Bidirectional Quadruple-Bus Transceivers
for Driving MOS Devices
D
I/O Ports Have 25-Ω Series Resistors, So
No External Resistors Are Required
D
Package Options Include Plastic
Small-Outline (DW) Package and Standard
Plastic (N) 300-mil DIPs
description
This octal buffer and line driver/MOS driver is
designed to drive the capacitive inputs of MOS
devices and to improve the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. This device features high fan-out
and improved fan-in.
The SN74ALS2240 is characterized for operation
from 0°C to 70°C.
FUNCTION TABLE
(each buffer)
INPUTS
OEA
LHL
LLH
HXZ
OUTPUT
Y
DW OR N PACKAGE
(TOP VIEW)
1
1OE
2
1A1
3
2Y4
4
1A2
5
2Y3
6
1A3
7
2Y2
8
1A4
9
2Y1
GND
10
20
19
18
17
16
15
14
13
12
11
V
CC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
logic symbol
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
†
1
1OE
2
1A1
4
1A2
6
1A3
8
1A4
19
2OE
11
2A1
13
2A2
15
2A3
17
2A4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EN
EN
18
16
14
12
1Y1
1Y2
1Y3
1Y4
9
2Y1
7
2Y2
5
2Y3
3
2Y4
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1997, Texas Instruments Incorporated
1
Page 2
SN74ALS2240
OCTAL BUFFER AND LINE DRIVER/MOS DRIVER
WITH 3-STATE OUTPUTS
SDAS268A – DECEMBER 1994 – REVISED NOVEMBER 1997
logic diagram (positive logic)
†
1
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2
4
6
8
19
11
13
18
16
14
12
1Y1
1Y2
1Y3
1Y4
9
2Y1
7
2Y2
15
2A3
173
2A4
†
All output resistors are 25 Ω.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51, except for through hole packages, which use a trace length
of zero.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 3
VOLV
V
V
A
Y
ns
SN74ALS2240
OCTAL BUFFER AND LINE DRIVER/MOS DRIVER
WITH 3-STATE OUTPUTS
SDAS268A – DECEMBER 1994 – REVISED NOVEMBER 1997
recommended operating conditions
MINNOMMAXUNIT
V
CC
V
IH
V
IL
T
A
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
†
All typical values are at VCC = 5 V, TA = 25°C.
‡
The output conditions have been chosen to produce a current that closely approximates one-half of the true short-circuit output current, IOS.
For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
FROM
(INPUT)
OE
OE
OE
OE
TO
(OUTPUT)
Y517ns
Y720ns
Y210ns
Y415ns
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX
UNIT
§
MINMAX
210
210
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3
Page 4
SN74ALS2240
OCTAL BUFFER AND LINE DRIVER/MOS DRIVER
WITH 3-STATE OUTPUTS
SDAS268A – DECEMBER 1994 – REVISED NOVEMBER 1997
PARAMETER MEASUREMENT INFORMATION
SERIES 54ALS/74ALS AND 54AS/74AS DEVICES
V
CC
From Output
Under Test
(see Note A)
C
L
Test
Point
R
L
From Output
Under Test
C
(see Note A)
L
R
L
Test
Point
From Output
Under Test
(see Note A)
7 V
RL = R1 = R2
S1
R1
C
L
Test
Point
R2
LOAD CIRCUIT FOR
BI-STATE
TOTEM-POLE OUTPUTS
Timing
Input
t
su
Data
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Output
Control
(low-level
enabling)
Waveform 1
S1 Closed
(see Note B)
Waveform 2
S1 Open
(see Note B)
t
PZL
t
PZH
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
VOLTAGE WAVEFORMS
1.3 V
t
PHZ
1.3 V
1.3 V
t
1.3 V1.3 V
1.3 V1.3 V
FOR OPEN-COLLECTOR OUTPUTS
h
t
PLZ
LOAD CIRCUIT
3.5 V
0.3 V
3.5 V
0.3 V
3.5 V
0.3 V
[
3.5 V
V
OL
0.3 V
V
OH
0.3 V
[
0 V
High-Level
Low-Level
Out-of-Phase
(see Note C)
Pulse
Pulse
Input
In-Phase
Output
Output
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
1.3 V1.3 V
t
w
1.3 V1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.3 V1.3 V
t
PLH
t
PHL
1.3 V1.3 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.3 V1.3 V
t
PHL
t
PLH
3.5 V
0.3 V
3.5 V
0.3 V
3.5 V
0.3 V
V
V
V
V
OH
OL
OH
OL
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. When measuring propagation delay items of 3-state outputs, switch S1 is open.
D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%.
E. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuits and Voltage Waveforms
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 5
IMPORTANT NOTICE
T exas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERT AIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICA TIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERST OOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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