 94V-0 epoxy molding

• Pending UL recognized
component

• Low clamping voltage

and metallic protection

• Lightning Protection,
IEC61000-4-5, 100A
(8/20µs)

Applications

• T1/E1 Line cards

• T3/E3 and DS3 Interfaces

• 10/100/1000 BaseT
Ethernet

• STS-1 Interfaces

SP03-3.3

Line in

Pin 2, 3, 6,
and 7

Line in

Pin 1 and 8

Pin 4 and 5

Line out

Line out

Additional Information

Datasheet

Life Support Note:

Not Intended for Use in Life Support or Life Saving Applications

The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13

Resources

Samples

Application Example

TeleLink (0461 1.25) SP03-3.3

TIP

RING

1

2

3

4

8

7

to chipset
(Ethernet PHY,
T3/E3 PHY, etc.

6

5

This schematic shows a high-speed data interface
protection solution. The SP03-3.3 provides both metallic
(differential) and longitudinal (common mode) protection
from lightning induced surge events. Its surge rating is
compatible with the intra-building surge requirements
of Telcordia’s GR-1089-CORE, and the Basic Level
Recommendations of ITU K.20 and .21. This device
protects against both positive and negative induced surge
events. The TeleLink fuse provides overcurrent protection
for the long term 50/60 Hz power fault events.

TVS Diode Arrays (SPA

®

Diodes)

Lightning Surge Protection - SP03-3.3 Series

Absolute Maximum Ratings

Parameter Rating Units

Peak Pulse Current (8/20µs) 150 A

Peak Pulse Power (8/20µs) 3300 W

IEC 61000-4-2, Direct Discharge, (Level 4) 30 kV

IEC 61000-4-2, Air Discharge, (Level 4) 30 kV

IEC 61000-4-5 (8/20µs) 100 A

Telcordia GR 1089 (Intra-Building) (2/10µs) 100 A

ITU K.20 (5/310µs) 40 A

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.

Electrical Characteristics (TOP = 25°C)

Parameter Symbol Test Conditions Min Typ Max Units

Reverse Stand-Off Voltage V

Reverse Breakdown Voltage V

Reverse Breakdown Voltage V

Reverse Leakage Current I

Clamping Voltage, Line-Ground V

Clamping Voltage, Line-Ground V

Clamping Voltage, Line-Line V

Clamping Voltage, Line-Line V

Junction Capacitance C

RWM

BR

BR

R

IT= 2µA 3.3 - - V

IT= 50µA 3.3 - - V

V

= 3.3V, T= 25°C - - 1 µA

RWM

C

C

C

C

IPP= 50A, tp=8/20 µs - - 11. 5 V

IPP= 100A, tp=8/20 µs - - 15 V

IPP= 50A, tp=8/20 µs - - 13.5 V

IPP= 100A, tp=8/20 µs - - 18 V

Between I/O Pins and Ground

VR=0V, f= 1MHz

j

Between I/O Pins

=0V, f= 1MHz

V

R

Thermal Information

Parameter Rating Units

SOIC Package 170 °C/W

Operating Temperature Range –40 to 125 °C

Storage Temperature Range –55 to 150 °C

Maximum Junction Temperature 150 °C

Maximum Lead Temperature (Soldering
20-40s) (SOIC - Lead Tips Only)

- - - 3.3 V

- 16 25 pF

- 8 12 pF

260 °C

Figure 1: Non-repetitive Peak Pulse Current vs. Pulse Time

1000

100

10

Peak Pulse Current (A)

1

110100 1000

Pulse decay time (µs)

Figure 2: Current Derating Curve

120

)

P

100

80

60

40

20

Percentage of Rated Current (%I

0

020406080100 120140 160

Ambient Temperature (C)

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 04/24/13

TVS Diode Arrays (SPA

Line

t

R

R

o

C

e

T

T

®

Diodes)

Lightning Surge Protection - SP03-3.3 Series

Figure 3: Pulse Waveform

100

80

(%)

PP

60

40

Percentage of I

20

0

0510 15 20 25 30 35 40

Time, µs

Figure 5: Capacitance vs. Reverse Voltage

20

18

16

14

12

10

8

Capacitance (pF)

6

4

2

0

00.5 11.5 22.5 3

Line to Ground

Line to Line

Reve rse Voltage (V)

Figure 4: Clamping Voltage vs. Peak Pulse Current

20

18

16

14

12

10

8

6

Clamping Voltage (V)

C

V

4

2

0

0102030405060708090100

to Line

Line to Ground

IP Peak Impulse Current (A)

Figure 6: Forward Voltage vs. Forward Current

7

6

5

4

3

2

Forward Voltage (V)

1

0

0102030405060708090 100

Ground-to-Line

Forward Current (A)

Soldering Parameters

Reflow Condition Pb – Free assembly

T

P

- Temperature Min (T

Pre Heat

- Temperature Max (T

- Time (min to max) (ts) 60 – 180 secs

Average ramp up rate (Liquidus) Temp
(T

) to peak

L

to TL - Ramp-up Rate 3°C/second max

T

S(max)

Reflow

- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 150 seconds

Peak Temperature (TP) 260

Time within 5°C of actual peak
Temperature (t

)

p

) 150°C

s(min)

) 200°C

s(max)

3°C/second max

+0/-5

°C

20 – 40 seconds

Ramp-up

t

amp-up

PreheatPrehea

S

T

L

T

S(max)

Temperature

T

S(min)

25

time to peak temperature

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

P

Do not exceed 260°C

© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13

t

P

t

L

Critical Zone

ritical Zon

L to TP

to

T

Ramp-down

amp-d

Time

TVS Diode Arrays (SPA

SP

03

3.3

B T

G

®

Diodes)

Lightning Surge Protection - SP03-3.3 Series

Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline

Package SOIC-8

Pins 8

JEDEC MS-012

Millimetres Inches

L

o

F

Recommended

Soldering Pad Outline

(Reference Only)

A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0. 010
A2 1.25 1.65 0.050 0.065

B 0.31 0.51 0.012 0.020

c 0.17 0.25 0.007 0 .010
D 4.80 5.00 0.189 0.197

E 5.80

E1 3.80 4.00 0.150 0.157

e 1.27 BSC 0.050 BSC

L 0.40

Min Max Min Max

6.20

1.27

0.228

0.016

0.244

0.050

Embossed Carrier Tape & Reel Specification — SOIC Package

Part Numbering System

–

TVS Diode Arrays

®

(SPA

Diodes)

Series
Working

Voltage

G= Green

T= Tape & Reel

Package

B = SOIC

Part Marking System

F

SP03-3.3

L

XXXXXXXX

First Line: Part number
Second Line: Date code

Ordering Information

Part Number Package Marking Min. Order Qty.

SP03-3.3BTG SOIC Tape & Reel SP03-3.3 2500

Millimetres Inches

Min Max Min Max

E 1.65 1.85 0.065 0.073
F 5.4 5.6 0.213 0.22

P2 1.95 2.05 0.077 0.081

D 1. 5 1. 6 0.059 0.063
D1 1.50 Min 0.059 Min
P0 3.9 4.1 0.154 0.161

10P0 40.0 ± 0.20 1.574 ± 0.008

W 11. 9 12.1 0.468 0.476

P 7. 9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087

t 0.30 ± 0.05 0.012 ± 0.002

Product Characteristics

Lead Plating Matte Tin

Lead Material Copper Alloy

Lead Coplanarity 0.004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte finish VDI 11-13.

Specifications are subject to change without notice.

© 2013 Littelfuse, Inc.

Revised: 04/24/13