Package Options Include Plastic
Small-Outline Package (DW), Plastic
J-Leaded Chip Carriers (FN), and Standard
Plastic 300-mil DIPs (N)
description
DW OR N PACKAGE
(TOP VIEW)
1
NC
IR
SI
D0
D1
D2
D3
GND
16
2
15
3
14
4
13
5
12
6
11
7
10
8
V
CC
SO
OR
Q0
Q1
Q2
Q3
RST
9
The SN74ALS236 is a 256-bit memory utilizing
advanced low-power Schottky IMPACT
technology. It features high speed with fast
FN PACKAGE
(TOP VIEW)
fall-through times and is organized as 64 words by
4 bits.
A first-in, first-out (FIFO) memory is a storage
device that allows data to be written into and read
from its array at independent data rates. The
SN74ALS236 is designed to process data at rates
up to 30 MHz in a bit-parallel format, word by
word.
SI
D0
NC
D1
D2
IR
3 2 1 20 19
4
5
6
7
8
910111213
NC
NC
V
CC
SO
18
17
16
15
14
OR
Q0
NC
Q1
Q2
Data is written into memory on the rising edge of
the shift-in (SI) input. When SI goes low, the first
data word ripples through to the output (see
Figure 1). As the FIFO fills up, the data words
NC – No internal connection
D3
GND
NC
RST
Q3
stack up in the order they were written. When the
FIFO is full, additional shift-in pulses have no
effect. Data is shifted out of memory on the falling
edge of the shift-out (SO) input (see Figure 2). When the FIFO is empty , additional SO pulses have no ef fect.
The last data word remains at the outputs until a new word falls through or reset (RST
) goes low.
Status of the SN74ALS236 FIFO memory is monitored by the output-ready (OR) and input-ready (IR) flags.
When OR is high, valid data is available at the outputs. OR is low when SO is high and stays low when the FIFO
is empty . IR is high when the inputs are ready to receive more data. IR is low when SI is high and stays low when
the FIFO is full.
When the FIFO is empty, input data is shifted to the output automatically when SI goes low. If SO is held high
during this time, the OR flag pulses high, indicating valid data at the outputs (see Figure 3).
When the FIFO is full, data is shifted in automatically by holding SI high and taking SO low. One propagation
delay after SO goes low, IR goes high. If SI is still high when IR goes high, data at the inputs is automatically
shifted in. Since IR is normally low when the FIFO is full and SI is high, only a high-level pulse is seen on the
IR output (see Figure 4).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
IMPACT is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
The FIFO must be reset after power up with a low-level pulse on the master reset (RST) input. This sets IR high
and OR low, signifying that the FIFO is empty. Resetting the FIFO sets the outputs to a low logic level (see
Figure 1). If SI is high when RST
SI goes low. If SI goes low before RST
are noninverting with respect to the data inputs.
The SN74ALS236 is characterized for operation from 0°C to 70°C.
goes high, the input data is shifted in and IR goes low and remains low until
goes high, the input data is not shifted in and IR goes high. Data outputs
logic symbol
†
This symbol is in accordance with ANSI/IEEE Standard 91-1984 and IEC Publication 617-12.
The last data word shifted out of the FIFO remains at the output until a new word falls through or an RST pulse clears the FIFO.
‡
While the output data is considered valid only when the OR flag is high, the stored data remains at the outputs. Any additional words written
into the FIFO stack up behind the first word and do not appear at the output until SO is taken low.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
Input voltage range, V
Package thermal impedance, θ
Storage temperature range, T
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 2 ns, tf≤ 2 ns.
D. The outputs are measured one at a time with one transition per measurement.
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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